The paper analyzes a network based denial of service attack for IP (Internet Protocol) networks. It is popularly called SYN flooding. works by an attacker sending many TCP (Transmission Control connection requests with spoofed source addresses to victim's machine. Each request causes the targeted host instantiate data structures out limited pool resources. Once target host's resources are exhausted, no more incoming connections can be established, thus denying further legitimate access....

Chaplets and advanced packaging technologies play a pivotal role in meeting the diverse demanding requirements of data-intensive workloads, by offering solutions that encompass performance, power efficiency, form factor, cost-effectiveness. These package architectures demand higher interconnect density among chiplet's to substrate. Conventional organic ceramic substrates are more apparent scaling electrical wire, due signal integrity, radiality, manufacturing challenges. Glass becoming...

The widespread digitization of critical industrial systems such as nuclear reactors has led to the development digital twins and/or adoption artificial intelligence techniques for simulating baseline behavior and performing predictive maintenance. Such analytical tools, referred anomaly detection techniques, rely on features extracted from data that describe underlying physical process. While these may work well with simulated data, their real-world applications are often hindered by...

We introduce well-developed optical proximity correction (OPC) techniques to the metasurface-based flat optics manufacturing process. Flat optics, formed by subwavelength scale nanostructure pillar (nanopillar) array, so called metasurface, has become promising substitutes for conventional bulky components. For its manufacturing, photolithography is preferable rather than electron beam lithography (EBL) technique because of time and cost effectiveness mass manufacturing. However, required...

This paper proposes the use of a Silicon-On-Insulator (SOI) substrate to control final Si thickness on substrate. After direct wafer-to-wafer bonding another carrier wafer, combination grinding and etching is used remove SOI wafer expose underlying BOX layer. Selective wet-etch process then employed buried oxide (BOX) stop thin Due good wet etch selectivity between (oxide) Si, remaining can be very well-controlled. In this paper, 175nm demonstrated bonded using method. method easily extended...

As industries take advantage of the widely adopted digitalization industrial control systems, concerns are heightened about their potential vulnerabilities to adversarial attacks. False data injection attack is one most realistic threats because could be as simple performing a reply allowing attackers circumvent conventional anomaly detection methods. This scenario real for critical e.g., nuclear reactors, chemical plants, etc., physics-based simulators wide range systems can found in open...

Hybrid bonding, a crucial technique in heterogeneous package integration, holds immense potential for advancing pitch scaling semiconductor technologies. As three-dimensional (3D) nodes continue to progress, the exploration of novel materials and processes becomes imperative. This study focuses on investigation optimal dielectric combinations maintain wafer integrity during aiming achieve higher bond strength with alternative dielectrics limited thicknesses few tens nanometers. Moreover,...

Widespread innovation from artificial intelligence and machine learning (AI/ML) tools presents a lucrative opportunity for the nuclear industry to improve state-of-the-art analyses (e.g. condition monitoring, remote operation, etc.) due increased data visibility. In recent years, risk posed by collaborative exchange has received attention due, in part, potential adversary's ability reverse-engineer intercepted using domain knowledge AI/ML tools. While efficacy of typical encryption been...

We report an efficient approach to integrate semiconductor laser array with photonic integrated circuits (PIC) in optical transceiver architecture aiming for 1.6 Tbps. Key features including waveguide alignment layer, multi-tip edge coupler, pedestals, marks, and under-bump metallization are used achieve integration coupling.

Advanced heterogeneous integration involves the stacking of multiple devices using direct bond interconnect processes to achieve improved functionality. Typical fabrication sequences may require downstream photolithography patterning after wafer-to-wafer bonding and silicon wafer thinning. Precise alignment for this process high overlay accuracy needs be done through thick layers, which is difficult due signal attenuation silicon. To overcome challenge, special layer cavities are often...

This work addresses how analysts of a high-valued system (e.g., nuclear reactor, aircraft turbine designs) can extract findable, accessible, interoperable, and reusable scientific data for public dissemination to artificial intelligence machine-learning (AI/ML) researchers in manner that cannot be reverse-engineered, potentially compromising sensitive or proprietary information. State-of-the-art methods address this problem through masking techniques, which allow access subset the...

Can predictive models develop cognizance or awareness of how they have been used? detect if are being manipulated executed in nonauthorized manners? a software track information propagation through its subroutines to improve execution efficiency? this be achieved covert manner, i.e., avoiding the use additional variables, lines code, and conventional logging files, instead rely directly on physics simulated required cognizance? Achieving these goals under looming threat insiders is...

In the face of advanced persistent threat actors, existing information technology (IT) defenses as well some more recent operational (OT) have been shown to become increasingly vulnerable, especially for critical infrastructure systems with well-established technical know-how. For example, data deception attacks demonstrated their ability mislead human operators and statistical detectors alike a wide range systems, e.g., electric grid, chemical nuclear plants, etc. To combat this challenge,...

In today's world, with an increasing number of robberies, looting and shoplifting, it is indispensable to ensure the safety our belongings valuables. When comes certain places like bank vaults, uninhabited houses, business establishments retail shops, jewellery stores, watch etc., surveillance for observing premise very essential has become unavoidable need hour. At such places, unlikely continuously monitor venue using conventional cameras or a security guard person. To address type issues...

Metasurfaces have been used for efficient manipulation of high-frequency terahertz waves [1]. Nanogaps in metasurface play a critical role the device performance terms higher Q, lower switching power, larger tuning range and/or sensitivity. Due to need nanogaps micron-scale unit cell forming centimeter-scale requires advance lithography tools that can provide both fine resolution and good alignment make process more suitable manufacturing. The involves patterning on highly reflective metals...