A5091152136- Electronic Packaging and Soldering Technologies
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Welding Techniques and Residual Stresses
- Nanoporous metals and alloys
- Semiconductor materials and interfaces
- 3D IC and TSV technologies
- Anodic Oxide Films and Nanostructures
- Copper Interconnects and Reliability
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloy Microstructure Properties
- High Temperature Alloys and Creep
- Electrocatalysts for Energy Conversion
- Metal Alloys Wear and Properties
- High Entropy Alloys Studies
- Silicon and Solar Cell Technologies
- Additive Manufacturing Materials and Processes
- Metallurgy and Material Forming
- Metal and Thin Film Mechanics
- Electrodeposition and Electroless Coatings
- High-Temperature Coating Behaviors
- Microstructure and Mechanical Properties of Steels
- Integrated Circuits and Semiconductor Failure Analysis
Osaka University
2020-2023
Hanoi University of Science and Technology
2021-2023
Northeastern University
2016
To develop a lead-free solder with high strength and ductility, novel interface was designed between the tetra-needle-like ZnO whisker (T-ZnOw) Sn1.0Ag0.5Cu matrix. First, surface modification of T-ZnOw conducted using pyrolysis method based on self-assembly to deposit NiO nanoparticles densely evenly surface. The interfacial relationship (1 0 0) 1) planes semi-coherent misfit 0.145. In-situ transmission electron microscopy used explore mechanism. Next, composite 0.3mass% NiO/T-ZnOw...
The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of on Cu substrate was due to rapid diffusion into In-rich alloy. In this study, effect addition xCu (x = 2.0 and 8.0 wt.%) wettability, interfacial reaction, mechanical In-Sn-xCu/Cu analyzed. results demonstrate that both In-Sn-xCu alloys exhibit good wettability contact angle increases with an increase in content. Furthermore, fine grains are observed matrix intermetallic...
The material flow dynamic and velocity distribution on the melted domain surface play a crucial role joint quality formation of welding defects. In this study, authors investigated effects low high currents plasma arc thermodynamics molten pool its relationship to high-speed video camera (HSVC) was used observe convection welded-joint appearance. Furthermore, consider Marangoni force activation, temperature measured by thermal HSVC. results revealed that weld higher than inside pool....
The material flow dynamic and velocity distribution on the melted domain surface play a crucial role joint quality formation of welding defects. In this study, authors investigated effects low high currents plasma arc thermodynamics molten pool its relationship to high-speed video camera (HSVC) was used observe convection welded-joint appearance. Furthermore, consider Marangoni force activation, temperature measured by thermal HSVC. results revealed that weld higher than inside due...
Using flexible polymeric substrates in organic electronic devices is the development trend because of its advantages such as, lighter, easy to roll and offer a lower cost. However, they are transform change dimensions at high temperatures. This big challenge for some available low-temperature bonding processes solders. Therefore, developed solders with low melting temperature, ductility satisfying mechanical properties necessary.The tin-indium eutectic (In-48Sn) alloy promising candidate...
Recently, the sintered nanoparticle has received an attention as a replacement for high temperature lead-based solder in electronic device packaging due to its great thermal conductivity, mechanical properties and melting temperature. However, there are still some problems such controlling thickness formation of unexpected voids caused by evaporation solvent. In this study, nanoporous Cu (NPC) bonding process was developed achieve Cu-Cu without solvent flux. NPC sheet fabricated dealloying...
In-48Sn eutectic alloy has been considering a promising solder for some flexible and organic electronic devices because of their low heat resistance. However, exhibits lower strength compared with other commercial alloys. In this study, we investigated the effects 4.0 mass % Cu addition on melting temperature, microstructure, mechanical properties alloy. The results revealed that temperature new In-Sn-4.0Cu was closed to (117 °C) caused by ternary reaction. Moreover, η-Cu6(In, Sn)5...
Abstract Nanoparticle sintering is considered a promising alternative bonding method to Pb- based soldering for the attachment of components in high-temperature electronic devices. However, technology still poses certain challenges, such as difficulty controlling joint thickness and generation voids owing solvent evaporation. In this study, solid-state (solvent-free), nanoporous-Cu (NPC) was examined. The effect temperatures (200–400°C) atmospheres (N 2 or formic acid) on shear strength...