- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Multilevel Inverters and Converters
- Advanced DC-DC Converters
- Heat Transfer and Optimization
- Electrostatic Discharge in Electronics
- Heat Transfer and Boiling Studies
- Acoustic Wave Resonator Technologies
- High voltage insulation and dielectric phenomena
- Thermal properties of materials
- Radio Frequency Integrated Circuit Design
- Induction Heating and Inverter Technology
- Refrigeration and Air Conditioning Technologies
- Power Line Communications and Noise
- Gas Sensing Nanomaterials and Sensors
- Electromagnetic Compatibility and Measurements
- Heat Transfer Mechanisms
- GaN-based semiconductor devices and materials
- Adhesion, Friction, and Surface Interactions
- Microwave Engineering and Waveguides
- Advanced Chemical Sensor Technologies
- Electric Motor Design and Analysis
- Building Energy and Comfort Optimization
- Advanced Aircraft Design and Technologies
- Thermal Radiation and Cooling Technologies
Iowa State University
2025
University of Arkansas at Fayetteville
2018-2024
Tiandi Science & Technology (China)
2021-2024
China Southern Power Grid (China)
2023
Hefei University of Technology
2023
Institute of Electronics
2022
Stony Brook University
2022
Henkel (United States)
2020
Guangxi Special Equipment Inspection Institute
2019
Huazhong University of Science and Technology
2019
Emerging applications of compact high-voltage SiC modules pose strong challenges in the module package insulation design. Such insulations are subjected to both dc and pulsewidth modulation (PWM) excitations between different terminals during switching intervals. High <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dV/dt</i> strongly interferes with partial discharge (PD) testing as it is hard distinguish PD pulses PWM excitation-induced...
The electric propulsion drives for the more-electric aircraft need lightweight and high-efficiency power converters. Moreover, a modular approach to construction of drive ensures reduced costs, reliability, ease maintenance. In this article, design fabrication procedure dc-ac three-level t-type single phase-leg electronics building block (PEBB) rated 100-kW, 1-kV dc-link is reported first time. A hybrid switch (HyS) consisting silicon insulatedgate bipolar junction transistor (IGBT) carbide...
The silicon carbide (SiC) devices have faster switching speed than that of the conventional (Si) devices, which however may cause excessive device voltage overshoot. Larger gate resistance can help to restrain overshoot, it slows down and increases losses. There are other methods mitigate e.g., using low-inductance busbars, adding snubber circuits, etc. In this article, busbar design for a 250-kW SiC three-level T-type inverter is investigated. current commutation loops (CCLs) first analyzed...
This article focuses on providing the laminated busbar design guidance for a three-level T-type neutral-pointclamped (3L-TNPC) inverter to achieve low stray inductance and balanced distribution between paralleled power switches. As result, equalized dynamic current sharing can be accomplished. To discover strategy, this first derives mutual-inductance-decoupled equivalent circuit 3L-TNPC. Then, effects of each item switching performance unveiled, parametric targets are then summarized....
This paper presents a flexible radiofrequency filter with central frequency of 2.4 GHz based on film bulk acoustic wave resonators (FBARs). The consists five air-gap type FBARs, each comprised an aluminum nitride piezoelectric thin sandwiched between two thin-film electrodes. By transfer printing the inorganic structure from silicon wafer to ultrathin polyimide substrate, high electrical performance and mechanical flexibility are achieved. has peak insertion loss -1.14 dB, 3 dB bandwidth 107...
Offsite-tuning is a privacy-preserving method for tuning large language models (LLMs) by sharing lossy compressed emulator from the LLM owners with data downstream task tuning. This approach protects privacy of both model and owners. However, current offsite methods often suffer adaptation degradation, high computational costs, limited protection strength due to uniformly dropping layers or relying on expensive knowledge distillation. To address these issues, we propose ScaleOT, novel...
This paper compares different space vector modulation (SVM) strategies for neutral-point voltage balancing (NPVB) control in three-level (3-L) T-type neutral-point-clamped (TNPC) inverters, and proposes an improved SVM trimmed NPVB hybrid-switch-based 3-L TNPC inverter with the features of loss common-mode (CMV) reduction.The proposed strategy uses a new principle small selection sequence, thus, it can balance neutral point (NP) potential achieve soft-switching clamping leg...
This paper proposes a multi-objective design optimization methodology for power-electronics inverters with more electric aircraft applications, which orients the optimum point of both passive components and semiconductors between power density efficiency inverter system based on semi-physical mathematical models multi-level sub-optimization models. algorithm is demonstrated by designing 25 kW 2-level motor-drive showing superior performances than state-of-arts products.
This paper presents the design and evaluation of a phase-leg power electronic building block (PEBB) with 150-kVA rated by using 3-level T-type neutral-point-clamped (3L-TNPC) inverter for high-speed motor drives. Model-based pre-design evaluations module selections are first introduced to evaluate feasibility improve efficiency. Based on selected modules, novel busbar structure is proposed stray inductance 11.2 nH. Besides these, non-metallic cold plate designed evaluated. It shows less...
