Takahiro Nakayama

ORCID: 0000-0001-8114-7618
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About
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Research Areas
  • Advanced Sensor and Energy Harvesting Materials
  • Advancements in Photolithography Techniques
  • Tactile and Sensory Interactions
  • Advanced MEMS and NEMS Technologies
  • Neuroscience and Neural Engineering
  • Semiconductor materials and devices
  • Nanofabrication and Lithography Techniques
  • Advanced Data Compression Techniques
  • Integrated Circuits and Semiconductor Failure Analysis
  • Photonic and Optical Devices
  • Force Microscopy Techniques and Applications
  • Organic Light-Emitting Diodes Research
  • Structural Health Monitoring Techniques
  • Electron and X-Ray Spectroscopy Techniques
  • Semiconductor Lasers and Optical Devices
  • Spatial Neglect and Hemispheric Dysfunction
  • Image and Signal Denoising Methods
  • Advancements in Semiconductor Devices and Circuit Design
  • Advanced Image Processing Techniques
  • Electrical and Thermal Properties of Materials
  • CCD and CMOS Imaging Sensors
  • Molecular Junctions and Nanostructures
  • Luminescence Properties of Advanced Materials
  • Modular Robots and Swarm Intelligence
  • Superconducting Materials and Applications

Chugoku Central Hospital
2024

Canon (Japan)
2009-2022

The University of Tokyo
1994-2022

Toyota Motor Corporation (Japan)
2012-2022

Osaka University
2004-2019

Hiroshima University
2017

Toyota Motor Corporation (Switzerland)
2011-2016

Shonan Institute of Technology
2015

Chiba University
2014

Nihon University
2010-2011

Luminescent spectra of organic thin films sandwiched with two mirrors were measured in an effort to detect optical microcavity effects. Narrowing and enhancement photoluminescent observed from the tri-(8-hydroxyquinolinol)aluminum monolayer at both sides. Furthermore, narrowing was also electroluminescent devices fabricated mirrors.

10.1063/1.109959 article EN Applied Physics Letters 1993-08-02

The spectral linewidth of distributed feedback (DFB) laser diodes is theoretically studied. Numerical calculation shows that DFB lasers with long cavity lengths and large coupling coefficients have very narrow less than 1 MHz, effects the phase shift mirror facets on characteristics are also analyzed, It shown phase-shifter further narrows lasers. Its numerical result physical meaning shown.

10.1109/jlt.1985.1074295 article EN Journal of Lightwave Technology 1985-10-01

Patients with left unilateral spatial neglect following lesions that mainly involved the right parietal lobe performed a line extension task, extending horizontal leftward to double its original length. We examined performances in and hemispaces, as well midline, assess whether conditions affected these performances. Whatever severity of found bisection test, patients were almost accurate comparable those normal controls across three conditions. The executed movements or toward...

10.1212/wnl.44.2.294 article EN Neurology 1994-02-01

This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on bus line. The integrates flip-bonded complementary metal-oxide semiconductor (CMOS) with sensing circuits low temperature cofired ceramic (LTCC) interposer Au through vias by Au-Au thermo-compression bonding. CMOS circuit and bonding pads the backside were electrically connected bumps LTCC interposer, gap was formed an sealing frame. A diaphragm for force in substrate. dimensions of...

10.3390/s17112451 article EN cc-by Sensors 2017-10-25

Robot tactile sensation can enhance human–robot communication in terms of safety, reliability and accuracy. The final goal our project is to widely cover a robot body with large number sensors, which has significant advantages such as accurate object recognition, high sensitivity redundancy. In this study, we developed multi-sensor system dedicated Complementary Metal-Oxide-Semiconductor (CMOS) Large-Scale Integration (LSI) circuit chips (referred “sensor platform LSI”) framework serial...

10.3390/s17091974 article EN cc-by Sensors 2017-08-28

Covering a whole surface of robot with tiny sensors which can measure local pressure and transmit the data through network is an ideal solution to give artificial skin robots improve capability action safety. The crucial technological barrier package force sensor communication function in small volume. In this paper, we propose novel device structure based on wafer bonding technology integrate capacitive using silicon diaphragm integrated circuit separately manufactured. Unique fabrication...

10.3390/s18072374 article EN cc-by Sensors 2018-07-21

A new blind oversampling clock and data recovery (BO-CDR) algorithm is proposed. It has high tolerance to low-frequency jitter (14.8 unit intervals at 10 kHz, measured 640 Mbps) suitable for systems where the receiver drift with respect transmission. The capable of recovering over a wide tracking range or when precise rate (β) not known priori, any real-valued rate, β ≥ 3, making this BO-CDR first require integer-valued β. To demonstrate utility algorithm, two implementations are designed...

10.1109/iscas.2015.7168954 article EN 2022 IEEE International Symposium on Circuits and Systems (ISCAS) 2015-05-01

This paper describes a wafer bonding process using 50 µm thick benzocyclobutene (BCB) layer which has vias and metal electrodes. The were fabricated by molding BCB glass mold. During the molding, worm-like voids grew between mold due to shrinkage of polymerizing BCB. They completely removed subsequent reflowing in N2. After patterning Al on reflowed for electrodes via connections, with substrate was performed. Voidless without damage achieved. Through process, control polymerization degree...

