We propose a high-frequency scalable electrical model of through silicon via (TSV). The proposed includes not only the TSV, but also bump and redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. is developed with analytic <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RLGC</i> equations derived from physical configuration. Each equation as function design parameters bump, RDL,...

In this paper, we introduce a new high-resolution reflectometry technique that operates simultaneously in both the time and frequency domains. The approach rests upon time-frequency signal analysis utilizes chirp multiplied by Gaussian envelope. envelope provides localization, while allows one to excite system under test with swept sinewave covering band of interest. This latter capability is particular interest when testing communication cables systems. Sensitivity detecting reflected...

In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from TSV. It important estimate TSV transfer function and manage noise-tolerance budget in of reliable 3D-IC system. this paper, model proposed based on transmission line matrix method (3D-TLM). Using model, functions active can be precisely estimated complicated 3D structures, including TSVs, circuits, shielding structures such...

The Lunar Orbiter Laser Altimeter (LOLA) measures the backscattered energy of returning altimetric laser pulse at its wavelength 1064 nm, and these data are used to map reflectivity Moon zero-phase angle with a photometrically uniform set. Global maps have been produced 4 pixels per degree (about 8 kilometers equator) 2 resolution within 20 deg latitude each pole. geometry is insensitive lunar topography, so enable characterization subtle variations in albedo, even high latitudes where such...

In modern electronic products, the noise from high-speed digital parts is likely to interfere with nearby receivers, causing radio-frequency interference (RFI) issues. this paper, equivalent dipole-moment models and a decomposition method based on reciprocity theory are proposed being used together estimate coupling source victim antennas. The extracted near fields of by solving inverse problem. tangential electromagnetic Huygens's surface, which enclose antenna, can be calculated these...

High-sensitive field probes are highly desirable for radio-frequency (RF) interference studies, where ultralow noise levels of interest. By incorporating an LC resonant circuit in a differential-loop probe, together with Marchand balun, magnetic-field probe enhanced sensitivity is developed. Its equivalent model and design methodology established. The validated by measurements. measured relative terms |S <sub xmlns:mml="http://www.w3.org/1998/Math/MathML"...

A new approach is proposed for modeling electromagnetic emissions of a printed circuit board (PCB) based on amplitude-only near-field measurement data. Magnetic dipoles placed over the top layer PCB are introduced as equivalent actual radiated sources. restarted optimization procedure differential evolution algorithm developed to determine parameters (number, position, and moment components) via minimizing difference between measured magnetic near field that by dipoles. These can be used...

A near-field probe fabricated on a printed circuit board (PCB) with high sensitivity to electric fields is proposed. To achieve sensitivity, board-level edge plating technology employed realize copper patch replacing conventional pin-type electrodes. In addition, the further enhanced at specific frequency band based LC resonance. The proposed has been experimentally validated by measurements an application processor (AP) used in latest mobile phones enhancement of around 20 dB Global...

In this paper, we propose a coupling model between through silicon via (TSV) and substrate based on 3-Dimensional transmission line matrix (3D-TLM), which utilizes equivalent lumped circuit of TSV. The proposed is verified by S-parameter simulations using 3D field solver analyzed with various structural parameters: TSV diameter, distance noise source, height. Based the model, timing jitter degradation phase locked loop (PLL) caused investigated. A shielding technique guard ring structure...

Abstract We place upper limits on lunar olivine abundance using midinfrared (5–25 µm) data from the Lunar Reconnaissance Orbiter Diviner Radiometer Experiment (Diviner) along with effective emissivity spectra of mineral mixtures in a simulated environment. Olivine‐bearing, pyroxene‐poor lithologies have been identified surface visible‐near‐infrared (VNIR) observations. Since Kaguya Spectral Profiler (SP) VNIR survey olivine‐rich regions is most complete to date, we focus this work exposures...

Through silicon via (TSV) is a promising vertical interconnection method to achieve 3-dimensional integrated circuit (3D IC) system. However, high-speed digital signals suffer from severe distortions induced by TSV interconnects. In this paper, we propose equalizer using an ohmic contact on double-sided interposer reduce the inter-symbol interference (ISI) of interconnects in 3D IC

In this paper, we proposed an effective coil design for electromagnetic field (EMF) noise reduction from the wireless power transfer system by using quadruple coils in transmitter and receiver laptop computer application. By receiver, EMF was significantly reduced with negligible change induced voltage. 3D simulations distributions are shown pros cons of designs discussed.

