Decoupling capacitors are widely used to reduce power supply noise. On-chip decoupling have traditionally been allocated into the white space available on a die or placed inside rows in standard cell circuit blocks. The efficacy of on-chip depends upon impedance power/ground lines connecting current loads and supplies. A design methodology for placing is presented this paper. maximum effective radius shown exist each capacitor. Beyond distance, capacitor ineffective. Depending parasitic...

Multiple power supply voltages are often used in modern high-performance ICs, such as microprocessors, to decrease consumption without affecting circuit speed. To maintain the impedance of a distribution system below specified level, multiple decoupling capacitors placed at different levels grid hierarchy. The systems with supplies is described this paper. noise one can propagate other supply, causing and signal integrity problems overall system. With introduction second therefore,...

To decrease power consumption without affecting circuit speed, multiple supply voltages are often used in modern high performance IC such as microprocessors. maintain the impedance of a distribution system below specified level, decoupling capacitors placed at different levels grid hierarchy. The systems with supplies is focus this paper. dependence on parameters investigated. An antiresonance phenomenon intuitively explained Design techniques to cancel and shift antiresonant spikes out...

On-chip power distribution grids with multiple supply voltages are discussed in this paper. Two types of interdigitated and paired grounds presented. Analytic models also developed to estimate the loop inductance four proposed delivery schemes. schemes, fully pseudo-interdigitated delivery, reduce voltage drops as compared conventional systems dual supplies a single ground by, on average, 15.3% 0.3%, respectively. The performance on-chip is reference grid ground. drop reduced, by 2.7% 2.3%,...

Decoupling capacitors are widely used to reduce power supply noise. On-chip decoupling have traditionally been allocated into the white space available on die based an unsystematic or ad hoc approach. In this way, large often placed at a significant distance from current load, compromising signal integrity of system. This issue delivery cannot be alleviated by simply increasing size on-chip capacitors. To effective, should physically close loads. The area occupied capacitor, however, is...

Reliable design of power distribution network for stacked integrated circuits introduces new challenges i.e., substrate coupling among through silicon vias (TSVs) and tiers grid in addition to reliability issues such as electromigration thermo-mechanical stress, compared conventional system on chip (SoC). In this paper a comprehensive modeling the TSV with frequency dependent parasitic is proposed. The analytical model considers impact between TSVs layers grid. A domain based analysis flow...

This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked integrated circuits (ICs). The power distribution network is modeled and extracted in frequency domain which includes impact of skin effect. worst case noise delivery networks (PDN) with local TSV failures resulting from fabrication process or circuit operation identified both time domain. From experimental results, it observed that a single failure could increase maximum voltage variation up to 70%...

The conventional power network design process requires iterative modifications to the existing eliminate hot spots and converge target impedance parameters. At later stages in IC process, this procedure may require significant time human resources due limited flexibility accommodate necessary changes. Power delivery exploration during early of bring considerable savings system development effort. number iterations be greatly reduced by choosing initial parameters sufficiently close optimum....

Multiple supply voltages are often utilized to decrease power dissipation in high performance integrated circuits. On-chip distribution grids with multiple discussed this paper. A grid and grounds is presented. The proposed delivery scheme reduces voltage drops as compared conventional systems dual supplies a single ground by 17% on average (20% maximum). For an example decoupling capacitors placed between the ground, exhibits, respectively, 13% 18% improvement. can be alternative system.

Decoupling capacitors are widely used to reduce power supply noise. On-chip decoupling have traditionally been allocated into the white space available on die based an unsystematic or ad hoc approach. In this way, large often placed at a significant distance from current load, compromising signal integrity of system. This issue delivery cannot be alleviated by simply increasing size on-chip capacitors. To effective, should physically close loads. The area occupied capacitor, however, is...

In this paper, we propose an efficient flow for the analysis and co-design of large 3D power distribution networks (3D PDN). flow, network is modeled in frequency domain thus can take advantage parallel computing. The proposed significantly reduces CPU time while obtaining accurate results as compared to commercial simulation tools. established PDN model, incorporate on-chip voltage regulator module (VRM) effect inductance. impact each design parameter on simultaneous switching noise (SSN)...

This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked integrated circuits (ICs). The power distribution network is modeled and extracted in frequency domain which includes impact of skin effect. worst case noise delivery networks (PDN) with local TSV failures resulting from fabrication process or circuit operation identified both time domain. From experimental results, it observed that a single failure could increase maximum voltage variation up to 70%...

Decoupling capacitors are widely used to reduce power supply noise. On-chip decoupling have traditionally been allocated into the available white space on a die. The efficacy of on-chip depends upon impedance power/ground lines connecting current loads and supplies. A maximum effective radius exists for each capacitor. Beyond this distance, capacitor is completely ineffective. Two radii determined by target (during discharge) charge time presented in paper. Depending parasitic distribution...

To decrease power consumption without affecting circuit speed, several supply voltages are used in modern high performance ICs such as microprocessors. maintain the impedance of a distribution system below specified level, multiple decoupling capacitors placed at different levels grid hierarchy. The systems with supplies is focus this paper. dependence on parameters investigated. Design techniques to cancel and shift antiresonant spikes out range operating frequencies presented.

Estimates of symbiotic on-die decoupling capacitance are provided for well-junction, interconnect, and quiescent circuits. The available is derived, the intentional required to obtain a desired supply voltage noise target determined.

Switching digital circuits produce current peaks which result in voltage fluctuations on the power supply lines due to inductive behavior of on-chip and chip-to-package interconnects. A design technique is described this paper lower ground bounce noise sensitive circuits. An noise-free added divert from nodes. decoupling capacitor tuned resonance with parasitic inductance interconnects provide an additional low impedance path. Ground reductions about 68% 22% are demonstrated for a single...

Multiple power supply voltages are often used in modern high performance ICs, such as microprocessors, to decrease consumption without affecting circuit speed. The system of decoupling capacitors distribution systems with multiple supplies is described. In order minimize the total impedance a multi-voltage delivery seen from particular supply, capacitor placed between supplies. noise at one can couple into other causing and signal integrity problems overall system. With introduction second...

Multiple supply voltages are often used in modern high performance ICs, such as microprocessors, to decrease power consumption without affecting circuit speed. A decoupling capacitor system for use multiple distribution systems is described. In order minimize the total impedance of a multi-voltage delivery system, seen from particular supply, placed between supplies. The noise at one can propagate other causing and signal integrity problems overall system. With introduction second therefore,...

On-die capacitances interact with the inductance and resistance of power distribution network to supply electrical charge. A distributed model is generally required analyze design a maintain acceptable levels voltage noise. An approximation method proposed in this paper for modeling system frequency domain, defining an effective decoupling capacitance radius around each switching element, both which are dependent. At high frequencies, charge highly localized, determined primarily by grid...

A distributed on-chip decoupling capacitor network is proposed in this paper. system of capacitors shown to provide an efficient solution for providing the required capacitance under existing technology constraints. In a capacitors, each sized based on parasitic impedance power distribution grid. Various tradeoffs are also discussed. Related simulation results typical values resistance presented. The worst case error 0.003% as compared SPICE.