N.C. Tien

ORCID: 0000-0003-0945-1310
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About
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Research Areas
  • Advanced MEMS and NEMS Technologies
  • Photonic and Optical Devices
  • Mechanical and Optical Resonators
  • Groundwater flow and contamination studies
  • Semiconductor Lasers and Optical Devices
  • Radioactive element chemistry and processing
  • Acoustic Wave Resonator Technologies
  • Soil and Unsaturated Flow
  • Advanced Fiber Optic Sensors
  • Microfluidic and Capillary Electrophoresis Applications
  • 3D IC and TSV technologies
  • Advanced Surface Polishing Techniques
  • Aerosol Filtration and Electrostatic Precipitation
  • Radioactivity and Radon Measurements
  • Optical Coherence Tomography Applications
  • Advanced Sensor and Energy Harvesting Materials
  • Radio Frequency Integrated Circuit Design
  • High voltage insulation and dielectric phenomena
  • Nuclear and radioactivity studies
  • Microfluidic and Bio-sensing Technologies
  • Semiconductor Quantum Structures and Devices
  • Electromagnetic Compatibility and Noise Suppression
  • Retinal and Macular Surgery
  • CO2 Sequestration and Geologic Interactions
  • Semiconductor materials and devices

National Tsing Hua University
2002-2024

ITRI International
2010-2018

Industrial Technology Research Institute
2010-2017

University of Hong Kong
2013

Case Western Reserve University
2006-2012

University of California, Davis
2002-2006

University of California, Berkeley
1995-2006

Institute of Nuclear Energy Research
2006

University of California, Los Angeles
2005

Cornell University
1998-2004

A silicon micromachining method has been developed to fabricate on-chip high-performance suspended spiral inductors. The structure of an inductor was formed with polysilicon and over a 30-/spl mu/m-deep cavity in the substrate beneath. Copper (Cu) electrolessly plated onto achieve low resistance. Cu plating process also metallized inner surfaces cavity, forming both good radio-frequency (RF) ground electromagnetic shield. High quality factors (Qs) 30 self-resonant frequencies higher than 10...

10.1109/22.898992 article EN IEEE Transactions on Microwave Theory and Techniques 2000-01-01

This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The takes advantage of the design flexibility structures possible with DRIE. As demonstration, torsional actuator driven by combdrive moving in out-of-plane direction, consisting fingers fingers, has been fabricated. integrated allows to be any structure made

10.1109/84.809061 article EN Journal of Microelectromechanical Systems 1999-01-01

We report an electrostatically driven linear microvibromotor fabricated using surface-micromachining technology. This device is developed for use in actuated micro-optical systems on silicon. Its submicron positioning resolution and a travel range of over 350 /spl mu/m are excellent properties this application. Vibromotor precision velocity characterized, various drive methods discussed. A simulation the vibromotor dynamics presented to explore optimization control issues device.

10.1109/84.536622 article EN Journal of Microelectromechanical Systems 1996-01-01

This paper presents an analytical solution to the electrostatic actuation of asymmetric combdrive in out-of-plane and torsional motions. The exact solutions force motion integral for torque are obtained. dependence peak on thickness movable fingers amount overlap combs is given closed form. Using our model, shift natural resonant frequency due a dc bias analyzed. Furthermore, also applies in-plane interdigitated combdrive. We found that generates constant within 0.1% when minimum initial...

10.1109/84.825787 article EN Journal of Microelectromechanical Systems 2000-03-01

We describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability accuracy required for active semiconductor laser-to-filter (single mode) coupling. In initial experiments, we measure an open-loop position of 0.2 μm, achieve repeatable 45% coupling efficiency with good stability.

10.1109/68.363382 article EN IEEE Photonics Technology Letters 1995-01-01

MEMS switches are one of the most promising future micromachined products that have attracted numerous research efforts in recent years. The majority reported to date employ electrostatic actuation, which requires large actuation voltages. Few lateral relays and those often require nonstandard post process, none them is intended for high-frequency applications. We developed an electrothermally actuated lateral-contact microrelay RF It designed fabricated on both low-resistivity...

10.1109/jmems.2004.838395 article EN Journal of Microelectromechanical Systems 2004-12-01

A microfabricated corona ionizer is developed for miniaturized air particle monitoring instruments. Peek's breakdown criterion and Warburg's Law are used to calculate the required electrode geometries. Single mask electroplating employed as microfabrication technique. Devices with discharge pin radius of 20 mum interelectrode spacing 1.4, 1.8, 2.0, 2.2 mm fabricated tested. The inception voltages in range from 1.4 2 kV achieved without substrate breakdown. It consumes relatively low power at...

10.1109/jmems.2007.909515 article EN Journal of Microelectromechanical Systems 2008-02-01

We present a three-dimensional (3-D) optical coherence tomography (OCT) system based on dual axis microelectromechanical (MEMS) mirror. The MEMS mirror provides high-speed, high resolution 2-axis scanning while occupying very small volume with extremely low power consumption. dimensions of the are 600/spl times/600 /spl mu/m, and both axes capable up to 30 degree angles at frequencies greater than 3 kHz good linearity. A 3-D image set is acquired when integrated fiber-based OCT system. Via...

