A5100643047- Industrial Vision Systems and Defect Detection
- Fault Detection and Control Systems
- Advanced Statistical Process Monitoring
- Biofuel production and bioconversion
- Manufacturing Process and Optimization
- Image and Object Detection Techniques
- Spectroscopy and Chemometric Analyses
- Machine Fault Diagnosis Techniques
- Technology Assessment and Management
- Microbial Metabolic Engineering and Bioproduction
- Technology and Data Analysis
- Ultrasonics and Acoustic Wave Propagation
- Anomaly Detection Techniques and Applications
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Solid Oxide Fuel Cells
- Face and Expression Recognition
- Enzyme Production and Characterization
- Time Series Analysis and Forecasting
- Non-Destructive Testing Techniques
- Advanced Chemical Sensor Technologies
- ZnO doping and properties
- Fuel Cells and Related Materials
- Enzyme Catalysis and Immobilization
- Welding Techniques and Residual Stresses
- Advanced Surface Polishing Techniques
Chungnam National University
2019-2025
Korea Atomic Energy Research Institute
2023
École Polytechnique Fédérale de Lausanne
2019
Korea University
2001-2019
École nationale supérieure d'arts et métiers
2019
University of Cincinnati
2019
Universidad Autónoma del Estado de Hidalgo
2019
World Economic Forum
2019
Université de technologie de belfort-montbéliard
2019
ParisTech
2019
With the coming of 4th industrial revolution era, manufacturers produce high-tech products. As production process is refined, inspection technologies become more important. Specifically, a printed circuit board (PCB), which an indispensable part electronic products, essential step to improve quality and yield. Image processing techniques are utilized for inspection, but there limitations because backgrounds images different kinds defects increase. In order overcome these limitations, methods...
In Korea, the use of fire-detection systems applying IoT technology to existing analog fire-alarm has increased owing communication convergence, world's best Internet network, and proliferation Things (IoT). Its can be expected increase worldwide in future. For IoT-based exhibit requisite reliability (based on a low false-alarm rate), research related analysis detection signals should actively promoted conducted. However, there been no activity based actual operational data, apart from that...
In the post-fabrication process for semiconductors, it is critical to predict yield. This consists of a series electrical and physical tests following semiconductor fabrication, that generate significant volume parametric data. While past research has investigated yield prediction using test data, most studies have difficulty correctly predicting low high because wide range variables large data set. Also, in case packaging yield, inaccurate as this does not directly correlate with Therefore,...
The encapsulation of living cells is appealing for its various applications to cell-based sensors, bioreactors, biocatalysts, and bioenergy. In this work, we introduce the multiple microalgal in hollow polymer shells rhombohedral shape by following sequential processes: embedding microalgae CaCO₃ crystals; layer-by-layer (LbL) coating polyelectrolytes; removal sacrificial crystals. microcapsule size was controlled alteration crystal size, which dependent on CaCl₂/Na₂CO₃ concentration. could...
The semiconductor manufacturing process is divided into fabrication and packaging process. Fabrication a core for semiconductors consists of about 700 unit processes. This accumulates vast amounts data, many companies apply data-based algorithms to systems improve yield quality. Data generated during the from equipment called fault detection classification (FDC) trace this data has time-series characteristics different patterns depending on sensor type or recipe. Therefore, it necessary...
This research focuses on providing an optimal dispatching algorithm for automatic guided vehicle (AGV) in a mobile metal board manufacturing facility. The target process comprises multiple computerized numerical control (CNC) machines and AGV. An AGV feeds materials between two rows of CNC processing boards, or conveys work process. As it is difficult to derive mathematically working order owing the high computational cost, simple rules have typically been applied such environments. However,...
In a semiconductor manufacturing process, defect cause analysis is challenging task because the process includes consecutive fabrication phases involving numerous facilities. Recently, in accordance with shrinking chip pitches, (FAB) processes require advanced facilities and designs for microcircuits. However, sizes of particle defects remain constant, spite increasing modernization Consequently, this increases ratio. Therefore, study proposes management method reduction The proposed...
The effects of annealing with H2 and N2 on the photoelectrochemical (PEC) properties annealed Nb-doped TiO2 (ann-TNO) film were investigated. photocurrent density ann-TNO was 2 to 3 orders magnitude higher than that u-TiO2 film. To understand this phenomenon, investigated by comparing (TNO) films. An investigation conducted using Hall effect estimation, photoluminescence (PL) analysis, band-gap calculation.
The purpose of this study was to examine the relationship demographic characteristics university students their self-perceived stressors and stress-coping behavior, explore how they could get rid stress in a more positive manner. For data handling, statistical on frequency percentage were obtained, t-test, one-way ANOVA, multiple regression analysis Scheffe posttest employed. subjects 250 who attended K as October 2006. A survey conducted with self- administered questionnaires, answer sheets...
In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in wafer testing phase is key element to ensure competitiveness of companies. The prediction can reduce unnecessary inspection time and expense. However, an analysing method not sufficient analyze data collected at phase. Therefore, many companies have been using summary information such as mean, weighted sum variance, summarized reduces accuracy. paper, we propose analysis for Wafer Map Image...