10.1088/0960-1317/21/8/085002 article EN Journal of Micromechanics and Microengineering 2011-06-27

A bus-connected tactile sensor system composed of MEMS-CMOS integrated force sensors was developed. capacitance-to-digital convertor for sensing, a data reduction processor and serial bus communication controller are implemented by laboratory-designed ASIC (Application Specific Integrated Circuit). These functions enable the to be connected with cable, autonomously transmit sensing using CSMA (Carrier Sense Multiple Access) protocol. By applying novel integration technology, can directly...

10.1109/transducers.2013.6627370 article EN 2013-06-01

This paper reports a fully-integrated, small-footprint fingertip sensor, which allows robots to have 3-axis tactile and thermal sensation. The capacitive force sensor is integrated with our original platform CMOS-LSI (sensor LSI) including diode-based temperature sensor. LSI offers flexible configurability, the sensitivity sample rate were configured for this application. materials of objects successfully identified by measuring change under control contact force. Fitting theoretical model...

10.1109/transducers.2017.7994099 article EN 2017-06-01

This paper reports a 3-axis MEMS-CMOS integrated tactile sensor for surface-mounting on flexible bus line. uses bran-new CMOS LSI with capacitive sensing circuit and other extended functionalities (e.g. configurability robust clock data recovery algorithm). The is composed of flip-bonded substrate diaphragm special low temperature co-fired ceramics (LTCC) vias. These substrates are electrically mechanically connected by Au-Au bonding, forming sealed differential gaps. completed outputs coded...

10.1109/memsys.2016.7421763 article EN 2016-01-01

This work attempts to optimize stents that are implanted at the neck of coronary or cerebral aneurysms effect a flow diversion. A two-dimensional version stent, which is series struts and gaps placed neck, considered as first step. Optimization carried out based on principles exploration design space using reductions in velocity vorticity aneurysm dome objective functions. Latin hypercube sampling develops 30–60 samples strut-gap arrangement. Flow past an with each these computed commercial...

10.1115/1.4001861 article EN Journal of Medical Devices 2010-06-01

This paper presents a novel SOI capacitive tactile sensor with quad-seesaw electrode for 3-axis complete differential detection, which enables integration CMOS. For differentially detecting forces, the is composed of four rotating plates individually suspended by torsion beams. In this study, to demonstrate working principle, we fabricated test device that integrates an substrate and anodically bondable LTCC fixed electrodes as alternative The experimental results successfully demonstrated...

10.1109/memsys.2014.6765739 article EN 2014-01-01

The environmental embrittlement of Ni3(Si, Ti) single crystals is investigated as functions media, strain rate, temperature and crystal orientation. shown to occur in air, water hydrogen gas, be limited ambient temperatures. Also, it found that the very sensitive rate decreasing elongation with little affected by boron doping. In response from environment, tensile fracture stress are reduced mode primarily changes {111} cracking ridge patterns (or dimple patterns) {001} a river pattern. It...

10.2320/matertrans1989.34.775 article EN Materials Transactions JIM 1993-01-01

An all-fibre gyroscope using a depolarised superluminescent diode which has coherence length of 8 μm and degree polarisation 0.03 is constructed. Although the configuration very simple fibre as short 200 m, drift detection limits are less than 14 deg/h 1.5 deg/h, respectively.

10.1049/el:19860372 article EN Electronics Letters 1986-05-08

It is very important to mitigate oxidation of multilayer mirrors (MLMs) and carbon deposition onto MLMs extend the lifetime EUV exposure tool. In order estimate lifetime, we have figure out scaling law. Previous results at EUVA shown that rate on not proportional every hydrocarbon partial pressure intensity<sup>3-4</sup>. this study focused Si-capped mirror. We made experiments irradiation using two different apparatuses. One connected a beamline (SBL-2) synchrotron radiation facility...

10.1117/12.813587 article EN Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE 2009-03-13

This study has opened a possibility to fabricate through silicon vias (TSV) in LSI wafer available by commercial multi-project (MPW) service and integrate the MEMS bonding. 300 μm deep Cu annular type TSV were fabricated TSMC 0.18 CMOS MPW cut into 4" diameter. The developed process managed mechanically fragile property of laser-ablated low stress TEOS PECVD SiO2 backfilling, surface planarization, temporally support etc. integrated Au-Au thermocompression bonding at 300°C, completed device...

10.1109/memsys.2017.7863515 article EN 2017-01-01

We present a novel non-stochastic method for optimizing the shapes of ferromagnetic materials to generate target static magnetic field. A magnetizing current corresponding an error field is calculated as inverse problem and then replaced with equivalent material. Iteration this process leads almost zero. It should be noted that initial condition material shape critical convergence. Consequently, we propose combined method: generated stochastic optimization algorithm, updated using explicit...

10.1109/tasc.2009.2018104 article EN IEEE Transactions on Applied Superconductivity 2009-06-01
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