Masaru Sato

ORCID: 0000-0002-3627-7111
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About
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Research Areas
  • Radio Frequency Integrated Circuit Design
  • Semiconductor materials and devices
  • Semiconductor Quantum Structures and Devices
  • GaN-based semiconductor devices and materials
  • Metal and Thin Film Mechanics
  • Copper Interconnects and Reliability
  • Microwave Engineering and Waveguides
  • Photonic and Optical Devices
  • Advancements in Semiconductor Devices and Circuit Design
  • Advanced Power Amplifier Design
  • Superconducting and THz Device Technology
  • Nanowire Synthesis and Applications
  • Semiconductor Lasers and Optical Devices
  • Advancements in PLL and VCO Technologies
  • Energy Harvesting in Wireless Networks
  • Semiconductor materials and interfaces
  • Terahertz technology and applications
  • Antenna Design and Analysis
  • Metal Forming Simulation Techniques
  • Thin-Film Transistor Technologies
  • Silicon Carbide Semiconductor Technologies
  • 3D IC and TSV technologies
  • Integrated Circuits and Semiconductor Failure Analysis
  • Advanced Photonic Communication Systems
  • Ga2O3 and related materials

Fujitsu (China)
2016-2025

Fujitsu (United States)
2009-2024

Fujitsu (Japan)
2015-2024

Materials Research Center
2024

Kitami Institute of Technology
2014-2023

European Organisation for Research and Treatment of Cancer
2021

Health Affairs
2021

Toyama Industrial Technology Center
2018-2020

University of Toyama
2019

Central Research Institute of Electric Power Industry
2011-2013

A high maximum frequency of oscillation (f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> ) 910 GHz was achieved at InAlAs/InGaAs highelectron mobility transistors (HEMTs) with a relatively long gate length (L xmlns:xlink="http://www.w3.org/1999/xlink">G</sub> 75 nm by adopting an asymmetric recess and double-side-doped structure. The f improved significantly extending the drain-side xmlns:xlink="http://www.w3.org/1999/xlink">RD</sub>...

10.1109/ted.2016.2624899 article EN IEEE Transactions on Electron Devices 2016-11-17

This letter reports on an InAlGaN/GaN high-electron-mobility transistor (HEMT) employing a SiC/diamond-bonded heat spreader with record high output power density of 22.3 W/mm. A quaternary In-added InAlGaN barrier enabled both the large current over 1 A/mm and breakdown voltage 257 V. The drain bias was increased as 100 V for S-band load-pull measurement, leading to operation. Furthermore, thermal resistance reduced by 60%, from 18.8 7.2°C/W, SiC/diamond spreader. dissipation effect clearly...

10.1109/led.2018.2884918 article EN IEEE Electron Device Letters 2018-12-05

This paper describes the implementation of 60 and 77GHz PAs in standard 90nm CMOS technology. An accurate transistor model is developed that enables designing circuits operating at frequencies up to 80GHz. The are designed with a unique matching topology for reducing RF signal loss networks.

10.1109/isscc.2008.4523307 article EN 2008-02-01

We demonstrated a W-band high-power-density MMIC power amplifier with 80 nm InAlGaN/GaN HEMTs. The consists of two-stage cascade units, each which has two transistors the same gate periphery for high gain and low-loss matching circuit. achieved maximum output 1.15 W PAE 12.3 % at 86 GHz under CW operation. Its density reached 3.6 W/mm, representing highest performance GaN HEMT amplifier.

10.1109/pawr.2016.7440153 article EN 2016-01-01

The study reports the findings on a quaternary InAlGaN/GaN high electron mobility transistor (HEMT) employing thermal chemical vapor deposition (TCVD) silicon nitride (SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> ) passivation with record output power density of 31.0 W/mm in X-band. We compared two different SiN methods, namely, TCVD deposition, and plasma-enhanced CVD (PECVD) for HEMTs investigated effects device performance....

10.1109/led.2024.3355051 article EN IEEE Electron Device Letters 2024-01-17

Abstract An AlGaN/GaN high-electron-mobility transistor (HEMT) on a free-standing GaN substrate achieved impressive power-added and drain efficiencies of 85.2% 89.0%, respectively, at 2.45 GHz. We improved the channel quality by reducing C concentration eliminated buffer leakage path removing residual Si substrate-epitaxial layer interface. These improvements, combined with reduction in dislocation density elimination nucleation using substrate, contributed to enhanced efficiency. To best...

