Ku Kang

ORCID: 0000-0003-4413-2542
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About
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Research Areas
  • Gas Sensing Nanomaterials and Sensors
  • 2D Materials and Applications
  • Recycling and Waste Management Techniques
  • Acoustic Wave Resonator Technologies
  • Surface and Thin Film Phenomena
  • Chemical and Physical Properties of Materials
  • Perovskite Materials and Applications
  • Semiconductor materials and devices
  • Analytical Chemistry and Sensors
  • Chemical Synthesis and Characterization
  • 3D IC and TSV technologies
  • Transition Metal Oxide Nanomaterials
  • Catalytic Processes in Materials Science
  • Metallurgy and Material Science
  • Materials Engineering and Processing
  • Advancements in Semiconductor Devices and Circuit Design
  • Quantum Dots Synthesis And Properties

Hanyang University
2021-2024

Abstract Strongly bound excitons are a characteristic hallmark of 2D semiconductors, enabling unique light–matter interactions and novel optical applications. Platinum diselenide (PtSe 2 ) is an emerging material with outstanding electrical properties excellent air stability. Bulk PtSe semimetal, but its atomically thin form shows semiconducting phase the appearance band‐gap, making one expect strongly excitons. However, in have been barely studied, either experimentally or theoretically....

10.1002/smll.202103400 article EN Small 2021-09-26

The potential applications of silicon microwire materials in monitoring gases have not been fully exploited. Uniform vertical arrays (Si VMWA) are fabricated using a metal-assisted chemical etching process after optimizing the conditions. characteristics and responses Si VMWA-based sensors with different diameters to ammonia gas (NH3) investigated both air nitrogen environments. sensing mechanism sensor NH3 is discussed clarify response exhibits linear wide range concentrations (4%@2...

10.1021/acsaelm.2c01383 article EN ACS Applied Electronic Materials 2023-01-12

This paper introduces a method for direct electrodeposition of indium on superconducting (SC) layers with an optimized electrolyte. Indium-to-indium bump and indium-to-SC bonding is achieved using plated wafers. An atmospheric plasma cleaning process removes native oxide, thermocompression (TCB) developed at air, enabling successful In-In In-SC different microbumps pitch. Plasma-treated bumps exhibit high applicability flip chip low temperatures in air atmosphere, as confirmed by...

10.23919/icep61562.2024.10535594 article EN 2022 International Conference on Electronics Packaging (ICEP) 2024-04-17

The integration of molybdenum disulfide (MoS 2 ) with other semiconductors to form heterojunction phototransistors demonstrates potential for optoelectronic applications due their strong interaction light and tunable bandgaps. Conventionally, bottom‐gate based on MoS amorphous indium–gallium–zinc oxide (a‐IGZO) are fabricated by deposition the a‐IGZO film gate dielectric, followed film, resulting in a /a‐IGZO heterojunction. In this study, an inverted (or denoted as a‐IGZO/MoS...

10.1002/pssa.202400536 article EN cc-by-nc-nd physica status solidi (a) 2024-10-08
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