10.1109/jstqe.2005.857683 article EN IEEE Journal of Selected Topics in Quantum Electronics 2005-07-01

Airborne particles are separated according to their electrical mobilities using a microfabricated corona ionizer and separator electrodes. Oleic acid with sizes ranging from 30 300 nm used characterize the device. They generated TSI 3075 constant output atomizer. These electrically charged by ionizer, resultant particle mobility is function of size particle. A varying DC potential difference 0-2 kV across electrodes selects various mobilities. subsequently counted 3025A condensation counter....

10.1109/jmems.2008.2011123 article EN Journal of Microelectromechanical Systems 2009-01-20

10.1016/j.ijrmms.2015.11.004 article EN International Journal of Rock Mechanics and Mining Sciences 2015-11-21

We report the fabrication of a laser-to-fiber coupling module that incorporates movable silicon-micromachined alignment micromirror. The micromirror can position beam on fiber within 0.17 μm standard deviation and has range motion more than 200 μm. Measurements have shown reproducible efficiency 40%. provides means to compensate for placement inaccuracies passively assembled optical components.

10.1109/68.481129 article EN IEEE Photonics Technology Letters 1996-03-01

A reduction of the adhesion between polysilicon surface-micromachined structures and its silicon substrate using ultrashort pulse laser irradiation has been demonstrated. Polysilicon cantilevers, which adhered to after final rinse dry, were freed by a 800 nm wavelength with duration 150 fs (full width at half-maximum) fluences up 40 mJ/cm2. Increasing widths 2.7 ps resulted in significantly fewer cantilevers indicating that process depends heavily on presence high-temperature carriers...

10.1063/1.116458 article EN Applied Physics Letters 1996-01-08

10.1016/0017-9310(95)00399-1 article EN International Journal of Heat and Mass Transfer 1996-10-01

10.1016/s0924-4247(01)00808-1 article EN Sensors and Actuators A Physical 2002-04-01

Polysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-/spl mu/m-deep cavities in the silicon substrate beneath. The metallization process simultaneously coated inner surfaces of Cu to form both good radio-frequency (RF) ground and electromagnetic shield. Quality factor (Q) up 30 self-resonance frequency (f/sub res/) higher than 10 GHz achieved for a 10.4 nH inductor. Simulation showed that Cu-lined reduced mutual inductance between two adjacent by 5, compared...

10.1109/mwsym.2000.860977 article EN 2002-11-07

In this paper, a micro-Venturi tube fabricated with polydimethylsiloxane (PDMS) is studied for interstitial fluid (ISF) transdermal extraction and manipulation in microfluidic system toward the application of continuous glucose monitoring. The fabrication structure parameters PDMS Venturi were theoretically analyzed experimentally validated against output vacuum efficiency structure. optimization methods also discussed. addition, an optimized was proposed fabricated. A pressure less than 86...

10.1088/0960-1317/22/3/035010 article EN Journal of Micromechanics and Microengineering 2012-02-14

We report a bi-material additive microfabrication technique combining inkjet-printed gold films and an aerosol-deposited dielectric enamel for the realization of multilayer microsystems. Hexanethiol-encapsulated nanoparticle ink enables metal deposition at atmospheric pressure with maximum temperature 200°C. Dielectric patterning is achieved via shadow mask. Process utility demonstrated passive radio frequency components through spiral inductors resonant parallel L-C tanks. The resulting...

10.1109/transducers.2013.6626731 article EN 2013-06-01

This paper reports the design and fabrication of a low-voltage lateral-contact microrelay for RF applications. The silicon surface micromachined relay utilizes electrothermal actuators low-stress nitride as structural connection well electrical thermal isolation. sidewall contact is sputtered gold. driving voltage measured to be low 8V. testing shows that has an off-state isolation 20 dB at 12 GHz. simplicity this four-mask process enables possible integration with other MEMS components.

10.1109/memsys.2002.984353 article EN 2003-06-25

Selective copper encapsulation on silicon has been used to fabricate micromachined devices such as inductors with quality factors over 30 at frequencies above 5 GHz. The are fabricated using either polysilicon surface micromachining, or integrated and deep reactive ion etching bulk micromachining. Their exposed surfaces selectively activated by palladium activation, which allows the subsequent deposition only. This encapsulated-with-copper technique takes advantage of both excellent...

10.1109/84.870052 article EN Journal of Microelectromechanical Systems 2000-09-01

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> The lateral actuated switch requires an isolation structure to provide mechanical coupling and electrical between the actuator contacts. This usually imposes extra difficulty on fabrication process. In previous reports, we demonstrated a thermal switch, where nitride was weak point, leading reliability problems. this paper, developed modified utilizing undoped polysilicon as material....

10.1109/jmems.2007.901121 article EN Journal of Microelectromechanical Systems 2007-10-01

We report on experimental demonstration of a new type nanomechanical resonators based very thin silicon carbide (SiC) square membranes. An optical interferometry with radio-frequency two-port measurement scheme enables sensitive and efficient detection many vibrational modes the Membranes sizes up to 1mm × thicknesses down t ≤ 500nm, offer high aspect ratios compelling resonance spectra multiple-mode operations from kHz range HF (3-30MHz) band. Typical resonances have Q's ~ 800-30000 at room...

10.1109/transducers.2011.5969837 article EN 2011-06-01
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