One of the biggest challenges in microscale additive manufacturing is production three-dimensional, metal parts with a high enough throughput to be relevant for commercial applications. This paper presents new process called selective laser sintering (μ-SLS) that can produce true 3D sub-5 μm resolution and greater than 60 mm3/hour. In μ-SLS, layer nanoparticle ink first coated onto substrate using slot die coating system. The then dried uniform layer. Next, precisely positioned under an...

A high electrical and thermal conductivity coupled with low costs make copper (Cu) an enticing alternative to aluminum for the fabrication of interconnects in packaging applications. To tap into benefits ever-reducing size transistors, it is required increase input/output pin count on electronic chips, thus, minimize chip board interconnects. Laser sintering Cu nanoparticle (NP) inks can serve as a promising process developing these micron sized, 3D interconnect structures. However, exact...

- This paper presents the optics design for a microscale Selective Laser Sintering (μ-SLS) system that aims to allow large areas of nanoparticles be sintered simultaneously while still maintaining micrometer scale feature resolutions in order improve throughput additive manufacturing process. The is shown able sinter 2.3 mm by 1.3 area metal have been spread into ~400 nm thick layer with resolution ~3 μm single shot. optical this ~1.2 indicating only about 2-3 pixels are needed form good...

The ability to create 3D ICs can significantly increase transistor packing density, reduce chip area and power dissipation leading possibilities of large-scale on-chip integration different systems. A promising process for this application is the microscale additive manufacturing (AM) interconnect structures capability writing metal with feature sizes approximately 1 μm on a variety substrates. Current AM techniques are limited in their capabilities produce conductive structures. This paper...

One of the limitations commercially available metal additive manufacturing (AM) processes is minimum feature size most can achieve. A proposed solution to bridge this gap microscale selective laser sintering (μ-SLS). The advent process creates a need for models which are able predict structural properties sintered parts. While there currently number good SLS models, majority these as melting accurate microparticles. However, when particles tend nanoscale, becomes diffusion dominated by grain...

One of the limitations commercially available metal Additive Manufacturing (AM) processes is minimum feature size most can achieve. A proposed solution to bridge this gap microscale selective laser sintering (μ-SLS). The advent process creates a need for models which are able predict structural properties sintered parts. While there currently number good SLS models, majority these as melting process, accurate microparticles. However, when particles tend nanoscale, becomes diffusion dominated...

Abstract Additive Manufacturing (AM) technologies are often restricted by the minimum feature size of parts they can repeatably build. The microscale selective laser sintering (μ-SLS) process, which is capable producing single micron resolution parts, addresses this issue directly. However, unwanted dissipation heat within powder bed a μ-SLS device during primary source error that limits producible parts. A particle scale thermal model needed to characterize properties nanoparticles...

Abstract Current additive manufacturing (AM) technologies are typically limited by the minimum feature sizes of parts they can produce. This issue is addressed microscale selective laser sintering system (μ-SLS), which capable building with single micrometer resolutions. Despite resolution system, producible using μ-SLS tool unwanted heat dissipation through particle bed during process. To address this flow, a scale thermal model needed to characterize conductivity nanoparticle and...

Abstract One of the main challenges facing expansion Additive Manufacturing (AM) is minimum feature sizes which these processes are able to achieve. Microscale Selective Laser Sintering (μ-SLS) a novel process created meet this limitation by precisely laser sintering nanoparticles give better control over sizes. With development new process, there concurrent need for models, can predict material properties nanoparticles. To end, paper presents simulation electrical resistivity sintered...

Abstract Microscale Selective Laser Sintering is an Additive Manufacturing process which involves the creation of parts using nanoparticles, precision substrate motion control, and optical setup aimed at achieving sub-micron resolution on printed parts. In order to drive towards this proposed goal, it important understand kinetics nanoparticle sintering be able make predictions properties that can expected from manufacturing process. To end, Phase Field Modelling simulations have been built...

Abstract Nanoparticles are being used in Additive Manufacturing to improve on the minimum feature sizes that processes able achieve. In order accurately control this process, it is important understand underlying characteristics define sintering of nanoparticles. This done by modelling process. A nanoparticle simulation has been introduced model between nanoparticles a powder bed. These simulations make use Phase Field Modelling track diffusion particles system. However, current state only...