10.35848/1882-0786/adbc79 article EN cc-by Applied Physics Express 2025-03-01

GaN-based high-electron-mobility transistors (HEMTs) fabricated on SiC substrates were successfully bonded to single-crystal diamond heat spreader by a surface activated bonding method with thin titanium (Ti) cover layer. A Ti layer the improved strength of SiC/diamond interface since formation an amorphous was suppressed. This process applied high-output power InAlGaN/GaN HEMTs spreaders. The structure reduced thermal resistance devices and enabled their high-power operation.

10.7567/1347-4065/ab5b68 article EN Japanese Journal of Applied Physics 2019-11-25

Abstract This paper demonstrates highly efficient GaN high-electron-mobility transistors (HEMTs) on substrates with reduced interface contamination. By applying a hydrofluoric acid-based pre-growth treatment to substrate, the Si impurity concentration at between substrate and epitaxial layer can successfully be reduced. RF performance was enhanced by owing suppression of Si-induced parasitic loss. As result, HEMTs exhibited an excellent power-added efficiency 82.8% 2.45 GHz. To best our...

10.35848/1882-0786/abc1cc article EN Applied Physics Express 2020-12-29

This paper reports on an AlGaN/GaN high-electron-mobility transistor (HEMT) free-standing AlN substrates with a record-high output power density of 24.4 W/mm at the X-band. A high-drain current operation 1.4 A/mm was realized by employing high-density 2-dimensional electron gas channel and regrown Ohmic contacts. Furthermore, high-voltage 110 V achieved owing to high-breakdown SiNx layer grown low-pressure/high-temperature chemical vapor deposition. Three-stage AlGaN buffer layers improved...

10.1109/jeds.2023.3234235 article EN cc-by-nc-nd IEEE Journal of the Electron Devices Society 2023-01-01

This paper proposes a new topology for broadband low-noise-amplifier (LNA). A common-gate (CG) amplifier with matching inductor composes unit cell, and the cells are cascaded to increase gain. As both input output impedances of cell matched 50 Ω wide frequency range, it is possible gain while maintaining bandwidth. Thus, high-gain performance can be obtained using this topology. The other features its small size, low power consumption, current reuse presents design methodology multistage CG...

10.1109/tmtt.2010.2050374 article EN IEEE Transactions on Microwave Theory and Techniques 2010-06-14

This paper describes a 0.18 /spl mu/m CMOS distributed amplifier with optimized source degeneration which achieves 4 dB gain and 39 GHz bandwidth within 1 variation.

10.1109/isscc.2004.1332801 article EN 2004-09-28

A <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">W</i> -band millimeter-wave transmitter and receiver that are based on impulse radio (IR) architecture were developed. The IR-based apparatuses have an optical-fiber input/output interface board supports multi protocol signals (OC-192 10 GbE) implements a forward error correction (FEC), enabling 10-Gb/s data transmission both in space fiber seamlessly. Analyzing model with simple on/off...

10.1109/tmtt.2009.2033242 article EN IEEE Transactions on Microwave Theory and Techniques 2009-11-03

A maximum frequency of oscillation (fmax) 1.3 THz was achieved using an extended drain-side recess structure InAlAs/InGaAs high-electron-mobility transistors (HEMTs), although the gate length relatively long at 75 nm. The high fmax improved by reducing drain output conductance (gd). use asymmetric and double-side doping above below a channel region were effective in gd. Further improvements transconductance (gm) gd distance between source electrodes.

10.7567/apex.10.024102 article EN Applied Physics Express 2017-01-13

We have developed a distributed amplifier for LiNbO/sub 3/ modulator driver using double-doped AlGaAs-InGaAs-AlGaAs pseudomorphic high electron mobility transistors (p-HEMTs). By stabilization and negative resistance control technique with source inductance grounded coplanar waveguided lines, we obtained gain of 15 dB, bandwidth 54 GHz, 6-V/sub PP/ output. These results indicate that our circuit is leading candidate use as in 40-Gb/s fiber-optic communication systems.

10.1109/jssc.2002.801167 article EN IEEE Journal of Solid-State Circuits 2002-09-01

ADVERTISEMENT RETURN TO ISSUEPREVArticleNEXTFormation of Soluble Polyethylene by Hydrogenation Alkali-Metal-Doped PolyacetyleneHideki Shirakawa, Masaru Sato, Akito Hamano, So-ichiro Kawakami, Kazuo Soga, and Sakuji IkedaCite this: Macromolecules 1980, 13, 2, 457–459Publication Date (Print):March 1, 1980Publication History Published online1 May 2002Published inissue 1 March 1980https://pubs.acs.org/doi/10.1021/ma60074a052https://doi.org/10.1021/ma60074a052research-articleACS...

