Jun He

ORCID: 0000-0003-1719-9661
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About
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Research Areas
  • Geological and Geochemical Analysis
  • Geochemistry and Geologic Mapping
  • Hydrocarbon exploration and reservoir analysis
  • Geomechanics and Mining Engineering
  • Analog and Mixed-Signal Circuit Design
  • Quantum and electron transport phenomena
  • Advancements in Semiconductor Devices and Circuit Design
  • Geochemistry and Geochronology of Asian Mineral Deposits
  • Radioactive element chemistry and processing
  • Advanced Battery Technologies Research
  • Radiation Effects in Electronics
  • Semiconductor materials and devices
  • Perovskite Materials and Applications
  • Transition Metal Oxide Nanomaterials
  • Geoscience and Mining Technology
  • Nanowire Synthesis and Applications

University of Science and Technology of China
2024-2025

Hefei University of Technology
2014-2022

Abstract The Tongling ore district is one of the most economically important areas in Middle–Lower Yangtze River Metallogenic Belt, eastern China. It contains hundreds polymetallic copper–gold deposits and occurrences. Those are mainly clustered (from west to east) within Tongguanshan, Shizishan, Xinqiao, Fenghuangshan, Shatanjiao orefields. Until recently, majority these were thought be skarn‐ or porphyry–skarn‐type deposits; however there have been recent discoveries numerous vein‐type Au,...

10.1111/1755-6724.13764 article EN Acta Geologica Sinica - English Edition 2019-02-01

The development of high-performance multispectral photodetector with narrowband and tunable spectral sensitivity is importance but remains highly challenging to date. Here, we have reported on the fabrication a Si Au/n-type Si/Au not only in ultraviolet also near-infrared region, which related controlled charge collection narrowing (CCN) mechanism. What more, negative response peak device can be readily tuned from 365 605 nm, positive modulated 938 970 nm when bias varies 0.1 −0.1 V. In...

10.1109/ted.2022.3171501 article EN IEEE Transactions on Electron Devices 2022-05-06

10.1109/icta64028.2024.10860723 article EN 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) 2024-10-25
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