Increasing levels of system integration pose difficulties in meeting design specifications for high-performance systems. Oftentimes increased complexity, nonlinearity, and multiple tradeoffs need to be handled simultaneously during the cycle. Since components such systems are highly correlated with each other, codesign co-optimization complete required. Machine learning (ML) provides opportunities analyzing control parameters, where techniques based on Bayesian optimization (BO) can used...

Integrated voltage regulators (IVRs) are considered nowadays as major elements in the development of power delivery networks for digital electronics because their ability to implement point-of-load regulation multicore microprocessors and system-on-chip (SoC) architectures. Inductive generally enable higher efficiency over a wide range conversion voltages. However, high IVRs require integration inductors with low loss reduced size at very frequency. The use magnetic material core can reduce...

Due to the increased popularity of wearable devices, designing flexible hybrid electronics (FHE) is becoming increasingly critical. Some emerging systems that require FHE include wearables, energy-harvesting sensory networks, and electrocardiogram monitors. These designers account for different actions, such as stretching, bending, twisting, etc. Accounting actions requires models components capture behavior under these actions. This work focuses on characterizing effects bending two...

This paper discusses the design, fabrication, and characterization of packaged planar inductors with magnetic material [nickel zinc (NiZn) ferrite]. Inductors are designed specifically for Internet Things (IoT) applications based on power loss in an IoT architecture. Different spiral inductor geometries demonstrated a printed wiring board varying thicknesses using stencil printing process. The can be applied to one or both sides and, therefore, provides size reduction. examines role...

This paper describes the modeling and design of package-embedded magnetic-core inductors for a system-in-package-based high-efficiency integrated voltage regulator. An application example is used to demonstrate complete process, starting with fabrication two candidate magnetic composite materials. Based on measured properties these materials, are designed simulated using full-wave simulations. Finally, overall regulator efficiencies resulting from inductor designs obtained analytical...

In this paper, the design, modeling, fabrication, and characterization of System-in-Package (SiP) solenoid power inductor using a NiZn ferrite composite magnetic core material is demonstrated. A novel fabrication process has been developed for integrating into buck-type integrated voltage regulator (IVR) module. The uses stencil printing to deposit pattern material. Photolithography copper electroplating are used form windings. electrical parameters fabricated inductors were extracted from...

Surface-acoustic-wave (SAW) sensors have undergone outstanding developments during the last decades. However, for biosensing applications, they struggle to compete with optical sensing technologies. In this work, we present a Love-wave-based platform that leverages use of local resonances micropillars fabricated on surface guiding layer. We demonstrate numerically and experimentally Love-wave interaction produces sharp attenuation dips in transmission spectrum. These are associated...

This paper demonstrates a new approach to model the impact of thermal effects on efficiency integrated voltage regulators (IVRs) by combining analytical evaluations with coupled electrical and simulations. An application shows that system-in-package solution avoids problems typically observed in other IVR designs. While evaluation this focuses loss inductor wiring PDN, developed is general enough also impacts power dissipation cores buck converter chip.

This paper discusses the electrical and mechanical characterization of an inkjet-printed patch antenna under uniaxial biaxial bending. A 30 mm × 40 design with a truncated copper ground plane was designed fabricated by inkjet printing on polyethylene terephthalate (PET) substrate. The samples were then fixtured cylindrical polycarbonate mandrels as well 3D printed saddle-like structures using polylactic acid (PLA). S11 measured in both bent flat configurations, shift resonant frequency...

High-efficiency integrated voltage regulators (IVRs) require the integration of power inductors, which have low loss and reduced size at very high frequency. The use a magnetic material core can reduce significantly inductor area simultaneously increase inductance. This paper focuses on fabrication, characterization modeling nickel zinc (NiZn) ferrite carbonyl iron powder (CIP)-epoxy composite materials, are used as materials embedded inductors in printed wiring board (PWB) for system...

Love wave (L-SAW) sensors have been used to probe cell monolayers, but their application detect changes beyond the focal adhesion points on as viscosity cytoskeleton, has not explored. In this work we present for first time a sensor with tuned penetration depth and sensitivity potentially mechanical of monolayers. We designed fabricated operating at 30 MHz viscous between 0.89 3.3 cP. The was modeled using an acoustic transmission line model, whereas response interdigital transducers (IDTs)...

