- Advanced Sensor and Energy Harvesting Materials
- Electronic Packaging and Soldering Technologies
- Nanomaterials and Printing Technologies
- Microwave Engineering and Waveguides
- Supercapacitor Materials and Fabrication
- Advancements in Battery Materials
- 3D IC and TSV technologies
- Advanced Materials and Mechanics
- Advancements in Semiconductor Devices and Circuit Design
- Conducting polymers and applications
- Adhesion, Friction, and Surface Interactions
- Radiation Effects in Electronics
- Mechanical stress and fatigue analysis
- Additive Manufacturing and 3D Printing Technologies
- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
- Advanced battery technologies research
- Modular Robots and Swarm Intelligence
- Epoxy Resin Curing Processes
- Radio Frequency Integrated Circuit Design
- Industrial Technology and Control Systems
- Semiconductor Lasers and Optical Devices
- Covalent Organic Framework Applications
- Textile materials and evaluations
- Mechanical Failure Analysis and Simulation
Eastern Michigan University
2024
Zhejiang University-University of Edinburgh Institute
2024
Georgia Institute of Technology
2018-2023
Changchun University
2022
Xinyang Normal University
2022
Hanyang University
2015-2020
Seoul Institute
2020
Fudan University
2020
Beijing University of Technology
2018
China Academy Of Machinery Science & Technology (China)
2014
A 3D network of single-walled carbon nanotubes embedded in poly-(dimethylsiloxane) is presented as a promising route to the fabrication flexible film with ordered and interconnected nanotubes. This possible using simple transfer method as-grown hierarchical on Si pillar substrate. used highly sensitive strain gauge sensor. type polymer should be applicable many fields involving mechanically stable reliable sensors.
Due to the increased popularity of wearable devices, designing flexible hybrid electronics (FHE) is becoming increasingly critical. Some emerging systems that require FHE include wearables, energy-harvesting sensory networks, and electrocardiogram monitors. These designers account for different actions, such as stretching, bending, twisting, etc. Accounting actions requires models components capture behavior under these actions. This work focuses on characterizing effects bending two...
Flexible electronic products are becoming increasingly popular. Because of the large deformation that flexible encounter, it is important to predict their performance in response mechanical loadings. This article focuses on and electrical behavior printed silver conductor under adaptive curvature flexure test. In test, bent between two rigid parallel plates so bending strain will be generated through and, thus, cause resistance change. The was measured continuously by four-wire method during...
Flexible electronic systems are being explored for a variety of applications during which they may be stretched, bent, twisted, and folded number times over different durations, etc. An understanding electrical mechanical behavior flexible under deformation is necessary its design reliability assessment. In this paper, we explore the use an adaptive curvature flexure test to understand strain resistance variation in printed conductors. The free-form substrate subjected radii through moving...
This paper discusses the electrical and mechanical characterization of an inkjet-printed patch antenna under uniaxial biaxial bending. A 30 mm × 40 design with a truncated copper ground plane was designed fabricated by inkjet printing on polyethylene terephthalate (PET) substrate. The samples were then fixtured cylindrical polycarbonate mandrels as well 3D printed saddle-like structures using polylactic acid (PLA). S11 measured in both bent flat configurations, shift resonant frequency...
Glass has been shown to be a capable core substrate material for high frequency applications. In this paper we examine the capabilities of ultra-thin glass as flexible that can used The two stack-ups discussed in are 60 μm total thickness with (Schott AF32) 30 thickness. One stack-up uses 15 JSR GT-N01 buildup dielectric and other Taiyo Photo Imageable Dielectric. Since neither these have previously electrically characterized, characterizes both up 110 GHz using microstrip ring resonators...
Flexible electronics are becoming more and widely used in all fields, such as wearable devices, flexible displays, sensors, so on. Therefore, it is essential to investigate the reliability of under various loading conditions. In this article, mechanical electrical behavior printed conductors was tested reciprocating adaptive curvature flexure bending. The silver-ink different widths were screen-printed on polyimide (PI) polyethylene terephthalate (PET) substrates served samples. Through...
Flexible hybrid electronics (FHE) is a promising technology enabling many applications in biomedical, communication, energy harvesting and internet of things (IoT) areas. To realize FHE applications, the components devices used mentioned technologies need to be electrically characterized under various flexible conditions such as stretching, bending, twisting, folding. Also, strain analysis from mechanical point view needs conducted justify reliable different scenarios. In this paper, design...
With the increased demand in wearable devices, design of Flexible Hybrid Electronics (FHE) is becoming important. Emerging systems requiring FHE include wearables, energy harvesting sensory networks, and ECG monitors to name a few. Designing these requires accounting for different flexible actions such as stretching, bending twisting, etc. which models components that capture behavior under actions. This work focuses on characterizing microstrip transmission lines it relates printed...
Abstract The serpentine shape has been increasingly popular for the conductor design in flexible electronics due to its superior compliance and stretchability performance. of structure is highly dependent on material strain threshold, geometry design, attachment substrate property. Therefore, identifying parameters their corresponding importance factors will help optimize geometry. In current work, a fully automated finite-element model developed calculate normalized maximum free-standing...
Glass has been shown to be a capable core substrate material for high-frequency applications. In this article, we examine the capabilities of ultra-thin glass as that can used flexible The two stack-ups discussed in work presented are 60 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> total thickness with (Schott AF32) 30 thickness. One stack-up uses 15 JSR GT-N01...
The dual-suspended architectures, consisting of CNT networks penetrating through cuprous oxides with (quasi-)octahedron structures, are constructed between Si pillars, which show excellent photocatalytic abilities towards MB dye decomposition.
There has been an explosion in the application of flexible and wearable electronics a wide range fields past few decades. When use, are subjected to variety mechanical loadings, including stretching, bending, twisting. These loadings will introduce damage printed materials eventually result their failure. Therefore, it is beneficial minimize elements by reducing strains without compromising functionality electronics. Serpentine structures have often used mitigate maximum strain during prior...
Serpentine printed conductors have been explored in flexible and stretchable electronics as a way to reduce strains the thus, overall normalized resistance increase under stretching other mechanical loading conditions. In this study, it is shown that substrate stiffness conductor ratio plays an important role effectiveness of serpentine geometry axial stretching. The benefit structure evident when significantly reduced. Also, through experimental measurements increases less for compared...
The interfacial strength of different thin film layers is critical for the reliability electronic devices. With continuing trend decreasing dimensions various features and in microelectronics, limitations methods used to test their mechanical behavior are becoming apparent. Smaller microelectronic device require fabrication attachment smaller fixtures samples apply loads, at such small length scales, appropriately have become difficult. Additionally, testing devices requires similarly small,...
A 3D nanoweb-like zeolite imidazole framework (ZIF-8) as an efficient heterogeneous catalyst was structured inside a microfluidic channel for Knoevenagel condensation reaction by growing the ZIF on carbon nanotube (CNT) networks bridging built-in micropillars.
Thick composites made with traditional impregnation and simultaneous resin infusion from the inside outside were studied to compare two methods for optimizing permeability, dipping time, structural organization. Permeability was greater, time shorter, impregnated more uniformly distributed, blow hole defects fewer when performed simultaneously of braided structure. The flow channel preset in precast body, allowing outside-in inside-out dipping.