Sridhar Sivapurapu

ORCID: 0000-0003-4623-7444
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About
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Research Areas
  • Advanced Sensor and Energy Harvesting Materials
  • Microwave Engineering and Waveguides
  • Nanomaterials and Printing Technologies
  • Tactile and Sensory Interactions
  • Thin-Film Transistor Technologies
  • Advanced MEMS and NEMS Technologies
  • Advanced Antenna and Metasurface Technologies
  • Surface Modification and Superhydrophobicity
  • Advancements in Semiconductor Devices and Circuit Design
  • Telecommunications and Broadcasting Technologies
  • Innovative Energy Harvesting Technologies
  • Energy Harvesting in Wireless Networks
  • Neuroscience and Neural Engineering
  • Nanowire Synthesis and Applications
  • Additive Manufacturing and 3D Printing Technologies
  • 3D IC and TSV technologies
  • Wireless Power Transfer Systems
  • Millimeter-Wave Propagation and Modeling
  • Electromagnetic Compatibility and Noise Suppression
  • Electronic Packaging and Soldering Technologies
  • Semiconductor Lasers and Optical Devices
  • Advanced Materials and Mechanics
  • RFID technology advancements
  • Antenna Design and Analysis
  • Advanced Memory and Neural Computing

Georgia Institute of Technology
2018-2022

During usage, printed electronic components are often stretched, bent, folded, and/or twisted to conform underlying structure. In this article, tests have been developed for characterizing the mechanical and high-frequency electrical behavior of inkjet-printed patch antennas on flexible polyethylene terephthalate (PET) substrates under uniaxial biaxial bending. A antenna is designed a single resonant frequency 5 GHz in free space. Polycarbonate cylindrical mandrels 1.25" diameter special...

10.1109/tcpmt.2020.2995532 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2020-05-18

Due to the increased popularity of wearable devices, designing flexible hybrid electronics (FHE) is becoming increasingly critical. Some emerging systems that require FHE include wearables, energy-harvesting sensory networks, and electrocardiogram monitors. These designers account for different actions, such as stretching, bending, twisting, etc. Accounting actions requires models components capture behavior under these actions. This work focuses on characterizing effects bending two...

10.1109/tcpmt.2019.2931452 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2019-07-26

This paper discusses the electrical and mechanical characterization of an inkjet-printed patch antenna under uniaxial biaxial bending. A 30 mm × 40 design with a truncated copper ground plane was designed fabricated by inkjet printing on polyethylene terephthalate (PET) substrate. The samples were then fixtured cylindrical polycarbonate mandrels as well 3D printed saddle-like structures using polylactic acid (PLA). S11 measured in both bent flat configurations, shift resonant frequency...

10.1109/ectc.2019.00298 article EN 2019-05-01

Glass has been shown to be a capable core substrate material for high frequency applications. In this paper we examine the capabilities of ultra-thin glass as flexible that can used The two stack-ups discussed in are 60 μm total thickness with (Schott AF32) 30 thickness. One stack-up uses 15 JSR GT-N01 buildup dielectric and other Taiyo Photo Imageable Dielectric. Since neither these have previously electrically characterized, characterizes both up 110 GHz using microstrip ring resonators...

10.1109/ectc32696.2021.00260 article EN 2021-06-01

Flexible hybrid electronics (FHE) is a promising technology enabling many applications in biomedical, communication, energy harvesting and internet of things (IoT) areas. To realize FHE applications, the components devices used mentioned technologies need to be electrically characterized under various flexible conditions such as stretching, bending, twisting, folding. Also, strain analysis from mechanical point view needs conducted justify reliable different scenarios. In this paper, design...

10.1109/ectc.2019.00044 article EN 2019-05-01

New material technologies must be explored to realize high-performance packages for meeting the stringent requirements defined in fifth generation (5G) and sub-THz frequency bands. To this end, electrical properties of new materials such as dielectric constant (relative permittivity) loss tangent need characterized along with interconnects on these substrates investigate their suitability mm-wave applications. In paper, a newly developed technology at Corning, namely, Alumina Ribbon Ceramic...

10.1109/ectc32696.2021.00356 article EN 2021-06-01

With the increased demand in wearable devices, design of Flexible Hybrid Electronics (FHE) is becoming important. Emerging systems requiring FHE include wearables, energy harvesting sensory networks, and ECG monitors to name a few. Designing these requires accounting for different flexible actions such as stretching, bending twisting, etc. which models components that capture behavior under actions. This work focuses on characterizing microstrip transmission lines it relates printed...

10.1109/nemo.2018.8503509 article EN 2018-08-01

Glass has been shown to be a capable core substrate material for high-frequency applications. In this article, we examine the capabilities of ultra-thin glass as that can used flexible The two stack-ups discussed in work presented are 60 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> total thickness with (Schott AF32) 30 thickness. One stack-up uses 15 JSR GT-N01...

10.1109/tcpmt.2022.3196912 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2022-08-05

Integrated energy harvesting and delivery systems are crucial to the development distribution of IoT devices, where physical dimensions as important efficiency. Current blocks use regulators with on-board inductors/capacitors interface between transducers load. A System-in-Package (SiP) Voltage Regulator (IVR) on-package passives provides a compact system. This paper demonstrates that, in SiP based system, co-design regulator circuit depending on input characteristics transducers, material...

10.1109/ectc.2018.00259 article EN 2018-05-01

Abstract High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things and wearable electronics. Carbon nanotube (CNT) thin-film transistor (TFT) is a promising candidate high-performance FHE because its high carrier mobility, superior mechanical flexibility, material compatibility with printing solution processes. Flexible sensors peripheral CNT-TFT circuits, decoders, drivers, sense amplifiers, can be printed hybrid-integrated thinned...

10.4071/imaps.925849 article EN Journal of Microelectronics and Electronic Packaging 2019-07-01

Abstract High‐performance and low‐cost flexible hybrid electronics (FHE) are desirable for applications such as Internet of Things (IoT), wearable electronics, displays. However, design toolkit, methodology, compact models that play an essential role in designing complex FHE circuits systems still missing today. To fill this gap, here we report (a) the process kit (PDK) dedicated to electronic automation (b) solution process–proven intellectual property (IP) blocks, which serves a stepping...

10.1002/jsid.876 article EN Journal of the Society for Information Display 2020-02-17

High-performance low-cost flexible hybrid electronics (FHE) are desirable for internet of things (IoT). Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate high-performance FHE because its high carrier mobility (25cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /V.s), superior mechanical flexibility/stretchability, and material compatibility with printing solution processes. Flexible sensors peripheral CNT-TFT...

10.23919/date.2019.8714975 article EN Design, Automation &amp; Test in Europe Conference &amp; Exhibition (DATE), 2015 2019-03-01

High‐performance low‐cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon‐nanotube (CNT) thin‐film transistor (TFT) is a promising candidate high‐performance FHE, because its high carrier mobility, superior mechanical flexibility, material compatibility with printing solution‐processes. Flexible sensors peripheral CNT‐TFT circuits, decoders, drivers sense amplifiers, can be printed hybrid‐integrated thinned...

10.1002/sdtp.12894 article EN SID Symposium Digest of Technical Papers 2019-05-29

High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate high-performance FHE, because its high carrier mobility, superior mechanical flexibility, material compatibility with printing solution-processes. Flexible sensors peripheral CNT-TFT circuits, decoders, drivers sense amplifiers, can be printed hybrid-integrated thinned...

10.1109/vlsi-dat.2019.8741745 article EN 2019-04-01
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