The 3-D integration helps improve performance and density of electronic systems. However, since electrical thermal for is related to each other, their codesign required. Machine learning, a promising approach in artificial intelligence, has recently shown promise addressing engineering optimization problems. In this paper, we apply machine learning the integrated systems where need be analyzed together maximizing performance. such systems, modeling can challenging due multiscale geometries...

Wireless power transfer (WPT) technology has recently emerged as an innovative and promising technology, its electromagnetic compatibility (EMC) become a significant issue. In this study, we investigated the (EM) radiated emission interference generated by WPT systems using resonant magnetic field coupling, especially in applications with multi-coil configurations. The change coil resonance associated configurations was analyzed via impedance profile. We measured EM results respect to...

In this paper, we present the analytical expressions of resonant peaks input impedance and frequencies maximum transferred power in wireless transfer systems case tight magnetic coupling. The predict source where is both cases constant AC voltage current source. We prove that coincide with at which maximized for test vehicles coupled rectangular coils are simulated 3D EM solver fabricated on printed circuit boards. Experimentally, it verified changes systems, its relationship their...

Coaxial through silicon via (TSV) technique allows reduction of high frequency loss due to conductivity in substrate and flexibility impedance by controlling the ratio shield center radii. For first time, we measured analyzed high-speed channel performance coaxial TSV. This letter presents measurement results fabricated test vehicle S-parameter eye-diagram. The eye-diagram prove that TSV is capable supporting signal transmission up bit rate 30 Gbps. equivalent circuit model suggested...

As technology develops, the number of chips increases while thickness mobile products continuously decreases, which leads to need for high-density packaging techniques with high numbers power and signal lines. By applying wireless transfer at printed circuit board (PCB) package levels, pins can be greatly reduced produce more space other components in system. For first time, this paper, we propose demonstrate a high-efficiency PCB- package-level interconnection scheme. We enhance efficiency...

In this paper, a model of power supply noise (PSN) effects on an analog-to-digital converter (ADC) in hierarchical structure is proposed. The ADC performance determined by not only on-chip characteristics but also off-chip characteristics. Therefore, chip-package-printed circuit board (PCB) coanalysis and comodeling are required to accurately evaluate the ADC. We propose comodel which allows estimation analysis PSN including characteristic. proposed includes three separate submodels:...

Multiple digital ICs sharing ground plane have potential problems of noise interference to each other. Current distribution on the can introduce intra-system EMC issues, which possibly result in receiver desensitization issue wireless devices. In this paper, a method moment (MoM) based current reconstruction is proposed estimate plane. This requires phased resolved near field data for accurate reconstruction. The validated by numerical example. reconstructed from compared with simulation...

Meshed power and ground planes are commonly used in today's flexible printed circuit board (PCB). In this paper, a methodology to extract the effective characteristic impedance as well per-unit-length parameters of transmission line with meshed reference plane is proposed based on an equivalent model. The validity confirmed through comparison full-wave simulations.

This paper, for the first time, proposes a novel stochastic model-based eye-diagram estimation method 8B/10B and transition-minimized differential signaling (TMDS)-encoded high-speed channels. A model describes behavior of an encoder with respect to probability. The previous methods are based on assumption that each bit has same probability 1 s 0 s. However, limits estimate accurate encoded We propose apply two types encodings: TMDS. For verification, we design TMDS within MATLAB. transient...

A method of moment (MoM)-based current reconstruction is proposed to estimate the surface density on ground plane. Current continuity property automatically enforced with Rao-Wilton-Glisson basis function. Both least square and optimization are utilized solve inverse problem obtain current. The successfully validated numeric simulations also a real-world measurement example. reconstructed distribution plane further used in typical radio frequency interference (RFI) example perform RFI...

Wireless power transfer technologies have been studied steadily and reached the stage of practical use in recent years. As commercialized research on wireless performed, system utilizing repeating-coil attempted. Then, electromagnetic radiated emissions become an important issue. In this paper, we report measurement analysis from using a resonant magnetic field. A relationship between resonance transferred are analyzed with respect to impedance profile obtained analytical expressions,...

In this paper, we present measurement results of board-to-board wireless power transfer (WPT) for low voltage applications using resonant coupling. WPT system consists source coil, receiver rectifier and load on printed circuit board (PCB). Among them, spiral coil is expressed as a simple equivalent circuit, which the components are calculated its physical configurations. The result in frequency-domain shows good correlation with simulation circuit. addition, CMOS full bridge turn-on...

In this paper, we present the analysis of electromagnetic interference (EMI) shielding effects wireless power transfer (WPT) using magnetic resonance coupling for board-to-board level interconnection. Board-to-board WPT consists source coil, receiver and load which are manufactured on printed circuit board (PCB). The coil is expressed as a simple equivalent model, components calculated physical dimensions coil. It verified that results model estimation in both frequency- time-domain show...

