Yulan Lu

ORCID: 0000-0003-3826-5998
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Research Areas
  • Advanced MEMS and NEMS Technologies
  • Mechanical and Optical Resonators
  • Acoustic Wave Resonator Technologies
  • Advanced Fiber Optic Sensors
  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Geophysics and Sensor Technology
  • Stochastic processes and financial applications
  • Seismic Waves and Analysis
  • Photonic and Optical Devices
  • Additive Manufacturing and 3D Printing Technologies
  • Advanced Sensor and Energy Harvesting Materials
  • Advanced Sensor Technologies Research
  • Electrocatalysts for Energy Conversion
  • Analytical Chemistry and Sensors
  • Hydrogen Storage and Materials
  • Insurance, Mortality, Demography, Risk Management
  • Differential Equations and Numerical Methods
  • Sensor Technology and Measurement Systems
  • Hybrid Renewable Energy Systems
  • Advanced Welding Techniques Analysis
  • Financial Risk and Volatility Modeling
  • Mathematical Biology Tumor Growth
  • Robotics and Sensor-Based Localization
  • Electromagnetic Compatibility and Noise Suppression

Chinese Academy of Sciences
2007-2025

State Key Laboratory of Transducer Technology
2017-2025

Aerospace Information Research Institute
2020-2025

China State Construction Engineering (China)
2025

Guangzhou Medical University
2025

Guangzhou Women and Children Medical Center
2025

National Cheng Kung University
2025

University of Chinese Academy of Sciences
2017-2024

Academy of Mathematics and Systems Science
2020-2022

Dongguan University of Technology
2022

In this paper, a piezoresistive pressure sensor based on silicon insulator (SOI) was presented, which composed of an SOI layer with sensing elements and glass cap for hermetic package. Different from its conventional counterparts, the position thickness four piezoresistors optimized numerical simulation, suggests that two at center while other edge pressure-sensitive diaphragm 2 μm can produce maximum sensitivity minimum nonlinearity. Due to use rather than metal electrical connections,...

10.3390/mi12091095 article EN cc-by Micromachines 2021-09-11

This letter presents a MEMS resonant differential pressure sensor with an integrated temperature and static to address the issue of side effects on measurement accuracies microsensors. In this microsensor, two resonators were employed sensitive diaphragm sense while Pt-film-resistor was included as additional resonator positioned framework sensor. Microfabrication conducted manufacture microsensor key performances quantified 79.76 Hz/kPa (~1036 ppm/kPa) sensitivity, <inline-formula...

10.1109/led.2022.3211886 article EN IEEE Electron Device Letters 2022-10-04

MXenes are a two-dimensional (2D) class of transition metal carbides, nitrides, and carbonitrides that have been synthesized developed for diverse purposes, such as energy storage devices. feature exceptional mechanical strength, outstanding hydrophilicity, astounding dispersion quality in comparison to other 2D materials, making them perfect the creation films/membranes with specified morphologies tunable nanochannels which is important active anode material. For metal-ion Li–S batteries,...

10.1016/j.mtadv.2022.100303 article EN cc-by-nc-nd Materials Today Advances 2022-10-13

This article presents a new micromachined resonant differential pressure sensor, which is mainly composed of an SOI wafer as the sensing element and glass-on-silicon (GOS) cap for vacuum packaging. More specifically, two resonators were deployed on central side areas pressure-sensitive diaphragm in handle layer coupled to GOS glass layer, enabling outputs. The proposed sensor was fabricated based conventional microfabrication processes (e.g., photolithography, deep reactive ion etching,...

10.1109/ted.2019.2957880 article EN IEEE Transactions on Electron Devices 2020-01-14

Cavity silicon on insulator (Cavity-SOI) offers significant design flexibility for microelectromechanical systems (MEMS). Notably, the shape and depth of cavity can be tailored to specific requirements, facilitating realization intricate multi-layer structural designs. The novelty proposed fabrication methodology is manifested in its employment a micromachining process flow, which integrates dry etching, wafer level Au–Si eutectic bonding, chemical mechanical polishing (CMP) create...

10.3390/mi16030297 article EN cc-by Micromachines 2025-02-28

Genome sequencing (GS) refers to a technology that comprehensively and systematically detects the DNA sequences of an individual's nuclear mitochondrial genomes. It aims identify genetic variants investigate their roles in human health disease progression. As emerging diagnostic tool, GS offers significant support for clinical diagnosis due its high throughput, accuracy, comprehensiveness. However, complexity data analysis interpretation requires substantial professional expertise...

10.16288/j.yczz.24-296 article EN PubMed 2025-03-01

As the importance of machine learning continues to grow, in-memory computation emerges as a promising approach, especially for data-intensive tasks like learning. Unlike conventional von Neumann architecture, which...

10.1039/d5mh00036j article EN Materials Horizons 2025-01-01

In this investigation, Cu/Sn lead-free solder microbumps with 10 μm pads on 20 pitch are designed and fabricated. The chip size is 5mm × thousands of microbumps. A daisy-chain feature adopted for the characterization reliability Assessment. After pattern trace formation, microbump fabricated by an electroplating technique. suitable barrier/seed layer thickness applied to minimize undercut due wet etching but still achieve good plating uniformity. With current process, less than 1 bump height...

10.1109/ectc.2011.5898704 article EN 2011-05-01

This paper presents a high-sensitivity micromachined resonant differential pressure sensor based on bulk silicon. The includes sensing unit made of SOI wafer, which is vacuum packaged by glass-on-silicon (GOS) wafer. More specifically, two resonators located in the device layer were coupled to GOS glass and deployed central side areas pressure-sensitive diaphragm respectively, enabling outputs. According relevant theory elasticity, sensitivity high, where conversion efficiency stress...

10.1109/jsen.2021.3051286 article EN IEEE Sensors Journal 2021-01-15

Abstract This paper reports a MEMS-based co-oscillating electrochemical vector hydrophone based on two microelectrode chips with deep micro-channels. Micro-channels and flow holes are obtained simultaneously by one step of reactive ion etching. By skillfully taking advantage the Aspect Ratio Dependent Etching(ARDE), penetrating silicon wafer micro-channels surrounding will be obtained. When sputtering metal micro-electrode, due to micro-channels’ depth limitation angle incidence sputtering,...

10.1088/1742-6596/2982/1/012008 article EN Journal of Physics Conference Series 2025-04-01
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