A. Tsuchiya

ORCID: 0009-0004-5444-6910
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Low-power high-performance VLSI design
  • Advancements in PLL and VCO Technologies
  • Indoor and Outdoor Localization Technologies
  • Electromagnetic Compatibility and Noise Suppression
  • VLSI and Analog Circuit Testing
  • Speech and Audio Processing
  • 3D IC and TSV technologies
  • Interconnection Networks and Systems
  • Semiconductor Lasers and Optical Devices
  • Robotics and Sensor-Based Localization
  • Synthesis and properties of polymers
  • Underwater Vehicles and Communication Systems
  • Microwave Engineering and Waveguides
  • Photonic and Optical Devices
  • Underwater Acoustics Research
  • Advanced materials and composites
  • Semiconductor materials and devices
  • Metal Alloys Wear and Properties
  • Embedded Systems Design Techniques
  • Metal and Thin Film Mechanics
  • Electronic Packaging and Soldering Technologies
  • Electrostatic Discharge in Electronics
  • Flow Measurement and Analysis
  • Analog and Mixed-Signal Circuit Design
  • Electromagnetic Compatibility and Measurements

University of Tsukuba
2019-2025

Tsukuba University of Technology
2024

Kyushu Institute of Technology
2016

Kyoto University
2003-2013

Kanagawa Industrial Technology Center
2011-2012

Fujitsu (Japan)
2003

The University of Tokyo
2002-2003

Abstract In this paper, we propose the use of a semi-circular array to achieve two-dimensional positioning in shallow water. We fabricated and conducted experiments coastal area evaluate an appropriate signal processing technique. The obtained results suggest that delay-and-sum beamforming method is suitable for applications allowing some error, while multiple classification provides more precise when additional computational resources are available.

10.35848/1347-4065/adcacd article EN Japanese Journal of Applied Physics 2025-04-09

This paper discusses the effect of dummy fills on performance spiral inductors. In Si-CMOS processes that use copper wire, metal are required to prevent thickness fluctuation in chemical mechanical polishing stage. Dummy have been thought affect wire capacitance; however, high frequency, also resistance and inductance due eddy current fills. work evaluates by three-dimensional field solver proposes a structure suppress Experimental results show proposed method can decrease <i...

10.1109/tmtt.2008.2007362 article EN IEEE Transactions on Microwave Theory and Techniques 2008-12-01

This work discusses the signaling performance of wave pipelining over on-chip transmission lines comparing conventional with CMOS static repeater insertion. We experimentally reveal that is about ten times superior in maximum throughput, latency and dissipates several less energy per bit compared signaling, whereas required interconnect resource comparable.

10.1109/epep.2004.1407619 article EN Electrical Performance of Electronic Packaging 2005-04-06

This paper discusses the resistive termination of on-chip high-performance interconnects. Resistive can improve bandwidth interconnects, on other hands, increases power dissipation. Therefore a design guideline for is necessary. In this paper, we propose method to determine The derived by proposed provides minimum sensitivity process variation as well maximum eye-opening in voltage

10.1109/cicc.2005.1568742 article EN 2006-01-18

This paper discusses the resistive termination of on-chip high-performance interconnects. Resistive is effective to improve bandwidth interconnects, on other hands, increases power dissipation and area. Therefore trade-off analysis about necessary. proposes a method determine The derived by proposed provides minimum sensitivity process variation as well maximum eye-opening in voltage.

10.1093/ietele/e90-c.6.1267 article EN IEICE Transactions on Electronics 2007-06-01

This paper discusses performance limitations of on-chip interconnects. On-chip global interconnects are considered to be a bottleneck high-performance LSIs. To overcome this issue, high-speed signaling and large throughput interconnection using electrical wires studied. However, the has not been studied sufficiently. reveals maximum interconnects, based on derived analytic expressions detailed circuit simulation. We derive trade-off curves among bit rate, interconnect length, eye opening,...