In this letter, a channel loss equalization method based on time-domain inter-symbol interference (ISI) cancellation technique for passive interconnects is proposed. The proposed can be applied to conventional equalizer designs that intentionally suppress the low-frequency and dc components of responses compensate frequency-dependent losses. An R-L design composed surface mount inductors resistor was employed validation method. With method, it demonstrated ISIs were successfully removed with...

The mixed-mode ABCD parameters are newly introduced and developed, where the definition connection carefully established to have both advantages of S-parameters parameters, simultaneously. In addition, closed-form equations model symmetric asymmetric coupled transmission lines derived. With derived equations, voltage transfer functions eye diagram a variety printed circuit board (PCB)-level differential interconnects analytically attainable, which greatly enhances their applicability for...

In this letter, a radio-frequency interference (RFI) evaluation method for highly integrated mobile devices, such as smartphones and tablets, is proposed. A near-field specification noise-emitting components in devices developed based on emission measurements RF sensitivity of with the bit-error-rate (BER) test. To devise specification, derivative relation between strength noise sources system-level newly suggested using theoretical relationship signal to ratio probability error...

In this paper, a component-level electromagnetic interference (EMI) evaluation method for multifunctional mobile devices is suggested. The proposed based on the extraction of transfer function between and system-level radiated emissions. To demonstrate practical correlation near-field emission from components or modules far-field radiation systems, measurement-based functions are extracted by testing various phones integrating camera as target component. A specification EMI developed with...

A new hybrid modeling method is proposed for the chip-package co-modeling and co-analysis. This designed to investigate simultaneous switching noise (SSN) coupling paths effects on dc output voltage offset of operational amplifier (OpAmp). It combines an analytical model circuit with a power distributed network (PDN) interconnection models at chip package substrate. In order validate model, CMOS OpAmp was fabricated using TSMC 0.25 mum. Then measured by sweeping SSN frequency from 10 MHz up...

A compact wide-band passive equalization design using a stub with defected ground structure is proposed. The proposed design, based on reflections under slow wave effect, compensates for inter-symbol interference wide bandwidth, size, remarkable compensation capability few manufacturing limitations, and high flexibility, compared to previous design. Significant improvements in eye-opening timing jitter are successfully demonstrated data rate of 8 Gbps 60 cm transmission line printed circuit board.

We propose a closed-form analytic model for the newly presented passive equalizer using near-end crosstalk and reflections on printed circuit board (PCB). The proposed is developed by impulse response analysis Fourier transform. Based model, we design-optimization procedure equalizer, which achieves eye-opening maximization ISI minimization in order to maximize equalization performance reduce design cycle. In optimization procedure, maximized with parameter sweep peak distortion analysis,...

We propose a wide-band passive equalization method for high-speed serial chip-to-chip input/output channels using wave propagation, reflection, and coupling effects on tightly coupled transmission line structure. This design offers precise control of wideband low-power consumption as compared to previous active discrete equalizers. Significant improvements in timing jitter voltage margin are successfully demonstrated data rate 12.5 Gbps 40 cm long backplane printed circuit board.

In this work, we developed a sophisticated low-cost and wide-band passive equalization method for high-speed differential interconnects. The proposed was based on high-pass filter design using parasitics that exist in multi-layer printed circuit board (PCB) By employing the as components, offered performance compact area. A noticeable improvement timing jitter eye-opening equalizer demonstrated data rate of 20 Gbps.

This paper proposes a radio-frequency interference (RFI) evaluation method for flexible flat cables (FFCs), which are commonly employed high-speed signal transmission in modern mobile devices and become major path of noise coupling to antennas. The coupled from differential-mode common-mode signals flowing through FFCs is obtained terms transfer functions based on S-parameter measurement. Considering the source power driver IC main board sent FFCs, at antenna was calculated evaluate...

A design methodology has been proposed to reduce the undesired channel effects including both high frequency loss and resonance coupled from power/ground planes. FIR pre-emphasis filter was used, optimization of conducted in domain. The effect designed is also verified by time-domain simulations 2Gbps eye pattern. signal distortion significantly mitigated with applying filter.

In this paper, a simulation-based system-level conducted susceptibility (CS) testing method for wireless power transfer (WPT) system is proposed. The proposed employs 3-dimensional electromagnetic (3D EM) models as well equivalent circuit to replace the measurement-based CS based on International Electrotechnical Commission 61000-4-6 standard. conducted-noise source and equipment under test (EUT) are modeled in simulator. conduction path, bulk current injection probe, calibration jig using...