A5010026629- Advanced Surface Polishing Techniques
- Diamond and Carbon-based Materials Research
- Advanced machining processes and optimization
- Force Microscopy Techniques and Applications
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Metal and Thin Film Mechanics
- Copper Interconnects and Reliability
- Adhesion, Friction, and Surface Interactions
- Advanced Machining and Optimization Techniques
- Lubricants and Their Additives
- Tribology and Lubrication Engineering
- Surface Roughness and Optical Measurements
- Advanced materials and composites
- Gear and Bearing Dynamics Analysis
- Electrodeposition and Electroless Coatings
- Nanomaterials and Printing Technologies
- Non-Destructive Testing Techniques
- Fluid Dynamics and Thin Films
- 3D IC and TSV technologies
- Molecular Junctions and Nanostructures
- Advanced Measurement and Metrology Techniques
- Nanowire Synthesis and Applications
- ZnO doping and properties
- Ion-surface interactions and analysis
Tsinghua University
2016-2025
Hunan Normal University
2019-2024
Hunan Provincial People's Hospital
2019-2024
State Key Laboratory of Tribology
2007-2022
University of Science and Technology Beijing
2012-2014
Fudan University
2007-2012
Korea Research Institute of Chemical Technology
2007
University of Alaska Fairbanks
2006
Louisiana State University
2005
Abstract Topographic nanomanufacturing with a depth precision down to atomic dimension is of importance for advancement nanoelectronics new functionalities. Here we demonstrate mask-less and chemical-free nanolithography process regio-specific removal layers on single crystalline silicon surface via shear-induced mechanochemical reactions. Since chemical reactions involve only the topmost layer exposed at interface, possible lattice beneath processed area remains intact without subsurface...
In this article, we report a controllable and reproducible approach to prepare highly ordered 2-D hexagonal mesoporous crystalline TiO2-SiO2 nanocomposites with variable Ti/Si ratios (0 infinity). XRD, TEM, N2 sorption techniques have been used systematically investigate the pore wall structure, thermal stability functioned synthetic conditions. The resultant materials are ultra stable (over 900 degrees C), large uniform diameters (approximately 6.8 nm), high Brunauer-Emmett-Teller specific...
Abstract For several decades, chemical mechanical polishing (CMP) has been the most widely used planarization method in integrated circuits manufacturing. The final results are affected by many factors related to carrier structure, pad, slurry, and process parameters. As both actions affect effectiveness of CMP, these themselves factors, CMP mechanism is complex a hot research area for years. This review provides basic description development, challenges, key technologies associated with...
This paper presents a novel strategy to synthesize MoO2/carbon nanowires based on organic–inorganic hybrid nanocomposites with nanometre periodic structures. The precursors provide uniform reactions throughout the composites for achieving carbon-hybrid structures and nano-morphology via easy calcination. Through systematic physical characterization including scanning electron microscopy, transmission X-ray powder diffraction, photoelectron spectroscopy, Raman etc., one-dimensional structure...
Friction behavior of aqueous solution at macroscale is quite different from that nanoscale. At macroscale, tribochemistry usually occurs between lubricant and friction surfaces in the running-in process due to a high contact pressure, most such processes can lead reduction. In present work, we reported hydrogen ions played an important role (friction reducing process), which could result coefficient 0.4 0.04 Si(3)N(4) glass macroscale. It found low state are closely dependent on...
Silicon nanowire arrays on silicon substrates can be synthesized with precise orientation depending the crystal of substrate using a vapor–liquid–solid epitaxial growth mechanism. The projections as-grown form rectangular networks (100) (see Figure), parallel straight lines (110) substrates, and triangular (111) substrates. Supporting information for this article is available WWW under http://www.wiley-vch.de/contents/jc_2089/2005/c0474_s.pdf or from author. Please note: publisher not...
Nanotribology has been given increasing attention by researchers in pursuing the nature of friction. In present work, an approach that combines supramolecular assembly and nanotribology is introduced. Herein, nanotribological study was carried out on seven template networks [namely, hydrogen bond induced tricarboxylic acids van der Waals force hexaphenylbenzene (HPB) derivatives]. The networks, as well host–guest assemblies molecules different forces, were constructed highly oriented...
To clarify the chemical mechanical polishing (CMP) mechanism of Cu in aqueous hydrogen peroxide and glycine, we developed a ReaxFF reactive force field to describe interaction between Cu, slurry (H2O, H2O2, glycine), silica abrasive. Based on this field, used molecular dynamics simulations illustrate chemistry at Cu/silica abrasive interface atom removal during CMP process. Our results indicate that H2O easily chemically adsorbs surface, H2O2 can dissociate into hydroxyl radicals, forming...
Abstract Transparent conductive electrodes (TCEs) are indispensable components of various optoelectronic devices such as displays, touch screen panels, solar cells, and smart windows. To date, the fabrication processes for metal mesh‐based TCEs either costly or having limited resolution throughput. Here, a two‐step surface energy‐directed assembly (SEDA) process to efficiently fabricate high silver meshes is introduced. The SEDA turns from on functionalized substrate with hydrophilic mesh...
Solution-based processes have received considerable attention in the fabrication of electronics and sensors owing to their merits being low-cost, vacuum-free, simple equipment. However, current solution-based either lack patterning capability or low resolution (tens micrometers) pattern fidelity terms line edge roughness (LER, several micrometers). Here, we present a surface energy-directed assembly (SEDA) process fabricate metal oxide patterns with up 2 orders magnitude improvement (800 nm)...
Solution-based processes have emerged as a compelling alternative to the traditional vacuum-based physical vapor deposition fabricate indium tin oxide (ITO) films owing their advantages of cost-effectiveness, being vacuum-free, and simple equipment. Despite extensive research improve electrical properties ITO transparent conductive oxides (TCOs), influence precursor solution composition on these remains unexplored. Here, we prepare solutions that vary in anionic groups metal cation valence...
Abstract Solution‐based processes are emerging in the fabrication of flexible electronics owing to their cost‐effectiveness, low‐temperature processing capabilities, and vacuum‐free operations. Currently, printing techniques, as most widely used solution‐based processes, suffer from low resolution poor pattern fidelity. Although surface energy‐directed assembly (SEDA) process enables unparalleled fidelity, multilayer application on substrates rarely attempted. Here, a SEDA is for fabricating...
Abstract Stretchable serpentine electrodes have garnered significant attention in diverse fields such as embodied artificial intelligence, electronic skin, free‐form displays, stretchable integrated circuits, etc. However, current micro/nano fabrication processes often struggle with compatibility issues on substrates or face challenges related to scalability, fidelity, and resolution. Here, the study has developed an orientation‐controlled surface energy‐directed assembly (SEDA) process for...