- Electronic Packaging and Soldering Technologies
- Advanced ceramic materials synthesis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
- Copper Interconnects and Reliability
- Aluminum Alloy Microstructure Properties
- Advanced Welding Techniques Analysis
- Fiber-reinforced polymer composites
- 3D IC and TSV technologies
- Advanced materials and composites
- Additive Manufacturing and 3D Printing Technologies
- Microstructure and Mechanical Properties of Steels
- Fatigue and fracture mechanics
- Powder Metallurgy Techniques and Materials
- Metallurgical and Alloy Processes
- Semiconductor materials and devices
- Dental Implant Techniques and Outcomes
- Semiconductor materials and interfaces
- High Temperature Alloys and Creep
- Boron and Carbon Nanomaterials Research
- Innovations in Concrete and Construction Materials
- Silicon Carbide Semiconductor Technologies
- Hydrogen embrittlement and corrosion behaviors in metals
- Natural Fiber Reinforced Composites
- Dental materials and restorations
Osaka University
2018-2024
Chinese Academy of Sciences
2024
Institute of Microelectronics
2024
Research Institute of Wood Industry
2022
Forestry Research Institute
2022
Chinese Academy of Forestry
2022
King's College London
2021
Beijing University of Technology
2018
Xi'an Jiaotong University
2001-2014
Shaanxi Yanchang Petroleum (China)
2014
To develop a lead-free solder with high strength and ductility, novel interface was designed between the tetra-needle-like ZnO whisker (T-ZnOw) Sn1.0Ag0.5Cu matrix. First, surface modification of T-ZnOw conducted using pyrolysis method based on self-assembly to deposit NiO nanoparticles densely evenly surface. The interfacial relationship (1 0 0) 1) planes semi-coherent misfit 0.145. In-situ transmission electron microscopy used explore mechanism. Next, composite 0.3mass% NiO/T-ZnOw...
Growth of an intermetallic compound (IMC) plays a critical role in the reliability flip-chip solder joints. It has been found that IMC growth is accelerated on anode and inhibited cathode during electromigration (EM), although there are discrepancies relevant literature. In this study, Cu/Sn3.0Ag0.5Cu/Cu joints were examined by EM under current density 1×104A/cm2 at 150 °C; aging test was conducted °C to compare results. Cu atoms dominant diffusion species migrate from EM. The increase...
The intrinsic point defects in InAlAs have been studied by first-principles calculations, with a simplified approach to rescale the charge transition levels from semilocal hybrid functional level. Both antisite and vacancy exhibit high sensitivity growth conditions. For Al-poor, In-poor As-poor conditions, AsAl, AsIn VAs demonstrate lowest defect formation energy, respectively. All including AsIn, InAs AlAs, donor-like behavior band gap as well VAs. VIn VAl are amphoteric defects, which can...
To acquire activated carbon fiber from phenol-liquefied wood (PLWACF) with better developed pore structure and a high proportion of mesoporosity, the porosity evolution PLWACF at temperatures 850 to 950 °C by water steam was detected physical adsorption N2 -196 °C.Results showed that well prolonging activation time 910 °C, it easy obtain having exceptionally surface area (larger than 2560 m 2 g -1 ).However, specific larger 3000 could only be obtained in late stages 880 °C.Using this...
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The B4C/BN nanocomposites were fabricated by hot-pressing sintering of the nanocomposite powders at 1850oC for 1h under pressure 30MPa. composite with microstructure B4C particles coated nano-sized BN prepared chemical reaction H3BO3 and CO(NH2)2 on surface high temperature. investigation sintered samples showed that h-BN homogenously distributed in matrix. With increasing content h-BN, density decreased gradually; fracture strength toughness gradually, 10wt% 20wt% achieved values. Vickers...
The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability high-power modules. Ag-In transient liquid phase (TLP) bonding serves as alternative method for die attachment. However, relevant material data ζ (Ag3In) phase, one intermetallic compound (IMC) products TLP bonding, are limited. This paper proposes approach to fabricate a densified and pure bulk sample phase. were subsequently investigated at elevated temperatures...
Detecting leakage liquid-filled pipe by acoustic emission instrument and researching the signal that measured with water experimental medium. Gathering signals in different pressures or diameters of aperture analyzing spectrum characteristics wavelet packets db5 basis. The result show major frequency components contained at about 232KHz-239KHz. signals’ amplitude energy enhance as pressure diameters’ increase.
High purity alumina/stainless steel joints were produced via activated molybdenummanganese (Mo-Mn) route using 72Ag-28Cu solder. Microstructures of the metallized ceramic and joint sections observed by scanning electron microscopy. Joint strength was tested shear-loading method. Some process factors characterized analyzed, which include temperature, holding time heating cooling rate in metallization process. The effects Ni plating succedent annealing also investigated. Experimental results...
Machinable SiC/graphite composites were fabricated by Plasma Activated Sintering (PAS), which characterized high heating rate, short time sintering and efficiency process. The staring powder mixture included SiC, graphite power a few aids. They sintered PAS under 30 MPa Pressure in vacuum at 1500°C 1550°C, respectively. density, bending strength hardness measured. phase the microstructure of also investigated. results indicated that relative density SiC/C(graphite) composite 1550°C was more...
Transient liquid phase bonding has attracted considerable interests as a potential die attachment method for high power modules. However, the drawback of long processing time restricts its wide application in industry. In this study, novel transit by using sandwich structure In-coated Ag sheet was proposed. The influence on microstructure and mechanical properties bonded joints were investigated. It found that qualified joint with shear strength 19.2 MPa could be obtained even within 10 min...
Abstract Post-oxidation annealing (POA) is widely employed in academic research as well mass production to improve the properties of SiC MOS devices. We investigated effect sequential NO and wet-O2 on interfacial reliability 4H-SiC capacitors. Compared with capacitors normal annealing, sample wet shows almost identical interface state density, near-interface trap density F-N effective barrier height. Regarding breakdown characteristics, charge-to-breakdown (QBD) NO/wet increased by two times...
The paper reports on an investigation of the fracture mechanism both tensile and impact in three types casing-drilling steels. results show that surface N80 steel includes fibrous zone, radiation area shear lip those K55 P110 steels include two zones; all surfaces casing drilling ductile mode, mode indicated with dimples is observed possesses a combined quasi-cleavage modes, single steels, sample fractured cleavage brittle manner, whereas dimpled manner.
Sn–45Bi–2.6Zn–0.5In and Sn–45Bi–2.6Zn–1In alloys have previously been shown to be superior Sn–58Bi under the thermal aging test. In this study, a comparative analysis of microstructure impact strength Sn–58Bi, Sn–45Bi–2.6Zn–0.5In, alloy bumps was conducted before after high-humidity high-temperature tests. Cross-sectional observations tests were performed on all bumps. The results indicated that conditions had slight influence bump, but it reduced maximum force almost zero generated voids at...