A5065400619- Advancements in Semiconductor Devices and Circuit Design
- Ferroelectric and Negative Capacitance Devices
- Laser Material Processing Techniques
- 2D Materials and Applications
- Semiconductor materials and devices
- Advanced machining processes and optimization
- Semiconductor Quantum Structures and Devices
- Nanowire Synthesis and Applications
- Advanced Surface Polishing Techniques
- Advanced Fiber Laser Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Photonic and Optical Devices
The University of Tokyo
2024
Two-dimensional (2D) materials stand as a promising platform for tunnel field-effect transistors (TFETs) in the pursuit of low-power electronics Internet Things era. This promise arises from their dangling bond-free van der Waals heterointerface. Nevertheless, attainment high device performance is markedly impeded by requirement precise control over 2D assembly with multiple stacks different layers. In this study, we addressed thickness-modulated n/p+-homojunction prepared Nb-doped p+-MoS2...
Ultrashort-pulse lasers (USPLs) are used in the machining of zirconia ceramics (ZrO2) because their extremely high peak intensities. However, highly efficient and precision microprocessing ZrO2 remains challenging. In this study, we applied a transient selective laser (TSL) processing technique by combining USPL continuous-wave (CW) to realize ultrafast drilling opaque ZrO2. Ultra-high-efficiency TSL was achieved with efficiency 1800 times higher than that drilling. The material removal...
Optical waveguides are crucial in the development of integrated optical circuits. This study examines their formation dielectric materials using ultrashort pulse laser direct writing. Emphasizing significance processing parameters for writing low-loss waveguides, we explored underlying mechanisms through situ observations internal modifications and a detailed analysis electron density refractive index changes. Employing combination pump-probe imaging Mach-Zehnder interferometry, reveal...