A5019748695- Advanced Surface Polishing Techniques
- Corrosion Behavior and Inhibition
- Electrodeposition and Electroless Coatings
- Advanced materials and composites
- Metal and Thin Film Mechanics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- High-Temperature Coating Behaviors
- Aluminum Alloys Composites Properties
- Polymer composites and self-healing
- Advanced Machining and Optimization Techniques
- Silicone and Siloxane Chemistry
- Electrochemical Analysis and Applications
- Hydrogen embrittlement and corrosion behaviors in metals
- Plant responses to water stress
- Hydrogels: synthesis, properties, applications
- Calcium Carbonate Crystallization and Inhibition
- Nanoporous metals and alloys
- ZnO doping and properties
- Manufacturing Process and Optimization
- Diamond and Carbon-based Materials Research
- Nanotechnology research and applications
- Advancements in Semiconductor Devices and Circuit Design
- Advanced battery technologies research
Shanghai Jiao Tong University
2018-2024
Longyan University
2024
Northeastern University
2018
Problems of dendrites formation, hydrogen evolution reaction (HER) and zinc anode corrosion have restricted the performance aqueous zinc-ion batteries (AZIB). In this work, we introduce 2-butene-1,4-diol (BED) into ZnSO4...
Drought is an important abiotic stressor that adversely affects agricultural production, resulting in decreased crop yields and food insecurity. The objective of this study was to develop a novel hydrogel-based composite (S-B-AA) by incorporating biochar into hydrogel (S-AA) evaluating its effects on tobacco plants under drought stress. S-B-AA exhibited enhanced water absorption retention capabilities compared the S-AA hydrogel. Under stress conditions, effectively increased total content,...
In this contribution, we reported a design of shape memory networks poly(ε‐caprolactone)s (PCLs) via POSS‐POSS interactions. First, series novel organic‐inorganic PCL stars with polyhedral oligomeric silsesquioxane (POSS) termini were synthesized the combination ring‐opening polymerization ε‐caprolactone and copper (I)‐catalyzed cycloaddition alkynyl azido groups. It was found that significantly displayed properties about 100% recovery. The morphological observation showed in stars, POSS...
A precise control of the microstructure electrodeposited cobalt film is crucial for attaining desired and reproducible electrical performance in edge nanoelectronic devices. Here we realize super-flat uni-oriented through a one-step electrodeposition process using benzenesulfinic acid (BNS) as additive. We find that unsaturated sulfite group BNS plays key role electroplating. Molecular activity analysis electrochemical test results suggested electron donating ability was higher than...
Chemical mechanical polishing (CMP) is widely used in chip manufacturing processes including metal interconnection, wafer-to-wafer hybrid bonding and through-silicon-via technologies to planarize surfaces remedy defects. Its planarization defect-remedy abilities are highly associated with the inhibitors CMP slurry their interaction surface. Though density functional theory (DFT) calculation has been proven effective unravelling adsorption mechanism on atomic scale, previous work mainly...
Abstract：Chemical mechanical planarization, known as CMP, is one of the key technologies in chip manufacturing and widely used to achieve ultrafine planarization a variety structures on nanometer scale.The metals interconnection layer exhibits quite different properties from materials other chips, whose relies more chemical components polishing slurry.The synergistic mechanism depicts process material removal metal CMP：the surface first chemically modified by slurry, followed subsequent...