A5103208885- Electronic Packaging and Soldering Technologies
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- 3D IC and TSV technologies
- Aluminum Alloy Microstructure Properties
- Intermetallics and Advanced Alloy Properties
- Tribology and Lubrication Engineering
- Semiconductor materials and interfaces
- Metallic Glasses and Amorphous Alloys
- Adhesion, Friction, and Surface Interactions
- Gear and Bearing Dynamics Analysis
- Metallurgical Processes and Thermodynamics
- Magnesium Alloys: Properties and Applications
- Metal Forming Simulation Techniques
- Advanced Surface Polishing Techniques
- Metal Alloys Wear and Properties
- Hydrogen embrittlement and corrosion behaviors in metals
- Fatigue and fracture mechanics
- Electromagnetic Compatibility and Noise Suppression
- Electrodeposition and Electroless Coatings
- High Entropy Alloys Studies
- High-Temperature Coating Behaviors
- Welding Techniques and Residual Stresses
- Material Properties and Failure Mechanisms
- Metallurgical and Alloy Processes
Zhengzhou Institute of Machinery
2012-2024
State Key Laboratory of Advanced Brazing Filler Metals and Technology
2012-2024
Tsinghua University
2024
Harbin Institute of Technology
2020
Northwestern Polytechnical University
2020
Xi'an University of Architecture and Technology
2020
With the miniaturization of solder joints and deterioration serving environment, much effort had been taken to improve properties Sn-based lead-free solders. And fabrication composite alloys by addition nanoparticles is one effective ways enhance properties. In this paper, recent research progress on reviewed summarizing relevant results in representative ones Sn-Ag-Cu (SAC), Sn-Bi, other multielement alloys. Specifically speaking, effect added evolution wettability, microstructure...
In this paper, the intermetallic compound (IMC) growth behaviors of Sn/Cu and Sn–0.6SiC/Cu solder under isothermal aging (50, 100, 150, 200 250 h) thermal cycling (300, 600, 900, 1200 1500 cycles) were studied. The results manifested that IMC layer got thicker in as time or cycles increased, but thickness Sn incorporated with silicon carbide nanowires (SiC NWs) was smaller than same condition. According to adsorption theory, SiC NWs would adsorb on grains then reduce surface tension IMC,...
In order to address the issues of excessive brittle intermetallic compounds (IMC) formation in TC4 brazed joints, two types novel Ti-Zr-Cu-Ni-Sn amorphous braze fillers were designed. The microstructure and shear strength TC4/Ti-Zr-Ni-Cu-Sn/TC4 joints studied by scanning electron microscopy (SEM), transmission (TEM), X-ray diffractometer (XRD) electronic universal materials testing machine. results show that optimized Ti
This study aims to provide a new process improve the welding performance of steel/magnesium dissimilar materials, using an ultrasonic-laser welding-brazing method joints AZ31B magnesium alloy on 304 stainless steel. The relationship between laser power, Ni-plating and element distribution, microstructure, mechanical properties welded was studied, formation mechanism interface zone joint analyzed. research results indicate that best effect is achieved when power 2000 W, minimum wetting angle...
This study analyzes the influence of different ultrasonic amplitudes on microstructure composition, microhardness, tensile strength, and corrosion resistance Al alloy/steel laser welding-brazing joints assisted by vibration. The application vibration did not change composition but refined them. were all composed θ-Fe(Al, Si)3 τ5-Al7.2Fe1.8Si formed at interface reaction zone, as well an α-Al solid solution Al-Si eutectic phase generated in weld seam zone. Meanwhile, thickness IMCs decreased...
Abstract In this article, environmental friendly BAg25Cu40Zn34Sn (BAg-25) and BAg30Cu37Zn32Sn (BAg-30) flux-core solder metal capable of facilitating automatic production brazing manufacturing processes were prepared. The butt lap induction tests carried out on the substrate with BAg-25 BAg-30. Wettability, microstructure mechanical properties solders base studied by field emission scanning electron microscope (SEM-EDS), backscattering diffraction (EBSD), tensile testing machine...
As a novel high-temperature solder with suitable eutectic temperature and excellent solderability, Au–30Ga alloy shows high application potential as packaging material for high-power devices. In this work, the evolution of microstructure, shear strength fracture mechanism Au–30Ga/Ni joint during soldering aging was studied. It found that increase time, Ga seriously consumed to form Ga–Ni interfacial intermetallic compounds (IMCs), resulting in formation Ga-poor region near interface layer....
Purpose The purpose of this paper is to improve the properties Sn−9Zn solder, so as meet requirements industrial applications. Design/methodology/approach effects Praseodymium on property and Sn whisker growth under aging treatment in lead‐free solder were investigated. Findings results indicate that with addition rare earth Pr, wettability mechanical improved. best comprehensive soldered joint obtained when content Pr 0.08 wt.%. After at 150°C for 360 h, Sn−9Zn−0.08Pr decreased but are...
Frictional vibration often occurs during sliding, commonly referred to as the stick-slip phenomenon. It is more likely occur in range of Stribeck curve, where friction and velocity have negative gradient characteristics. In this study, ultrasonic applied metal/metal sliding pair which reduce both static kinetic forces. The inhibition mechanism on phenomenon investigated for a moving at low velocities (0.05–1.0 mm/s) under condition dry oil lubrication. Under friction, reduces slider's force...
Purpose This paper aims to investigate the improvement of Sn58Bi solder properties by Ni nanoparticle provide theoretical support in field electronic packaging. Design/methodology/approach In this study, nickel nanoparticles (Ni NPs) were doped into as a reinforcing agent prepare composite solder. The wettability solder, melting characteristics alloy, microstructure joints, mechanical and intermetallics growth at interface investigated. Findings Test results show that had little substantial...
Zn-2 wt%Al alloy with micro-addition of Ag (0–1.5 wt%) was fabricated into as-cast and wire-shaped. The effect addition on microstructures investigated through SEM/EDS, XRD DSC technology. Then the damp-heat corrosion experiment carried out wire-shaped alloy. And influence characteristics further studied XRD, hardness test weighting method. results showed that coarsened both primary η-Zn dendrites eutectic lamellar β-ZnAl in Furthermore, during plastic deformation process to obtain alloy,...