Three-level (3L) inverters suffer from higher parasitic inductance due to the increased number of series-connected switches in a single current commutation loop (CCL) results larger size CCL compared their two-level (2L) counterparts. As such, semiconductors are subjected voltage stress and severe ringing at switching transient. While silicon carbide's (SiC) faster speed improves overall efficiency by reducing loss, voltage, gradient (dv/dt di/dt) generate electromagnetic interference (EMI)...
This article proposes an insulation design strategy of laminated busbar to avoid partial discharge (PD) in more-electric aircraft (MEA) applications. During high-altitude operation, the converters for MEA are exposed low air pressure, making being triggered easier. But blindly increasing results excessive parasitic inductance and degraded switching performance, which lead serve losses electromagnetic interference (EMI) problems during high-frequency operations. targets this issue conducts a...
This paper comprehensively evaluates three space-vector-modulation (SVM) schemes on a novel three-phase hybrid-switch-based 3-level T-type neutral-point-clamped (3L-TNPC) inverter, regarding switching loss, neutral point balancing and EMI spectrum. The loss analysis based the double-pulse test (DPT) are completed, revealing characters of each switch in 3L-TNPC. Based characters, kinds SVMs proposed, analyzed compared. optimal SVM is then selected comparison.
Conventional passive EMI filters are bulky and occupy up to 30% of converter volume weight. Active a key technology that enables the reduction components in filter. The effectiveness traditional active filter for is limited by additional overhead from noise sensing compensation ensure stability. In this article, novel proposed demonstrated differential mode attenuation. consists twin circuit made low voltage/current mimic high-power main circuit. Unlike conventional filter, uses networks...
Silicon carbide (SiC) power devices possess many beneficial properties for electronics applications, but commercial 62-mm SiC module packages with the direct drop-in replacement of Si limit benefits these devices. To fully utilize advantages devices, this article presents a low-profile and high density packaging solution 1200-V/300-A enhanced electrical thermal performance. The design optimizations on layout, chip placement, terminal structure are compatible conventional fabrication...
This paper presents an improved model to demonstrate the effect of parasitic inductance and temperature on switching behavior silicon carbide MOSFET offer a reference power module design. The trans-conductance capacitance non-linearity are also considered based numerical calculation method. static dynamic testing DBC bare die with changeable is designed processed. experiment shows high accuracy.
In view of the importance electromagnetic compatibility (EMC), universities worldwide are paying more attention to training electronic engineers with good EMC design knowledge. As part training, a practical printed circuit board (PCB) layout project has been offered as an elective undergraduates in authors' universities. The requires students PCB standard digital twice, first time no consideration at all, and second careful consideration. significant difference levels radiated emissions two...
Three-level inverters suffer from higher parasitic inductance due to the increased number of series-connected power switches in a single current commutation loop (CCL) and geometrically larger size CCL with compared their 2 level counterparts. As such semiconductors are subjected voltage stress severe ringing at switching transient. To solve this problem, an optimized 3-level T-type NPC module has been proposed hybrid combination switch (SiC MOSFET + Si IGBT) rated for 1200V/180A. A step by...
This paper presents an experimental study on the parameters that determine thermal performance of sintered copper wicks with longitudinal micro grooves for heat pipe applications. The grooves, which provide passages to vent vapor, have a width in range from 150 μm 500 μm. powder used here has nominal diameter 50 μm, produces effective pore radius approximately 13 main composed pores and present characteristics bi-dispersed wick structures. Unlike traditional structures, grooved structures...
With the advent of wide-bandgap devices, it has become possible to switch at a faster rate (on and off) along with higher switching frequencies. This results in attaining power density, smaller filter size, lighter weight for converter. But bottleneck taking advantage these ultra-fast devices is spurious behavior during operation due cross talk electromagnetic interference inheriting from dv/dt di/dt. To meet standard ensure robust operation, EMI place time being; mostly conducted emission...
Partial discharge (PD) issue of high voltage power module packaging insulation is increasingly critical due to the development wide bandgap modules towards density, which leads smaller packages and higher operating voltages. However, existing standards for focus on PD measurement under sinusoidal waveform rather than actual DC or square that poses electric stress insulation, thus cannot fully represent phenomenon in electronics systems. To bridge this gap, paper introduces a testing platform...
The conventional refrigerants have considerable ozone depleting effect (CFC/HCFC) and global warming impact (HFC). Carbon Dioxide (CO2) is being investigated as an alternative refrigerant for vapor compression systems. In addition to its environmental benefits, offers certain attractive thermal characteristics such small surface tension, liquid viscosity large capacity. Furthermore, when used with micro channels CO2 heat exchangers provide additional advantage of high compaction, low...