This paper establishes a widely applicable method for designing hollow-core anti-resonant fiber (HC-ARF) model based on geometric principles, which is feasible under practical manufacturing conditions and defined by concise equations. We define this problem as combinatorial optimization issue the constraints of mixed integer nonlinearity. iteratively refine solution space through multiple steps, culminating in an integrated algorithm automated modeling computation data extraction. Through...

Purpose The purpose of this study is to delve into the mechanism Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for expeditious design and practical implementation innovative lead-free solder materials electronic packaging industry. Design/methodology/approach This investigates effect adding Si 3 N 4 NWs Sn58Bi various mass fractions (0, 0.1, 0.2, 0.4, 0.6 0.8 Wt.%) modifying joining Cu substrate. Meanwhile, melting characteristics wettability as well...

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Steel/aluminum welded joints are prone to the formation of brittle intermetallic compounds (IMCs), which significantly affect mechanical performance joints. In this study, isothermal aging process was used simulate prolonged heating chassis welds during automotive operation. A comparative analysis conducted investigate evolution IMCs at aluminum interface two types steel/aluminum joints, with and without nano TiC, under different treatment times. Mechanical tests were also on The results...

In this research, (111) oriented nanotwinned Cu (nt-Cu) substrates, combined with vacuum soldering, were utilized to enhance the strength and reliability of solder joints. The wettability composite Sn1.0Ag0.5Cu-Si3N4 (SAC105-Si3N4) was improved on nt-Cu substrates oxidization molten avoided by environment, ensuring formation regular uniform characterized their low surface energy, are demonstrated be highly efficient in restricting growth interfacial IMCs, effects becomes particularly...

Subspace leakage is a problem frequently encountered in many real-world multidimensional array space time adaptive processing (STAP). It leads to effective rank of clutter increased and spectral spread, which seriously impacts on the performance suppression STAP. We consider that polarization information combined spatial Doppler can improve subspace environments. New exploited rejection enhance output signal-to-clutter-plus-noise ratio (SCNR). The polarization-space-time joint domain...

In order to achieve low-temperature bonding and high-temperature service, Cu/Sn/Cu Cu/Sn-0.6SiC/Cu structure were fabricated by transient liquid phase (TLP) bonding, the microstructure evolution of intermetallic compound (IMC) mechanical performance TLP solder joints investigated. The results demonstrated that scalloped Cu6Sn5 IMC lamellar Cu3Sn formed at Sn/Cu interface gradually grew up in both as time increased. asymmetrical growth on sides interface, whereas interfacial rate was smaller...

In this study, highly reactive Ti nanoparticles (Ti NPs) were added to a low-silver Sn-1.0Ag-0.5Cu (SAC105) solder. The thermal, microstructural, interfacial, wettability, and mechanical properties of SAC105-xTi NPs (x = 0, 0.1, 0.2, 0.3, 0.4, 0.5 wt%) solder investigated. results showed that the addition had little effect on melting point range SAC105 alloy. alloy with 0.2 wt% has lowest coefficient thermal expansion (CTE), SAC105-0.4 contact angle. However, surface joint is deteriorated by...

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This study investigated the influence of three ultrasonic-assisted soldering process parameters, namely temperature, ultrasonic duration, and power, on strength Cu/Sn58Bi-0.4Mg/Cu solder joints. A three-factor, three-level orthogonal experiment was conducted by us using an L9 (34) design, research outcome evaluated in terms joints shear strength. The optimal experimental design determined through range analysis, Analysis Variance (ANOVA) performed to assess individual impacts each factor...

This study incorporated activated Ti nanoparticles (Ti NPs) into Sn1.0Ag0.5Cu (SAC105) solder for vacuum soldering with Cu substrates. The wettability, microstructure, interfacial, and mechanical properties of SAC105-xTi (x = 0.1, 0.2, 0.3, 0.4, 0.5 wt%) composite were systematically investigated. results showed that adding NPs improved the wettability SAC105 solder, in which wetting angle SAC105-0.3Ti was 19.51°. Additionally, helped to refine microstructure inhibited growth interfacial...