10.1021/ma60074a052 article EN Macromolecules 1980-03-01

At mm-wave frequency, the layout of CMOS transistors has a larger effect on device performance than ever before in low frequency. In this work, distance between gate and drain contact (D <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gd</sub> ) been enlarged to obtain better maximum available gain (MAG). A 0.6 dB MAG improvement is realized when D changes from 60 nm 200 nm. By using asymmetric-layout transistor, four-stage common-source noise...

10.1109/esscirc.2010.5619713 article EN Proceedings of ESSCIRC 2010-09-01

The minimum noise figure (NF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">min</sub> ) at 94 GHz was improved effectively by employing a cavity structure in the interconnection process, even though wide gate head used InP-based high-electron-mobility transistors (HEMTs). is effective improving NF since resistance reduced, while increased parasitic capacitance passivated affects figure. Then, eliminated successfully around region. We measured...

10.1109/led.2011.2175360 article EN IEEE Electron Device Letters 2011-12-23

Low-temperature deposition has been required for preparing SiNx films of high density, refractive index, and low hydrogen content various applications. We examine the characteristics deposited at temperature by reactive sputtering plasma-enhanced CVD under different conditions. The results reveal that we can give an outline preparation conditions provide properties pretreatment Si target improves sputter-deposited reducing amount oxygen incorporation.

10.7567/jjap.53.05ge01 article EN Japanese Journal of Applied Physics 2014-04-16

This paper describes a new preamplifier IC with 0,15-/spl mu/m gate InP-based high electron mobility transistors (HEMTs) for high-speed fiber optic communication system. The consists of lumped-element transimpedance amplifier (TIA) the input stage and highly stabilized distributed cascode-configured unit cells gain stage. A gain-peaking technique was employed to enhance bandwidth flatness preamplifier. peaking profile compensates lack TIA. As result, we achieved flat 52 dB/spl Omega/ 49 GHz.

10.1109/4.944656 article EN IEEE Journal of Solid-State Circuits 2001-01-01

A fully-integrated K-band differential power amplifier was designed in 65 nm CMOS. The comprised of the 2-stage cascode configuration has matching networks based on transformer. To match impedances, turn ratios each transformer were to be 1:1 for input stage, 2:1 inter and 1:1.5 output respectively. saturation more than 20 dBm obtained band between 16 GHz 25 GHz. peak value 23.8 dBm, added efficiency (PAE) 25.1 % at 19 chip occupied area including DC RF pads is 1.2 × 0.8 mm.

10.1109/rfic.2011.5940655 article EN 2011-06-01

Gallium nitride high electron mobility transistors (GaN HEMTs) were developed for millimeter-wave power amplifier applications. The device with a gate length of 80 nm and an InAlN barrier layer exhibited drain current more than 1.2 A/mm breakdown voltage 73 V. A cut-off frequency fT 113 GHz maximum oscillation fmax 230 achieved. output density reached 1 W/mm linear gain 6.4 dB at load-pull measurements 90 GHz. And we extracted equivalent circuit model parameters the InAlN/GaN HEMT showed...

10.1587/transele.e97.c.923 article EN IEICE Transactions on Electronics 2014-01-01

The authors present a 3-V dual-modulus (/64/65, /128/129) prescaler that operates up to 1.0 GHz with 3-mW (V/sub CC/ at 2.58 V) power consumption. Under the normal supply voltage of 3 V, maximum operating frequency and dissipation are 1.18 5 mW, respectively. This has been achieved by accurate circuit simulation use 0.2- mu m bipolar technology.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

10.1109/4.173107 article EN IEEE Journal of Solid-State Circuits 1992-01-01

Abstract Summary: Alternating copolymers between substituted 1,3,5‐triazine (substituent = alkyl or amine) and thiophene bithiophene are synthesized. The copolymer of amino‐1,3,5‐triazine with is soluble in organic solvents, transparent most parts the visible region, photoluminescent. receives electrochemical n ‐doping an E pc −2.08 V vs Ag + /Ag shows a time‐of‐flight electron drift mobility 2.0 × 10 −4 cm 2 · −1 s , which larger than that widely used Al(8‐quinolinolato) 3 . Structure...

10.1002/marc.200500773 article EN Macromolecular Rapid Communications 2006-02-16

This paper describes 94-GHz band low-noise and high-gain amplifier MMICs using InP HEMTs, which have been developed for passive millimeter-wave (PMMW) imaging. To achieve a high gain with low noise performance, we propose new stabilizing technique the amplifier. The measured figure was 3.2 dB 33 dB. In addition, PMMW imager this We also demonstrated an example of image acquired by imager.

10.1109/mwsym.2007.380074 article EN IEEE MTT-S International Microwave Symposium digest 2007-06-01
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