Grain boundaries have been demonstrated as the dominating ion migration channels in polycrystalline organic–inorganic halide perovskite films.

Abstract Lithium‐rich, manganese‐based layered oxides are considered one of the most valuable cathode materials for next generation high‐energy density lithium‐ion batteries (LIBs) their high specific capacity and low cost. However, practical implementation in LIBs is hindered by rapid voltage/capacity decay on cycling long‐standing contradictions between redox kinetics volumetric energy due to poor calendaring compatibility. Herein, a coherent near‐zero‐strain interphase constructed grain...

Wide bandgap (WBG) power devices with voltage ratings exceeding 10 kV have the potential to revolutionize medium- and high-voltage systems due their high-speed switching lower ON-state losses. However, present module packages are limiting performance of these unique switches. The objective this article is push boundaries high-density, high-speed, 10-kV packaging. proposed package addresses well-known electromagnetic thermal challenges, as well more recent prominent electrostatic interference...

A double-sided 1200-V/600-A multichip half-bridge insulated gate bipolar transistor (IGBT) module was fabricated utilizing molybdenum as stress-relief buffer and sintered nanosilver die-attachment. By using the packaging, volume, parasitic inductance, junction temperature were decreased significantly, thus higher power density could be achieved. However, thermomechanical stress also increased. In this paper, instead of most common copper used a between chips substrate, greatly without...

Die attachment by pressureless silver sintering at <; 200 °C is significant for power electronic packaging because it can relieve residual thermo-mechanical stress and avoid chip damage. In this letter, we developed a trimodal-silver paste capable of as low 180 due to the usage trimodal-system 170 removable organics agents. The bondline could be densified neck-formation expected. Thanks high packing density trimodal system, bonding strength 35 MPa was achieved. Moreover, IGBT modules were...

Low-temperature silver (Ag) sintering is emerging as a cutting-edge die-attach technology for power electronics packaging. However, the industry still has concerns about completely accepting this technology. One of reasons lack knowledge mechanism and process sintered bonding on various metallization. Before, we reported preliminary assessment die-shear strength microstructures Si dummy device attached Ag, Au, Cu This research will go deeper into practice science attaching SiC devices with...

Sluggish sulfur reduction reaction (SRR) kinetics remains a formidable challenge in Li–S electrochemistry. In this sense, the rational design of single‐atom species has become burgeoning practice to expedite redox, where underlying catalytic mechanism otherwise elusive. Herein, class metal modified porous carbon nanofiber films (MSA PCNFs, M = Fe, Co, or Ni), fabricated via generic synthetic strategy, as mediators boost SRR is reported. Throughout electrokinetic measurement and operando...

This study aimed to determine the chemical composition of five Lavender essential oils (LEOs) using gas chromatography-mass spectroscopy technique and assess their antibacterial activity against four marine Vibrio species, including Shewanella algae, maridflavi, harveyi, alginolyticus. Sensitivity tests were performed disk diffusion serial dilution methods. The results showed that all LEOs exhibited tested species. activities above moderate sensitivity. from French blue, space eye-catching,...

Mn-Al powders were prepared by rapid solidification followed high-energy mechanical milling. The resulted in single-phase ε. milling was performed both the ε phase and τ phase, with τ-phase formation accomplished through a heat treatment at 500 °C for 10 min. For ε-milled samples, conversion of to after via same treatment. Mechanical induced significant increase coercivity cases, reaching 4.5 kOe 4.1 kOe, respectively, decrease upon further result grain refinement Additionally, cases loss...

Die attach by low-temperature silver sintering has been widely used in power electronics packaging. Most of the reported work was done on direct-bond-copper (DBC) substrates metallized with or gold. There is a lack studies sintered-silver bonding nickel (Ni), low-cost metallization DBC. In this study, we fabricated module using pressureless in-air die Ni-plated DBC substrate. Strong die-shear strength over 40 MPa achieved. It also found static and switching characteristics, transient...

Femtosecond laser surface processing (FLSP) can be used to functionalize many surfaces, imparting specialized properties such as increased broadband optical absorption or super-hydrophobicity/-hydrophilicity. In this study, the subsurface microstructure of a series mound-like FLSP structures formed on commercially pure titanium using five combinations fluence and cumulative pulse counts was studied. Using dual beam Scanning Electron Microscope with Focused Ion Beam, for each structure type...

In order to achieve superior interfacial heat dissipation, large-area (&#x2265;400 mm²) sintering of a novel nanosilver paste at ultralow temperature (180 &#x00B0;C) was successfully realized using extra terpineol solvents interfaces by promoting the diffusivity Ag nanoparticles, i.e., NPs, into device metallization as well diffusion channel. Under auxiliary pressure &#x2264; 5 MPa, strong joint can be obtained with shear strength &#x003E; 500 kgf and steady-state thermal...

High temperature application and long-term reliability are the future development trends of IGBT (insulated gate bipolar transistor) module. This article proposes a 1200-V/50-A module using current-assisted sintered nanosilver as die attachment high-temperature solder substrate attachment. We measured compared electrical thermal characteristics, proposed modules with those commercial same level. The show consistency in performance, which also proved feasibility sintering. impedance decreased...

Femtosecond laser surface processing (FLSP) is an emerging technique for creating functionalized surfaces with specialized properties, such as broadband optical absorption or superhydrophobicity/superhydrophilicity. It has been demonstrated in the past that FLSP can be used to form two distinct classes of mound-like, self-organized micro/nanostructures on various metals. Here, formation mechanisms below growth (BSG) and above (ASG) mounds polycrystalline Ni60Nb40 are studied. Cross-sectional...

A planar phase-leg 650-V/240-A insulated-gate bipolar transistor (IGBT) module with 16 IGBT chips and free-wheeling diodes has been demonstrated by pressureless sintering nanosilver paste to achieve extremely high power density low parasitic inductance. Nanosilver was chosen as the die-attach material increase operation temperature well heat dissipation. The thermal coupling effect of so many in parallel performance have discussed. electrical also characterized verify feasibility packaging...

Ankang Kan1,,#, Zhaofeng Chen2, #, Meiyu Wang1, Zhang Jinsheng1, Rujun Ma3, Kecheng Lou1 1Merchant Marine College, Shanghai Maritime University, 201306, P. R. China 2College of Material Science and Technology, Nanjing University Aeronautics Astronautics, 211106, 3Suzhou Junyue New Technology Co., Ltd, Suzhou 215164,

An inertially stabilized platform (ISP) is a gimbal used to hold camera. It essential for isolating the attitude sway during an imaging process. To make more compact, implementation of ISP with spherical mechanism has been proposed. However, this design introduces complex non-linear coupling characteristics, significantly increasing complexity control. This study aims solve problem and present algorithm achieve high-performance inertial stabilization this, kinematic dynamic models were...

Recently, silver paste, epoxy, and solders were commonly used as die-attach materials for power electronic packaging. Thermal performance of these should be paid attention to since reliability sintered or soldered jointsis highly dependent on the thermal performance. To accurately investigate transient behavior joints in applications, an improved way system impedance measurement developed this paper. A series measurements utilized gate-emitter voltage temperature-sensitive parameter at...