Mingliang Tan

ORCID: 0000-0001-7400-3886
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About
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Research Areas
  • Ultrasound Imaging and Elastography
  • Ultrasonics and Acoustic Wave Propagation
  • Electrical and Bioimpedance Tomography
  • Photoacoustic and Ultrasonic Imaging
  • Analog and Mixed-Signal Circuit Design
  • Wireless Power Transfer Systems
  • Integrated Circuits and Semiconductor Failure Analysis
  • Optical Systems and Laser Technology
  • Advanced X-ray and CT Imaging
  • Ultrasound and Hyperthermia Applications
  • Induction Heating and Inverter Technology
  • Ultrasound and Cavitation Phenomena
  • Coronary Interventions and Diagnostics
  • Piezoelectric Actuators and Control
  • Advanced DC-DC Converters
  • Cardiac Valve Diseases and Treatments
  • VLSI and Analog Circuit Testing
  • Advanced MRI Techniques and Applications

Delft University of Technology
2017-2024

This paper presents an area- and power-efficient application-specified integrated circuit (ASIC) for 3-D forward-looking intravascular ultrasound imaging. The ASIC is intended to be mounted at the tip of a catheter, has circular active area with diameter 1.5 mm on top which 2-D array piezoelectric transducer elements integrated. It requires only four micro-coaxial cables interface 64 receive (RX) 16 transmit (TX) imaging system. To do so, it routes high-voltage (HV) pulses generated by...

10.1109/jssc.2018.2828826 article EN IEEE Journal of Solid-State Circuits 2018-05-08

This paper presents a front-end application-specified integrated circuit (ASIC) with 2-D PZT matrix transducer that enables in-probe digitization acceptable power dissipation for the next-generation endoscopic and catheter-based 3-D ultrasound imaging systems. To achieve power-efficient massively parallel analog-to-digital conversion (ADC) in array, 10-bit 30 MS/s beamforming ADC merges subarray functions charge domain is proposed. It eliminates need costly intermediate buffers, thus...

10.1109/jssc.2018.2864295 article EN IEEE Journal of Solid-State Circuits 2018-09-05

Intravascular ultrasound (IVUS) is an imaging modality used to visualize atherosclerosis from within the inner lumen of human arteries. Complex lesions like chronic total occlusions require forward-looking IVUS (FL-IVUS), instead conventional side-looking geometry. Volumetric can be achieved with 2-D array transducers, which present major challenges in reducing cable count and device integration. In this work, we 80-element lead zirconium titanate matrix transducer for FL-IVUS a front-end...

10.1109/tuffc.2018.2859824 article EN IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control 2018-07-25

This article presents a low-noise transimpedance amplifier (TIA) designed for miniature ultrasound probes. It provides continuously variable gain to compensate the time-dependent attenuation of received echo signal. time-gain compensation (TGC) compresses echo-signal dynamic range (DR) while avoiding imaging artifacts associated with discrete steps. Embedding TGC function in TIA reduces output DR, saving power compared prior solutions that apply after amplifier. The employs capacitive ladder...

10.1109/jssc.2020.3023618 article EN IEEE Journal of Solid-State Circuits 2020-09-22

This article presents a fully integrated 64-channel programmable ultrasound transmit beamformer for catheter-based probes, designed to interface with capacitive micro-machined transducer (CMUT) array. The chip is equipped high-voltage (HV) pulsers that can generate ±30-V return-to-zero (RZ) and non-RZ pulses. employ compact back-to-back isolating HV switch topology employs floating-gate drivers only one MOS transistor each. Further die-size reduction achieved by using the RZ switches also as...

10.1109/jssc.2020.2987719 article EN IEEE Journal of Solid-State Circuits 2020-04-29

Data acquisition from 2D transducer arrays is one of the main challenges for development emerging miniature 3D ultrasound imaging devices, such as trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The obstacle lies in mismatch between large number elements (10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> to 10 xmlns:xlink="http://www.w3.org/1999/xlink">4</sup> ) limited cable count (<;200). Recent...

