A5046995692- Heat Transfer and Optimization
- Heat Transfer Mechanisms
- Heat Transfer and Boiling Studies
- Solar Thermal and Photovoltaic Systems
Tsinghua University
2022-2023
Driven by the demands of intelligent industry, integrated circuit chip has witnessed development in direction use increased number transistors and larger area. Consequently, power dissipation is increasingly limiting performance. In this study, an embedded microfluidic cooling solution for a 20 mm×20 mm high-power was realized. The microchannels double H type manifold channels were etched on two silicon wafers, thereafter assembled employing silicon-silicon direct bonding process. depth all...
Embedded microfluidic cooling improves efficiency by avoiding interfacial thermal resistance. However, the temperature rise of fluid along flow direction leads to an uneven axial straight parallel microchannels (SPMCs), which then causes degradation uniformity, especially at outlet position with greatest Counterflow (CFMCs) heat exchangers can be realized adjusting adjacent channels opposite direction. In this paper, a one-dimensional resistance model CFMCs is established, and surface...