A5100329028- Supercapacitor Materials and Fabrication
- Advanced Sensor and Energy Harvesting Materials
- Magnetic Field Sensors Techniques
- CCD and CMOS Imaging Sensors
- Analog and Mixed-Signal Circuit Design
- Advanced DC-DC Converters
- Sensor Technology and Measurement Systems
- ZnO doping and properties
- Acoustic Wave Resonator Technologies
- Electric Motor Design and Analysis
- 3D IC and TSV technologies
- Induction Heating and Inverter Technology
- Conducting polymers and applications
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Neuroscience and Neural Engineering
- Engineering and Technology Innovations
- Silicon Carbide Semiconductor Technologies
- Multiferroics and related materials
University of Pennsylvania
2020-2025
Philadelphia University
2021
Tianjin University of Technology
2019
Tsinghua University
2012
Low noise sensors with low power consumption are needed for sensing the biomagnetic potentials produced by human body. Compared to their electrical counterparts, noninvasive and noncontact. A strain-modulated FeCo-Hf/AlScN-based sensor a bandwidth of 3.4 kHz magnetic spectral density at 1 59.5 pT/ <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\surd $ </tex-math></inline-formula> Hz before demodulation...
This paper presents a 12-bit 270MS/s pipelined analog-to-digital converter (ADC) without employing front-end sample-and-hold amplifier. A novel strategy is established to diminish the aperture error while maintaining both original tracking time and amplifying of multiplying digital-to-analog (MDAC). It matches signal paths between comparators MDAC in first stage by using proper timing sequence high-speed dynamic comparators. The measurement results show 63.7dB SNR 76.1dBc SFDR at 120.1MHz...
MEMS-enabled multilayer composites, in which microfabrication is used to create micron-scale thickness layers within the volume of meso-scale structures, can be exploited materials with highly anisotropic electromagnetic properties. Such have utility both sensing and energy applications, including electrostatic magnetic storage conversion. A fabrication challenge realizing these classes lies size-scale disparity between an individual layer desired final material. We demonstrate a fully...
A printed circuit board (PCB) integrated inductor with an additively electrodeposited polypyrrole-laminated nickel-iron (NiFe) core is presented for MHz dc–dc power conversion. The PCB-integrated has a racetrack-shaped winding, which formed using standard PCB manufacturing process. Subsequently, multilayers of NiFe and polypyrrole are to wrap laminated around the racetrack winding. 515 nH fabricated. fabricated shows dc resistance 290 mΩ peak quality factor 9.6 at 2.1 MHz. tested in 4 buck...
Metallic magnetic alloys are of interest as core materials in ultracompact or integrated inductors and transformers. However, when operated at high frequencies, such should comprise a multilayer stack material laminations electrically insulating interlayers to suppress eddy current loss. To achieve scalable continuous fabrication structure, sequential electrodeposition is an attractive approach. electrodeposition, interlayer's electrical conductivity be sufficiently permit subsequent layers,...
This Letter presents a wide supply voltage range, ultra‐low power, and CMOS‐only subthreshold reference. A complementary‐to‐absolute‐temperature ( ) generator implemented by standard transistor high is used to obtain negative temperature coefficient (TC) voltage. While, proportional‐to‐absolute‐temperature adopts unbalanced differential pair achieve positive TC With both generator, the reference circuit proposed, which in CMOS process. The simulation results show that mean output 225.5 mV at...
We present a vacuum packaging process based on standard fused silica wafer bonding combined with laser-assisted simultaneous localized fusion and dicing technology. Direct of stacks results in an optically transparent package without introducing intermediate layers. The temperature inside the is maintained lower than 400 °C during fabrication to preserve CMOS compatibility. To characterize level package, white light interferometery introduced observe surface topography package. Simulation...
We fabricated one-turn-like wire inductor via electrodepositing magnetic core materials, NiFe, on the surface of cylindrical copper wires. The current was applied to flow through a which generated circumferential flux around wire. Control thickness and lengths showed tunability inductance values. Compared an air-core (no wire), 50 μm thick NiFe electroplated had 144 times higher also achieved sequential electroplating interlamination layer, polypyrrole, surfaces. Laminated cores retention...