10.1109/cicc.2004.1358864 article EN 2004-11-30

On-chip global signaling whose performance improves with technology advance is eagerly demanded. This work focuses on wave pipelining on-chip transmission lines, which one of probable solutions, and predicts the trend in future. Experiments reveal that capacity per channel will improve till at least 35nm 10mm-long or below signaling. We also demonstrate current-mode differential robust against power supply noise, but delivery nonzero impedance degrades performance.

10.1109/epep.2005.1563706 article EN 2006-01-05

Proposed are low-loss and high-speed transmission flexible printed circuits (FPCs) based on liquid crystal polymer (LCP) films. The losses of FPC LCP polyimide (PI) film were measured under various conditions. At 23°C with 60 %RH, the differential-mode loss differential line films was 0.52 dB/cm lower than that PI at 40 GHz. Moreover, differences in film, caused by changes temperature relative humidity, smaller those film. These results show characteristics FPCs more stable

10.1049/el.2012.2779 article EN Electronics Letters 2012-09-12

This paper proposes a design technique to reduce the power dissipation of CML driver for on-chip transmission-lines. drivers can operate at higher frequency than conventional static CMOS logic drivers. On other hand, is larger that The proposed method reduces by using an impedance-unmatched instead impedance-matched driver. Measurement results show 32% compared with 12.5 Gbps.

10.1093/ietele/e90-c.6.1274 article EN IEICE Transactions on Electronics 2007-06-01

This paper proposes a closed-form eye-diagram model for on-chip distortionless transmission lines with intentionally inserted shunt conductance. We derive expressions of eye-opening both in voltage and time, by assuming piece-wise linear waveform model. The is experimentally verified various length, conductance resistive termination. also apply the proposed to design space exploration, demonstrate that helps estimate optimal termination according required signaling length throughput.

10.1093/ietfec/e91-a.12.3474 article EN IEICE Transactions on Fundamentals of Electronics Communications and Computer Sciences 2008-12-01

Abstract The objective of this study is to achieve vehicle self-localization using a single acoustic ranging sensor in multipath environment. For purpose, we proposed measurement method multiple time-of-flight (ToF) an and the ToFs. predicts ToFs based on wall position predicted self-location corrects by comparing it with actual Sound waves radiated indoors are reflected times every wall, ceiling, floor. Therefore, observed signal contains waves. Since conventional only considers reflection,...

10.35848/1347-4065/ac506c article EN Japanese Journal of Applied Physics 2022-01-31

Demonstrated successfully a 20 km fiber-optic transmission of 156 Mb/s-DBPSK 60 GHz optical mm-wave signal with new modulation technique employed; the dual-mode phase shift keying (DMPM) method that we have proposed for use in advanced fiber-radio systems based on passive base stations (PBSs). The experiment was performed to investigate DMPM performance from realistic viewpoint, and following attractive features were confirmed its PBS application; high index, dispersion tolerance compactness.

10.1109/mwp.2002.981797 article EN 2003-06-25

Temperature dependence of the complex permittivity for polyimide (PI) used in flexible printed circuit at 10 GHz was measured by cylindrical cavity resonator method with temperature controller range between 27 to 100°C. The PI absorbing moisture larger than those drying 27°C. With an increase temperature, decreased and came close over 70°C. low is affected absorption compared high temperature. From measurement result, we discussed effect condition on dielectric loss microstrip line fabricated PI.

10.1109/iceaa.2011.6046375 article EN International Conference on Electromagnetics in Advanced Applications 2011-09-01

This study aims to realize self-position estimation for indoor robots using only a single acoustic channel. When omnidirectional transmitter/receiver is used as an object detection sensor, detected objects are identified on concentric circles with the center point. Self-position method this sensor cannot use directional information of object. fact makes it impossible specify robot's turning angle environmental information. In paper, we propose that can consider direction reflected by...

10.1109/jispin.2024.3403519 article EN cc-by IEEE Journal of Indoor and Seamless Positioning and Navigation 2024-01-01

10.1109/gcce62371.2024.10760443 article EN 2022 IEEE 11th Global Conference on Consumer Electronics (GCCE) 2024-10-29

In this paper, we propose a wall position estimation method for indoor mobile robots having omnidirectional speakers and microphones. method, linear up-chirp signal is emit from the speaker recorded by microphone, an impulse response of room measured calculating crosscorrelation function between transmit receive signals. Furthermore, distance to surface estimated obtaining delay time detected echo. We implemented proposed on robot experimented it, suggesting that it can estimate with accuracy 0.2 m.