Integrated Voltage Regulators (IVR) with integrated magnetics have been shown to provide better efficiency and performance as compared conventional on-board solutions by reducing power delivery networks (PDN) parasitic, DC switching losses. However, IVR integration remains a challenging problem, major bottleneck being the of inductors especially for high-efficiency high-conversion ratio converters in applications such personal computers servers, where conversion ratios 12:1V or 48:1V (with...

Flexible hybrid electronics (FHE) is a promising technology enabling many applications in biomedical, communication, energy harvesting and internet of things (IoT) areas. To realize FHE applications, the components devices used mentioned technologies need to be electrically characterized under various flexible conditions such as stretching, bending, twisting, folding. Also, strain analysis from mechanical point view needs conducted justify reliable different scenarios. In this paper, design...

Wireless power transfer (WPT) is an ideal delivery solution for many light-load applications, such as the Internet of Things. A regulated WPT may utilize a distribution unit (PDU). Previous works have designed planar inductors integration with switched-inductor buck regulators, but these will not be efficient applications. This paper reevaluates inductor loss applications by taking into account frequency spectrum current. Using this revised analysis, screen printed NiZn ferrite epoxy...

In this paper, we discuss the design, fabrication, and characterization of package embedded solenoidal inductor using a NiZn ferrite magnetic core material based on novel fabrication process. The process relies stencil printing along with photolithography copper electroplating inductor's traces. electrical parameters fabricated inductors were extracted pi-equivalent circuit showed an average dc resistance 29 mΩ , inductance 26 nH, ac 2.62 Ω at 100 MHz, which represents targeted switching...

IoT edge devices are of interest to sustainability research because their support for low energy applications. This work focuses on a wireless power transfer (WPT) system at GHz frequency based near field coupling (NFC) with class E rectifier and DC-DC converter inductor, designed loads in the mW range. The design is completed an integrated board, allowing integration WPT coils inductor circuit board electrical characteristics. maximum efficiency, minimizing losses associated high frequency,...

RF wireless power transfer and energy harvesting have gained a lot of interest nowadays due to its importance as convenient feature in hand-held Internet Things devices. One bottleneck both these applications is on converting the received regulated voltage level that mixed signal load can use. A high-efficiency switching dc-dc converter, which switches at much lower frequency than frequency, required for this purpose. This poses unique design challenge connecting two very different domains....

With the increased demand in wearable devices, design of Flexible Hybrid Electronics (FHE) is becoming important. Emerging systems requiring FHE include wearables, energy harvesting sensory networks, and ECG monitors to name a few. Designing these requires accounting for different flexible actions such as stretching, bending twisting, etc. which models components that capture behavior under actions. This work focuses on characterizing microstrip transmission lines it relates printed...

Integrated energy harvesting and delivery systems are crucial to the development distribution of IoT devices, where physical dimensions as important efficiency. Current blocks use regulators with on-board inductors/capacitors interface between transducers load. A System-in-Package (SiP) Voltage Regulator (IVR) on-package passives provides a compact system. This paper demonstrates that, in SiP based system, co-design regulator circuit depending on input characteristics transducers, material...

We present a finite element (FE) based model to accurately investigate the dispersion and attenuation of Love waves in multilayered structure made piezoelectric substrate, guiding layer, viscous fluid. The numerical solves general form wave equations that includes materials anisotropy, piezoelectricity, viscoelasticity. express for elastic particular formulation order solve an eigenvalue problem where is complex wavenumber k from which we can derive phase velocity [ω/Re(k)] rate [Im(k)]....

The purpose of this paper is to theoretically investigate the resistance backside metallization stacks. latter serves as a conventional die-attach layer providing an excellent ohmic contact and heat dissipation interface integrate circuits in semiconductor packaging. Since typical stack different metal layers, one major practical challenge estimation its vertical electrical when it deposited on silicon wafer. Here, simple fast computation model based finite elements Ansys software proposed...

In this paper, a challenge of silver-based backside metallization (BSM) is addressed by investigating the effect silicon (Si) substrate rear surface modification through chemical etching (roughness modification) on sputtered Titanium/Nickel Vanadium/Silver (TiNiVAg) BSM stack in terms structural (layers conformability, uniformity, morphology, etc.) properties. Ultra-flat (non-structured) and structured Si wafers using isotropic with an average roughness (Ra) 0nm 200nm respectively, were used...