- Injection Molding Process and Properties
- Additive Manufacturing and 3D Printing Technologies
- Advanced machining processes and optimization
- Topology Optimization in Engineering
- Metal and Thin Film Mechanics
- Diamond and Carbon-based Materials Research
- Adhesion, Friction, and Surface Interactions
- Heat Transfer and Optimization
- Advanced Surface Polishing Techniques
- Advanced Multi-Objective Optimization Algorithms
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- Metallurgy and Material Forming
- Aluminum Alloys Composites Properties
- Composite Material Mechanics
- Advanced Numerical Analysis Techniques
- Manufacturing Process and Optimization
- Metallic Glasses and Amorphous Alloys
- Polymer Foaming and Composites
- Building Energy and Comfort Optimization
- High-Velocity Impact and Material Behavior
- Force Microscopy Techniques and Applications
- Surface Roughness and Optical Measurements
- Composite Structure Analysis and Optimization
- Magnesium Alloys: Properties and Applications
UK Dementia Research Institute
2025
China Geological Survey
2024-2025
Stanford University
2024
Hefei University of Technology
2024
Hebei University of Technology
2024
Amazon (United States)
2024
Northwestern Polytechnical University
2024
Central South University
2016-2020
Purdue University West Lafayette
2016-2019
Indiana University – Purdue University Indianapolis
2015-2019
Plastic injection molding is a versatile process and major part of the present plastic manufacturing industry. Traditional die design limited to straight (drilled) cooling channels, which don't impart optimal thermal (or thermo-mechanical) performance. With advent additive technology, tools with conformal channels now possible. The incorporation can improve performance an mold, though it may compromise structural or mechanical stability mold. However, optimum based on thermo-mechanical are...
Heatsink design is critical for power density and reliability enhancement of semiconductor modules. In this letter, an automated optimization methodology air-cooled heatsinks are proposed based on genetic algorithm finite element analysis. While the generates a population candidates with complex heatsink cross-section geometry in each iteration, analysis used to evaluate fitness function individual heatsink, i.e., junction temperature devices. With rule "survival fittest," eventually...
This work presents a framework for optimizing additive manufacturing of plastic injection molds. The proposed system consists three modules, namely process and material modeling, multi-scale topology optimization, experimental testing, calibration validation. Advanced numerical simulation is implemented typical die with conformal cooling channels to predict cycle time, part quality tooling life. A thermo-mechanical optimization algorithm being developed minimize the weight enhance its...
Abstract Background People living with dementia often experience changes in independence and daily living, affecting their well-being quality of life. Behavioural correlate cognitive decline, functional impairment, caregiver distress, care availability. Methods We use data from a 3-year prospective observational study 141 people at home, using the Bristol Activities Daily Living Scale, Neuropsychiatric Inventory assessments, alongside self-reported healthcare-related data. Results Here we...
Helium is a critical, scarce, and strategic resource, often found in association with natural gas. This study reports the first discovery of overpressured helium-rich gas Lower Yangtze Region Eastern China, helium concentrations reaching as high 4.5%, significantly surpassing commercial extraction threshold 0.1%. Comprehensive geochemical analyses, including isotopes ratios, carbon isotope compositions CH4 CO2, compositional data, indicate that this region predominantly crustal origin....
This work presents a systematic and practical finite element based design optimization approach for the injection tooling adaptive to additive manufacturing (AM) technology using stereo-lithography (SLA) powder bed fusion (PBF). First thermomechanical of conformal cooling is implemented obtain optimal parameters associated with design. Then, multiscale topology lightweight lattice without compromising thermal mechanical performance. The optimize real mold final prototyped in SLA...
This work presents implementation of numerical analysis and topology optimization techniques for redesigning traditional injection molding tools. Traditional tools have straight cooling channels, drilled into a solid body the core cavity. The time constitutes large portion total production cycle that needs to be reduced as much possible in order bring significant improvement overall business industry. Incorporating conformal channels dies is highly competent solution lower well improve...
This article presents a systematic power stage design approach for high-power density air-cooled inverter, which involves the utilization of emerging 1.7 kV silicon carbide (SiC) mosfet bare die engineering samples, heatsinks optimized with genetic algorithm, and built using three-dimensional printing technology integrated modules novel packaging structure. The developed inverter assembly is mainly composed SiC phase leg split high-side low-side switch submodules, are attached to two...