10.1109/gcce46687.2019.9015286 article EN 2022 IEEE 11th Global Conference on Consumer Electronics (GCCE) 2019-10-01

This paper presents high-speed and area-efficient laser-diode driver with interwoven inductor in a 0.18-μm CMOS. We interweave ten peaking inductors for area-effective implementation as well performance enhancement. Interwoven can not only achieve area-efficiency but also tune frequency characteristic. Mutual inductances of enhance bandwidth suppress group delay dispersion. The test chip area is 0.32 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML"...

10.1109/aspdac.2013.6509578 article EN 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC) 2013-01-01

We report on the first fine x-z mapping experiment of magnetic near-field distribution over circuit patterns. Required three-dimensional (3D) spatial resolution was brought about by utilizing fiber-edged magneto-optic (FEMO) probe structure. The 3D technique electromagnetic fields provides more information finer variations in vertical (z) direction cases circuits. electro-optic/magneto-optic (EO/MO) probing techniques are promising toward this purpose since one can take its attractive...

10.1109/leos.2001.969303 article EN 2002-11-13

The relative complex permittivities of dielectric substrates for flexible printed circuits (FPCs) at 10 GHz were measured by the perturbation method using a cylindrical cavity resonator temperatures ranging from 27 to 100 °C. temperature dependencies ɛγ and tan δ values polyimide (PI) greatly changed moisture absorption properties. ετ liquid crystal polymer (LCP) substrate not affected lower than those PI below 70 losses microstrip lines (MSLs) FPCs evaluated. These found be more stable an...

10.1049/el.2012.2090 article EN Electronics Letters 2012-07-19

We designed a 1 V, 50 MHz, 16-bit DSP core using 0.25-/spl mu/m Dual Vt Library, SRAM, and Mask ROM tailored for V operation. The architecture was enhanced an alternate MAC to recover slower circuitry. A 1.0 1.5 voltage up converter with 59% power efficiency 450 ps 2.5 level were implemented. simulation CODEC firmware showed 10.4 mW, about quarter of standard DSP.

10.1109/vlsic.1999.797218 article EN 2003-01-20

This paper proposes a simple yet sufficient Si-substrate modeling for interconnect resistance and inductance extraction. The proposed expresses as four filaments in filament-based extractor. Although the number of is small, extracted loop inductances resistances show accurate frequency dependence resulting from proximity effect. We experimentally prove accuracy using FEM (Finite Element Method) based simulations electromagnetic fields. also method to determine optimal size filaments. model...

10.1093/ietfec/e89-a.12.3560 article EN IEICE Transactions on Fundamentals of Electronics Communications and Computer Sciences 2006-12-01

逃げ面側のみ窒化クロムで被覆した超硬合金工具(UP)の摩耗特性と切削性能を明らかにするため,スプルース柾目面の回転切削(回転径134 mm,回転数6000 rpm,送り 1 m/min)と,その回転切削で摩耗した工具による平削り(切込量を徐々に増加させるために被削面を順目方向に0.14°傾斜。送り 3 m/min)を行い,切れ刃の摩耗,平削りでの切屑生成能などを高速度工具鋼(HSS)および被覆なしの超硬合金(UH)工具と比較した。回転切削においてUPは常に鋭利な切れ刃を保持し,切削材長50 mでの刃先の丸み半径(R)はHSSの約 1/6,UHの約 1/2 であった。平削りの実験から,切屑生成過程は切削力の変化などから3段階に分類できること,切れ刃が被削材に接触し連続した切屑を生成し始めるまでの時間は常にUPが最も小さいこと,連続した切屑を生成し始める切込量とRは良好な直線関係を示すことなどが明らかになった。

10.2488/jwrs.56.1 article JA Mokuzai Gakkaishi 2010-01-01
Coming Soon ...