A5042323526- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloy Microstructure Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Copper Interconnects and Reliability
- Metal-Organic Frameworks: Synthesis and Applications
- Photochromic and Fluorescence Chemistry
- Metallurgical and Alloy Processes
- High-Temperature Coating Behaviors
- High Entropy Alloys Studies
- Advanced materials and composites
- Metal and Thin Film Mechanics
- Catalytic Processes in Materials Science
- Nanoplatforms for cancer theranostics
- Microstructure and mechanical properties
- Photopolymerization techniques and applications
- Electrocatalysts for Energy Conversion
- Molecular Sensors and Ion Detection
- Luminescence and Fluorescent Materials
- Advanced ceramic materials synthesis
- Additive Manufacturing and 3D Printing Technologies
- Lanthanide and Transition Metal Complexes
- Semiconductor materials and interfaces
Anhui University
2025
Northeast Normal University
2023-2024
Feng Chia University
2020-2024
Shanxi Normal University
2021-2024
University of Manchester
2023
Osaka University
2019-2021
National Yang Ming Chiao Tung University
2015-2021
Kunming University
2018
National Formosa University
2015
National University of Formosa
2015
Abstract High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation corrosion. Although many researchers have investigated HEA applications, few considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound (Fe, Cr, Co, Ni, Cu)Sn 2 at the interface between Sn-3.0Ag-0.5Cu (SAC) solder FeCoNiCrCu 0.5 substrate after...
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient thermal expansion mismatch between Si chips and polymer substrates induces warpage during reflow process. As such, temperature reliability solder joints are critical aspects PoP. Although Sn58Bi good candidate low-temperature processes, its brittleness causes other issues. In this study, an in-situ observation was performed on composite solders (CSs) made...
Photochromic viologen-based materials have emerged as one of the most promising candidates for development X-ray light detection applications, including medical diagnosis and treatment, environmental radiation inspection, industrial crack detection. However, design construction low-dose X-ray-sensitive complexes remains an immense challenge, especially in-depth dissection their response mechanisms. Herein, by using N,N'-4,4'-bipyridiniodipropionate (CV) functional sensitive structural units...
Thermomigration (TM) has become a critical reliability issue in advanced electronic packaging because of Joule heating. A temperature gradient is required to conduct heat away, and only 1 °C difference across 10 μm thick microbump produces 1000 °C/cm, which can cause TM, especially low melting eutectic Sn-Bi solder interconnects. We report here that Bi atoms moving from the hot end cold gradient, are dominant diffusing species. Under assumption constant volume, Sn squeezed by at have...
Electroplated Cu has been extensively applied in advanced electronic packaging, and its mechanical properties are critical for reliability. In this study, foils fabricated through electroplating with various bis-(3-sulfopropyl) disulfide (SPS) concentrations examined using tensile tests. The SPS concentration affects the grain size of electroplated foils, resulting different properties. A significant Hall-Petch effect, [Formula: see text], is demonstrated foils. impurities identified...
Abstract Developing highly active and CO‐resistant Ru‐based catalysts for the alkaline hydrogen oxidation reaction (HOR) can advance large‐scale application of fuel cells but remains a huge challenge. Herein, pure phase W 2 C supported Ru cluster catalyst (Ru/W C) is successfully synthesized through one‐step carburization method. It found that charge transfer from to strongly anchored clusters forms electron‐rich δ− sites electron‐deficient δ+ sites, which significantly weakens adsorption...
Comprehensive Summary Hydrogen‐bonded organic networks (HONs) have attracted intense research interest due to their mild synthesis conditions, good solvent processability and strong reproducibility. Most HONs are constructed by electrically neutral ligands through intermolecular interactions such as weak hydrogen bonding, π‐π stacking. But there a few charge‐assisted hydrogen‐bonding (CAHONs) oppositely charged components. Under hydrothermal we successfully synthesized 3D CAHON (H 2 CV)(H...
Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized surfaces of solder and matrix material during soldering, replacing flux being challenging as continuous decrease in pitch bump a three-dimensional integrated circuit. Although previous study observed effect Sn steaming on wettability FA it has not been understood yet by adequate studies. This demonstrates fluxless soldering behavior Sn-3.0Ag-0.5Cu (SAC) solder/Cu under atmosphere. Resembling vulcanian...