Thomas H. Lee

ORCID: 0000-0003-0635-2990
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About
Contact & Profiles
Research Areas
  • Radio Frequency Integrated Circuit Design
  • Advancements in PLL and VCO Technologies
  • Microwave Engineering and Waveguides
  • Semiconductor Lasers and Optical Devices
  • Semiconductor materials and devices
  • Photonic and Optical Devices
  • International Law and Aviation
  • International Law and Human Rights
  • Analog and Mixed-Signal Circuit Design
  • Advancements in Semiconductor Devices and Circuit Design
  • Advanced Memory and Neural Computing
  • Superconducting and THz Device Technology
  • 3D IC and TSV technologies
  • Low-power high-performance VLSI design
  • Analytical Chemistry and Sensors
  • Energy Harvesting in Wireless Networks
  • Semiconductor Quantum Structures and Devices
  • Electrostatic Discharge in Electronics
  • Terahertz technology and applications
  • Interprofessional Education and Collaboration
  • Advanced Fiber Laser Technologies
  • Experimental Learning in Engineering
  • Antenna Design and Analysis
  • Mechanical and Optical Resonators
  • Wireless Power Transfer Systems

Community Catalyst
2024-2025

Press Ganey
2019-2025

Stanford University
2013-2024

Health Affairs
2024

Advisory Board Company (United States)
2024

Fordham University
2005-2022

Palo Alto University
2003-2021

Chicago Kent College of Law
2021

Illinois College
2021

Harvard University
2019-2020

A general circuit model is derived for the electrical noise of electrode–electrolyte systems, with emphasis on its implications electrochemical sensors. The power spectral densities associated all sources introduced in are also analytically calculated. Current and voltage fluctuations typical systems demonstrated to originate from either thermal equilibrium created by conductors, or nonequilibrium excess caused charge transfer processes produced interactions. density predicted using...

10.1063/1.1755429 article EN Journal of Applied Physics 2004-06-23

Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number vertical interconnects. Through Silicon Vias (TSVs) provide promising area- and power-efficient way support communication between different layers. Unfortunately, low TSV yield significantly impacts design three-dimensional stacks TSVs. This paper presents defect-tolerance technique for TSVs-based multi-bit links through an efficient effective use redundancy. is...

10.5555/1509456.1509589 article EN International Conference on Computer Aided Design 2008-11-10

Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number vertical interconnects. Through Silicon Vias (TSVs) provide promising area- and power-efficient way support communication between different layers. Unfortunately, low TSV yield significantly impacts design three-dimensional stacks TSVs. This paper presents defect-tolerance technique for TSVs-based multi-bit links through an efficient effective use redundancy. is...

10.1109/iccad.2008.4681638 article EN IEEE/ACM International Conference on Computer-Aided Design 2008-11-01

Article Free Access Share on Optimization of inductor circuits via geometric programming Authors: Maria del Mar Hershenson Electrical Engineering Department, Stanford University, Stanford, CA CAView Profile , Sunderarajan S. Mohan Stephen P. Boyd Thomas H. Lee Authors Info & Claims DAC '99: Proceedings the 36th annual ACM/IEEE Design Automation ConferenceJune 1999 Pages 994–998https://doi.org/10.1145/309847.310112Online:01 June 1999Publication History 24citation638DownloadsMetricsTotal...

10.1145/309847.310112 article EN 1999-06-01

Article Free Access Share on GPCAD: a tool for CMOS op-amp synthesis Authors: Maria del Mar Hershenson Electrical Engineering Department, Stanford University, CA CAView Profile , Stephen P. Boyd Thomas H. Lee Authors Info & Claims ICCAD '98: Proceedings of the 1998 IEEE/ACM international conference Computer-aided designNovember Pages 296–303https://doi.org/10.1145/288548.288628Online:01 November 1998Publication History 45citation513DownloadsMetricsTotal Citations45Total Downloads513Last 12...

10.1145/288548.288628 article EN 1998-01-01

We present a method for optimizing and automating component transistor sizing CMOS LC oscillators. observe that the performance measures can be formulated as posynomial functions of design variables. As result, oscillator problems posed geometric program, special type optimization problem which very efficient global methods have recently been developed. The synthesis is therefore fast, determines globally optimal design; in particular final solution completely independent starting point...

10.5555/339492.339574 article EN 1999-11-07

Rapid, sequence-specific DNA detection is essential for applications in medical diagnostics and genetic screening. Electrical biosensors that use immobilized nucleic acids are especially promising these because of their potential miniaturization automation. Current methods based on sequencing by synthesis rely optical readouts; however, a direct electrical method this technique not available. We report here an approach enzymatically catalyzed induced surface charge perturbation. discovered...

10.1073/pnas.0601184103 article EN Proceedings of the National Academy of Sciences 2006-04-14

A low-voltage synchronous buck converter has been designed and fabricated in a 0.5mum CMOS technology. The uses two charge conservation techniques to increase efficiency at light loads while still operating PWM mode switching frequency of 3MHz. These reduce IC power loss from 11.5mW 8.9mW, 22.7% reduction, for l <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">load</sub> = 20mA V xmlns:xlink="http://www.w3.org/1999/xlink">out</sub> 1.8V.