Abstract This paper takes a low-speed axial contra-rotating compressor as the experimental object, and sensor array is used to collect pressure sequences in stall conditions for different speed configurations. These data sets are then preprocessed train neural networks. A self-learning threshold method based on kernel density estimation (KDE) utilized obtain alarm thresholds. By utilizing best-performing long short-term memory (LSTM) model predict initiation time 15 configurations with...
Enhancing power density and reliability of electronics is extremely important in applications. One the key challenges design process to optimum heat sink. In this paper, an algorithm proposed air-cooled sinks using genetic (GA) finite element analysis (FEA) simulations. While GA generates a population candidate each iteration, FEA simulations are used evaluate fitness function each. The considered paper maximum junction temperature semiconductor devices. With approach that prefers "survival...
With the advent of additive manufacturing, innovative design methods, such as network-based techniques, and structural topology optimization have been used to generate complex highly efficient cooling systems in recent years. However, methods that incorporate coupled thermal fluid analysis remain scarce. In this paper, a thermal-fluid algorithm is introduced for conformal channels. The problem formulated based on coupling Navier- Stokes equations convection-diffusion equation. solved by...
Abstract Multistage adaptive testing (MST) has been recently adopted for international large‐scale assessments such as Programme International Student Assessment (PISA). MST offers improved measurement efficiency over traditional nonadaptive tests and practical convenience single‐item‐adaptive computerized (CAT). As a third alternative test design to CAT, Zheng Chang proposed the “on‐the‐fly multistage testing” (OMST), which combines benefits of CAT offsets their limitations. In this study,...
In this paper, a genetic algorithm- (GA-) based approach is discussed for designing heat sinks on total generation and dissipation pre-specified size shape. This combines random iteration processes algorithms with finite element analysis (FEA) to design the optimized sink. With an that prefers "survival of fittest", more powerful sink can be designed which cool power electronics efficiently. Some resulting designs only 3D printed due their complexity. addition describing methodology, paper...
Additive manufacturing allows the fabrication parts and tools of high complexity. This capability challenges traditional guidelines in design conformal cooling systems heat exchangers, injection molds, other tools. Innovative methods, such as network-based approaches, lattice structures, structural topology optimization have been used to generate complex highly efficient systems; however, methods that incorporate coupled thermal fluid analysis remain scarce. paper introduces a thermal-fluid...
The traditional heatsink design technologies for forced air-cooling and power semiconductors with low junction temperatures have constrained the converters to be designed massive heatsinks. losses of WBG device technology higher temperature operation over a wide operating range not been fully utilized liquid-cooled systems. other major limitation has also module packaging "stack" approach baseplate. This paper presents novel stage which involves 1.7 kV silicon carbide (SiC) MOSFETs, Genetic...
Purpose This paper aims to establish a multiscale topology optimization method for the optimal design of non-periodic, self-supporting cellular structures subjected thermo-mechanical loads. The result is hierarchically complex that thermally efficient, mechanically stable and suitable additive manufacturing (AM). Design/methodology/approach proposed seeks maximize performance at macroscale in conceptual while obtaining maximum shear modulus each unit cell mesoscale. Then, re-estimated,...
Abstract This work introduces a cluster-based structural optimization (CBSO) method for the design of categorical multimaterial structures subjected to crushing, dynamic loading. The proposed consists three steps: conceptual generation, clustering, and Bayesian optimization. In first step, is generated using hybrid cellular automaton (HCA) algorithm. second threshold-based cluster analysis yields lower-dimensional design. Here, validity index introduced in order qualitatively evaluate...
In this paper, a fully differential telescopic operational amplifier design is presented which achieve both high dc gain and unity-gain frequency. Trade-offs among such factors as bandwidth, gain, phase, margin, bias current, signal swing, slew rate, power are made evidently. The characteristic of kind two-stage investigated theoretically, in paper. results indicate that proposed achieves broader unity increases the DC gain. Simulation show that, at 5 V supply, output swing ±4.3 V, settling...