Analog-to-digital converter (ADC) is becoming of utmost importance in an automotive environment. With the increased number magnetic field sources near ADC that can alter its behaviors significantly, we need to model how affects performance ADC. Therefore, order accurately evaluate practical and considerable off-chip on-chip effects are highly complex, chip-printed circuit board (PCB) comodeling, cosimulation, coanalysis required. In this study, a comodel on proposed. The proposed includes...

In this paper, structural and electrical characteristic deviations of silicone rubber sockets are analyzed depending on external force based its lumped RLGC model. Electrical performances heavily depend compression rate the socket. Thus, study socket is needed for reliable tests. The an assumption simplified equivalent model For verification, a 3D electromagnetic (EM) simulation program used results compared with that proposed models in frequency domain. performance nearly identical to EM...

As a demand for electrical systems with wide data bandwidth has increased, high-performance packages ensuring high rates, such as low power double rate series, have become common. The need test sockets also emerged to these packages. However, conventional pogo pin socket limited due the parasitic components arising from its spring. On other hand, silicone rubber satisfies requirement because it high-density conductive metal powders in an elastic rubber. In this paper, we propose RLGC...

A simultaneous switching current (SSC) drawn by an integrated circuit (IC) creates noise on power nets, which in turn causes jitters the I/O signals and reduces maximum clock frequency. For a thorough analysis of high-speed ICs, there is dire need to measure currents at specific pins ICs. In this paper, novel magnetically coupled embedded probing structure proposed for measuring SSC chip level resulting from logical activity buffers. SSCs are found capturing magnetic flux induced interest,...

This paper, for the first time, proposes and verifies a new coaxial silicone rubber socket high-bandwidth high-density package test using fabricated sample. In addition, this paper also characterizes socket. Because of proposed socket's novel structure, successfully achieves electrical performance improvement. For verification, we compare previous noncoaxial in time domain. The has greater eye height width measured diagram than those Moreover, slope is improved case Therefore, shows...

In this study, magnetically coupled coil design for high efficiency wireless power transfer (WPT) in PCB-to-active silicon (Si) interposer is proposed and analyzed using Z-parameter analysis. For strong magnetic coupling between transmitter (Tx) on PCB receiver (Rx) Si-interposer, each structure selected considering process dimension difference Si-interposer. The equivalent circuit models Tx Rx Si-interposer are suggested. Especially, the model includes lossy Si-substrate characteristics...

An analog-to-digital converter (ADC) is an essential device in mixed mode systems. The performance of the ADC, however, deteriorated by coupled power supply noises through hierarchical chip-PCB distributed networks (PDNs). In order to design a high-performance system, modeling and analysis noise effects on ADC are necessary, as circuit PDN structure multilayer PCB substrates. this paper, hybrid model proposed for ADC. combines two mechanisms. First, coupling ratio derived combined PDNs at...

In a near-field scanning system, each element of the measurement chain contributes to thermal noise power density: probe, cables, amplifiers, and measuring instrument. The signal-to-noise ratio (SNR) is strongly affected by source output impedance, temperature, lossy transmission lines between probe amplifier noise, gain. By minimizing loss using ultralow-noise amplifiers (noise figure (NF) <; 0.5 dB), SNR improves >10 dB, compared setup 1-m cable 3-dB NF amplifier. A resonant that cooled...

In this paper, we present the modeling of electromagnetic interference (EMI) shielding materials in wireless power transfer (WPT) for board-to-board level interconnections. The properties such as ferrite and metal can change equivalent circuit spiral coil. additional components due to presence material are expressed a simple model, which calculated using analytic equations. It is verified that results from model show good correlation with simulated results. other words, affects not only EMI...

Motivated by the abrupt miniaturization of mobile devices and demand for 3D-IC, Through Silicon Via (TSV) has been highlighted as key technology compactly integrating multiple dies various functions a whole system. With dramatic growth in number TSVs TSV-based need accurate detection TSV disconnection defects arose, to compensate instability fabrication processes. In this paper, we experimentally verify proposed contactless wafer-level connectivity testing structure using magnetic coupling...

For high-speed package testing, conductive rubber contactors become more and promising because of its excellent RF performance. electrical characteristic analysis the contactor, lumped equivalent circuit model contactor based on physical dimension structure is proposed verified with 3D field SPICE simulation.

We propose, for the first time, an explicit semiconductor physics-based through-silicon via (TSV) capacitance-voltage (CV) model. The effect of TSV CV hysteresis is demonstrated in model, and capacitance modeled with respect to dc bias voltage dimension TSV. proposed model verified by comparison measurement results. correlates well This can be utilized a circuit level simulation expand possible application to, but not limited hierarchical power distribution network impedance analysis, RC...