10.1109/isscc.2018.8310246 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2018-02-01

This letter presents a compact programmable high-voltage (HV) pulser for ultrasound imaging, designed driving capacitive micromachined ultrasonic transducers (CMUTs) in miniature probes. To enable bipolar return-to-zero (RZ) pulsing and embedded transmit/receive switching, back-to-back isolating HV switch is proposed that employs 'boating-gate drivers with only one MOS transistor each. The can be digitally programmed to generate pulses without RZ, peak-to-peak swing up 60 V, as well negative...

10.1109/lssc.2019.2938141 article EN IEEE Solid-State Circuits Letters 2019-09-01

This paper presents an ultrasound receiver ASIC in 180nm CMOS that enables element-level digitization of echo signals miniature 3D probes. It is the first to integrate analog front-end and a 10-b Nyquist ADC within 150 μm element pitch 5-MHz 2D transducer array. To achieve this, hybrid SAR/shared-single-slope architecture proposed which ramp generator shared each 2x2 subarray. The consumes 1.54mW/element has been successfully demonstrated acoustic imaging experiment.

10.23919/vlsic.2019.8778200 article EN Symposium on VLSI Circuits 2019-06-01

This paper presents a front-end ASIC for forward-looking intravascular ultrasound (IVUS) imaging. The is intended to be mounted at the tip of catheter and can interface total 80 piezo-electric transducer elements with an imaging systems using only 4 cables, thus significantly reducing system complexity compared prior art. It capable switching high-voltage transmit pulses 16 elements, capturing resulting echo signals 64 multiplexed receive elements. digitizes received locally, providing more...

10.1109/cicc.2017.7993708 article EN 2022 IEEE Custom Integrated Circuits Conference (CICC) 2017-04-01

Miniature ultrasound probes, such as the intra-cardiac echography (ICE) probe shown in Fig. 23.6.1, increasingly employ in-probe ASICs to interface with elements of an transducer array improve signal quality and reduce cable count [1]-[4]. For each element, ASIC contains a pulser that drives element generate pressure wave, low-noise amplifier (LNA) amplifies resulting echo signal, time-gain compensation (TGC) circuit compensates for time-varying echo-signal amplitude due propagation...

10.1109/isscc19947.2020.9063052 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2020-02-01

This letter presents a compact programmable high-voltage (HV) pulser for ultrasound imaging, designed driving capacitive micromachined ultrasonic transducers (CMUTs) in miniature probes. To enable bipolar return-to-zero (RZ) pulsing and embedded transmit/receive switching, back-to-back isolating HV switch is proposed that employs floating-gate drivers with only one MOS transistor each. The can be digitally programmed to generate pulses without RZ, peak-to-peak swing up 60 V, as well negative...

10.1109/esscirc.2019.8902876 article EN ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC) 2019-09-01

Battery-powered ultrasound (US) imaging devices in the form of an on-body patch are promising for next-generation health monitoring. They have potential to enable impactful applications such as blood-pressure, cardiac, bladder, and respiratory Research this area date has focused on realization patch-based flexible transducers, while significant challenges associated with required battery-powered miniaturized electronics remained largely unaddressed.

10.1109/isscc49657.2024.10454286 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2024-02-18

In this work, we report the acoustical characterization of a 9 French (Fr) CMUT-based 1D catheter tip (2.5×12.8 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> - 64 elements 7.5 MHz) embedding channels analog transceiver ASIC (180 nm HV BCD technology) dedicated to Intra-cardiac Echocardiography. To end, Through-Silicon-Via process has been integrated in CMUT flow ensure suitable vertical integration level needed accommodate with...

10.1109/ius46767.2020.9251715 article EN 2017 IEEE International Ultrasonics Symposium (IUS) 2020-09-07
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