We propose a high-frequency scalable electrical model of through silicon via (TSV). The proposed includes not only the TSV, but also bump and redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. is developed with analytic <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RLGC</i> equations derived from physical configuration. Each equation as function design parameters bump, RDL,...

In a surveillance camera environment, the detection of standing-pigs in real-time is an important issue towards final goal 24-h tracking individual pigs. this study, we focus on depth-based with "moving noises", which appear every night commercial pig farm, but have not been reported yet. We first apply spatiotemporal interpolation technique to remove moving noises occurring depth images. Then, detect by utilizing undefined values around them. Our experimental results show that method...

Using high-speed through-silicon via (TSV) channels is a potential means of utilizing 3-D interconnections to realize considerable high-bandwidth throughput in vertically stacked and laterally distributed integrated circuits. However, although the TSV silicon interposer channel lead significant decrease interconnect length, received digital signal after transmission through still degraded at high data-rate due nonidealities channel. Therefore, an analysis integrity necessary. In this paper,...

Through silicon via (TSV)-based 3-D integrated circuit has introduced the solution to limitlessly growing demand on high system bandwidth, low power consumption, and small form factor of electronic devices. As design aims for higher performance, physical dimensions channels are continuously decreasing. With TSV diameter less than 10 μm pitch several tens micrometers, I/O count increased up order thousands wide bandwidth data transmission. However, without highly precise fabrication process,...

Software-Defined Networking (SDN) and Network Function Virtualization (NFV) are paradigms that help administrators to manage dynamic networks. While SDN allows centralized network control, NFV provides flexible scalable Virtual Functions (VNFs). These also enablers for concepts such as Service Chaining (SFC) where chains composed of several VNFs provide a specific service. However, in order maximize the benefits from above-mentioned flexibility, new research questions need be addressed,...

In this paper, we propose a model for 3-D stacked on-chip power distribution networks (PDNs) in through silicon via (TSV)-based memory ICs that includes the effects of power/ground TSVs (P/G TSVs), decoupling capacitors (on-chip decaps), and substrate. modeling procedure PDNs, distributed RLGC-lumped an PDN, including decaps substrate, is proposed. Additionally, P/G TSV pair introduced. The proposed PDN combines models PDNs with pairs hierarchical order segmentation method. are successfully...

In this paper, for the first time, we designed and analyzed channels between a graphic processing unit memory in silicon interposer 3-D stacked high bandwidth (HBM). We thoroughly verified electrical characteristics of considering various design parameters, such as channel width space, redistribution layer via, under bump metallurgy pads. particular, also considered meshed ground planes used proposed transmission lines, which are microstrip strip lines. Signal integrity (SI) was successfully...

This letter proposes a fast and precise high-speed channel modeling optimization technique based on machine learning algorithms. Resistance, inductance, conductance, capacitance (RLGC) matrices of are precisely modeled by design-of-experiment method artificial neural network. In addition, an optimal design, which achieves minimum loss crosstalk, is investigated within short time genetic algorithm. The performance the proposed validated simulations up to 20 GHz.

Tetracyclines (TCs) are the most widely used antibiotics for prevention and treatment of livestock diseases, but they toxic to humans have frequently been detected in water bodies. In this study, physical chemical properties zirconium-based metal organic framework (MOF) UiO-66 its NH2-functionalized congener UiO-66-NH2 were investigated along with batch TC adsorption tests determine effect functionalization on removal. removal was highest at pH 3 decreased increasing pH. Pseudo-1st...

Industrial wastewater typically contains both cationic and anionic heavy metals; therefore, their simultaneous removal must be considered to ensure environmental sustainability. Herein, nitrogen heteroatom (N) doped hydrochar derived from corncob was prepared via facile NH4Cl-aided hydrothermal carbonization used for the adsorption of divalent copper (Cu(II)) hexavalent chromium (Cr(VI)) in aqueous solutions. During carbonization, NH4Cl played a vital role as porogen N dopant, which...

In this paper, we propose models for large-sized silicon interposer power distribution networks (PDNs) and through via (TSV)-based stacked grid-type PDNs using a segmentation method. We model the as distributed scalable resistance (R), inductance (L), conductance (G), capacitance (C)-lumped an accurate estimation of PDN impedance, including wave phenomena such mode resonance at high end frequency range. For estimation, it is necessary to accurately all transmission line (TL) sections that...