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Foam Ni has promising application prospects as a reinforcing phase due to its unique three-dimensional (3D) continuous structure. In the present study, SAC105 and SAC105-0.3Ti solders were introduced into foam carriers. Different types of solder interconnected with Cu substrate by vacuum thermal-compression bonding form Cu/SAC105/Cu (SAC), Cu/SAC105-0.3Ti/Cu (SACT), Cu/SAC105-Ni/Cu (SACN), Cu/SAC105-0.3Ti-Ni/Cu (SACTN) joints. It was found that SAC joints could bridge interfacial IMC layer...

In this paper, SiC nanowires (NWs) were added to the SAC105 solder as an enhancement agent. By mechanical stirring, Sn1.0Ag0.5Cu (SAC105)-xSiC (x=0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) solders prepared and served samples investigate thermal properties, wettability, microstructure, interfacial properties. It was found that addition of 0.4% NWs allowed a substantial increase in spreading area. The Cu6Sn5 IMC Ag3Sn IMC, β-Sn grains significantly refined within SAC105-0.6SiC matrix. Meanwhile,...

The reaction between Sn and metal substrate can form intermetallic compounds (IMCs) to realize the metallurgical interconnection in electronic packaging, however, little is known about formation growth of nanoscale IMCs. In this paper, we have fabricated Sn/Cu Sn-0.1AlN/Cu structure using laser soldering under different power (200W, 225W, 250 W) heating time (2s, 3s, 4 s). results show clearly that nano-Cu6Sn5 films feasible (200w 2s) with system, thickness five hundred nanometers grains...

In the present study, Si3N4 nanowires (NWs) with a mass fraction of 0.6 wt% were incorporated into Sn1.0Ag0.5 (SAC105) solder. Cu/SAC105/Cu and Cu/SAC105-Si3N4/Cu 3D structure joints constructed by transient liquid-phase (TLP) bonding. The interfacial IMC growth enhancement mechanism joint properties examined comparing evolution interfaces mechanical characteristics solder before after NWs doping. It was found that Cu3Sn layer thickness containing thinner than undoped ones at any given time....

In the present study, Si3N4 nanowires (NWs) with a mass fraction of 0.6 wt% were incorporated into Sn1.0Ag0.5 (SAC105) solder. Cu/SAC105/Cu and Cu/SAC105-Si3N4/Cu 3D structure joints constructed by transient liquid-phase (TLP) bonding. To investigate influence mechanism NWs, interfacial IMC evolution mechanical properties two solder analyzed. It was found that Cu3Sn layer thickness containing NWs thinner than undoped ones at any given time. The growth Cu6Sn5 inhibited, resulting in retarded...

Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05AlN/Cu were prepared by transient liquid-phase bonding (TLP) process for low temperature high service. The evolution of interfacial IMC the influence mechanism AlN on TLP solder joints studied. During process, top bottom IMCs show asymmetric growth. With increase time, Cu6Sn5 Cu3Sn in two continue to grow, finally complete morphology can be formed, which is more less. In addition, calculating growth rate IMC, it was found that at both ends three-dimensional...

In this study, Si3N4 nanowires (NWs) with ceramic properties were incorporated into Sn1.0Ag0.5Cu (SAC105) solder to enhance its overall performance. The thermal properties, spreading behavior, microstructure, interface, and mechanical of SAC105-xSi3N4 (x=0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) solders systematically investigated. research revealed that doping NWs SAC105 could expand melting range decrease undercooling. Notably, the alloy containing 0.6 wt% had lowest expansion coefficient (CTE),...

In this study, the Sn58Bi-xMg (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0) composite solders were synthesized to explore impact of Mg particles. The study examined wettability, thermal properties, mechanical microstructure, and growth interfacial IMC (intermetallic compound) solder. Experimental results showed that adding particles had no significant on melting point Sn58Bi However, increasing content increased undercooling Moreover, incorporation resulted in a consistent rise coefficient expansion...