10.1109/isscc.2007.373527 article EN 2007-02-01

Abstract Wireless functionality is essential for the implementation of wearable systems, but its adaptation in stretchable electronic systems has had limited success. In this paper, electromagnetic properties serpentine mesh‐based studied, and general strategy used to produce high‐performance microwave systems. Stretchable mechanics are enabled by converting solid metallic sections conventional subwavelength‐scale meshes, followed bonding an elastomeric substrate. Compared prior...

10.1002/adfm.201703059 article EN Advanced Functional Materials 2017-10-16

This issue of NEJM Catalyst Innovations in Care Delivery includes articles, case studies, and research reports on public health programs, maternal infant care, community partnerships grantmaking, cochlear implantation, hybrid virtual cystic fibrosis climate action at academic systems.

10.1056/cat.25.0008 article EN NEJM Catalyst 2025-01-15

Machine learning and AI have achieved remarkable advancements but at the cost of significant computational resources energy consumption. This has created an urgent need for a novel, energy-efficient fabric to replace current computing pipeline. Recently, promising approach emerged by mimicking spiking neurons in brain leveraging oscillators on CMOS direct computation. In this context, we propose new efficient machine framework implemented Oscillator Networks (OscNet). We model developmental...

10.48550/arxiv.2502.07192 preprint EN arXiv (Cornell University) 2025-02-10

We study the statistical behavior of affinity-based biosensors. The detection uncertainty and noise in such devices originates primarily from probabilistic molecular-level bindings within sensing regions, stochastic mass-transfer processes reaction chamber. In this paper, we model dynamic these sensory systems by a Markov process, which enables us to estimate sensor inherent power spectral density (PSD) response time. also present methods parameters are extracted kinetic rates, diffusion...

10.1063/1.1861970 article EN Journal of Applied Physics 2005-04-07

The noise characteristics of today’s short-channel devices are shown to have a better resemblance ballistic than long-channel metal oxide semiconductor field effect transistors (MOSFETs). Therefore the these best modeled using ballistic-MOSFET-based model. Extensive hydrodynamic device simulations presented in support this hypothesis and simple compact model is introduced. This used for predicting behavior future nanoscale devices. Most findings work can also be applied carbon nanotubes...

10.1063/1.2740345 article EN Journal of Applied Physics 2007-06-15

A 1.4-GHz LC voltage-controlled oscillator has been implemented in a MOSIS 0.5-µm CMOS process. Complementary cross-coupled PMOS and NMOS transistors enhance single-ended symmetry at each of the resonant nodes, reducing close-in phase noise. Tapped bond wires provide tank with high Q. At an offset frequency 100 kHz, measured noise is -107 dBc/Hz 3 mW power dissipation from 3.0 V supply. gate capacitors achieve 17% tuning range.

10.1145/280756.280761 article EN 1998-01-01

We present a high-speed optical switching scheme based on phased array beam steering, and analyze the trade-off between switch power efficiency, signal-to-noise-ratio, number of output channels, speed. For proof concept, two-channel has been fabricated, using GaAs∕AlGaAs multiple quantum well phase modulator. demonstrate deflection angle 100mrad at fastest ever reported speed 18GHz, consuming 1.8mW. A signal-to-noise ratio 8dB is measured each channel. The relatively low can be further...

10.1063/1.2831005 article EN Applied Physics Letters 2008-01-07

Coplanar waveguides were fabricated in a process that emulates silicon CMOS technologies with 5 to 10 metal layers. The observed S21 loss of 0.3dB/mm at 50 GHz is among the lowest ever reported standard Al interconnects on Si/SiO2. Optimum design parameters counter-intuitive: some frequency ranges, was achieved relatively narrow lines over low-resistivity substrate. This exploited transmission are fully compatible technology. emulation calibrated commercial 4-layer Al/Cu

10.1109/arftg.1998.327295 article EN 1998-06-01

In this paper, we propose a quasi-analytical device model of nanowire FET (NWFET) for both ballistic and drift-diffusion current transport, which can be used in any conventional circuit simulator like SPICE. The closed form expressions current-voltage (I-V) capacitance-voltage characteristics are obtained by analytically solving equations with appropriate approximations. developed was further verified the measured I-V an NWFET device. Results show close match data.

10.1109/ted.2007.899397 article EN IEEE Transactions on Electron Devices 2007-06-28

This paper presents an ultra-low resistance, high wiring density, through-wafer via (TWV) technology that is compatible with standard silicon wafer processing. Vias as small 30 µm by are fabricated through a 525 thick wafer. results in aspect ratio for the greater than 17:1. Furthermore, dc resistance of single less 50 mΩ. Key fabrication steps, including dry etch, copper metallization, and photoresist electroplating, described detail. As demonstration potential applications TWV technology,...

10.1143/jjap.38.2393 article EN Japanese Journal of Applied Physics 1999-04-01

Guidelines from the National Cholesterol Education Program (NCEP) recommend reduction of low-density lipoprotein cholesterol (LDL-C) to 100 mg/dL (2.59 mmol/L) or less in patients with established coronary heart disease (CHD). However, Committee for Quality Assurance (NCQA) is implementing a new performance measure as part Health Plan Employer and Data Information Set (HEDIS) that appears endorse different target. The HEDIS will require managed care organizations seeking NCQA accreditation...

10.1001/jama.283.1.94 article EN JAMA 2000-01-05
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