Network softwarization paradigms such as SDN and NFV provide network operators with advantages in terms of scalability, cost resource efficiency, well flexibility. However, order to fully reap these benefits cope new challenges regarding the heterogeneity user demands an ever-growing service landscape, management operation networks requires a high degree automation that ensures fast proactive decision making. With recent success machine learning (ML) across numerous domains, shift from...

Coaxial through silicon via (TSV) technique allows reduction of high frequency loss due to conductivity in substrate and flexibility impedance by controlling the ratio shield center radii. For first time, we measured analyzed high-speed channel performance coaxial TSV. This letter presents measurement results fabricated test vehicle S-parameter eye-diagram. The eye-diagram prove that TSV is capable supporting signal transmission up bit rate 30 Gbps. equivalent circuit model suggested...

We investigated the activities of ionic-liquid-derived (by pyrolysis) nitrogen-doped carbon as electrocatalyst for two-electron oxygen reduction reaction (ORR) and regeneration divalent iron in electro-Fenton process, focusing on pyrolysis-temperature-dependent evolution doping structure. The results provided insight into catalytic activity a function pyrolysis temperature. On basis XPS N 1s analysis, temperature was optimized at 900 °C since pyridinic/graphitic structures which are known to...

A semiconductor industry has been encountered a memory bandwidth bottleneck toward high density and system. In order to overcome those limitations, 3D stacked (HBM) based on through silicon via (TSV) fine pitch interposer technology is lately introduced. By adopting this structure, thousands numbers of input/output (I/O) channels with can be integrated HBM which enables terabyte/s On the interposer, significant I/O are they tend operate at same time leads severe simultaneous switching noise...

In addition to providing network operators with benefits in terms of flexibility and cost efficiency, softwarization paradigms like SDN NFV are key enablers for the concept Service Function Chaining (SFC). The corresponding networks need support a wide range services applications highly dynamic temporal profiles heterogeneous demands. Hence, efficient management operation such requires high degree automation that is paired fast proactive decisions order cope these phenomena. particular,...

Automated pig monitoring is important for smart farms; thus, several deep-learning-based techniques have been proposed recently. In applying automated to real farms, however, practical issues such as detecting pigs from overexposed regions, caused by strong sunlight through a window, should be considered. Another issue in specific application the annotation cost data. this study, we propose method managing these two issues. Using annotated data obtained training images without first...

As total system bandwidth increased, memory industry has been imposed to satisfy its requirements. At last, innovative next generation named high (HBM) with extremely fine micro-bump pitch of bottom die is introduced for terabytes/s graphics module. To establish HBM based module, it becomes essential fabricate silicon interposer due capability process narrow signal width and space. Silicon the key solution mitigate bottleneck module computing system. design successfully, optimization...

Precise analytical models of power supply noise induced jitter (PSIJ) at inverter chains are proposed. Based on the piecewise linear approximated I-V curve model, local PSIJ transfer functions rising and falling edges derived. The total function an chain output is then estimated by alternately accumulating edges. several assumptions, full model significantly simplified, which provides physical insights chains. Accuracy proposed successfully validated SPICE simulations with 130 nm CMOS...

In addition to providing network operators with benefits in terms of flexibility and cost efficiency, softwarization paradigms like SDN NFV are key enablers for the concept Service Function Chaining (SFC). The corresponding networks need support a wide range services applications highly heterogeneous requirements that change dynamically during network's lifetime. Hence, efficient management operation such requires high degree automation is paired fast proactive decisions order cope these...

Software-defined networking (SDN) and the network function virtualization (NFV) led to great developments in software based control technology by decreasing expenditures. Service chaining (SFC) is an important find efficient paths servers process all of requested virtualized functions (VNF). However, SFC challenging since it has maintain high Quality (QoS) even for complicated situations. Although some works have been conducted such tasks with high-level intelligent models like deep neural...

The mixed-mode ABCD parameters are newly introduced and developed, where the definition connection carefully established to have both advantages of S-parameters parameters, simultaneously. In addition, closed-form equations model symmetric asymmetric coupled transmission lines derived. With derived equations, voltage transfer functions eye diagram a variety printed circuit board (PCB)-level differential interconnects analytically attainable, which greatly enhances their applicability for...