Moises Jezzini

ORCID: 0000-0002-7692-6753
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About
Contact & Profiles
Research Areas
  • Photonic and Optical Devices
  • Neural Networks and Reservoir Computing
  • Optical Network Technologies
  • Semiconductor Lasers and Optical Devices
  • Advanced Photonic Communication Systems
  • Mechanical and Optical Resonators
  • Photonic Crystals and Applications
  • Advanced Fiber Laser Technologies
  • Optical Coherence Tomography Applications
  • Advanced Fluorescence Microscopy Techniques
  • Retinal and Macular Surgery
  • Nanowire Synthesis and Applications
  • Computational Physics and Python Applications
  • Optical Polarization and Ellipsometry
  • Science Education and Pedagogy
  • Microwave Engineering and Waveguides
  • Photorefractive and Nonlinear Optics
  • Educational Innovations and Challenges
  • Retinal Diseases and Treatments
  • Orbital Angular Momentum in Optics
  • Biomedical and Engineering Education
  • Quantum optics and atomic interactions
  • Solid State Laser Technologies
  • Innovative Teaching Methods

University College Cork
2016-2024

Tyndall Centre
2021

Tyndall National Institute
2019

KTH Royal Institute of Technology
2019

Bellingham Technical College
2016

Tecnológico de Monterrey
2006

Abstract Silicon photonics has emerged as a mature technology that is expected to play key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and quantum information processing. The success of silicon been enabled by the unique combination performance, yield, high-volume capacity can only be achieved standardizing manufacturing technology. Today, standardized platforms...

10.1038/s41378-023-00498-z article EN cc-by Microsystems & Nanoengineering 2023-03-20

Widespread adoption of silicon photonics into datacenters requires that the integration driving electronics with be an essential component transceiver development. In this article, we describe our photonic design: a 2.5D integrated multi-chip module (MCM) for 4-channel wavelength division multiplexed (WDM) microdisk modulation targeting 10 Gbps per channel. A interposer is used to provide connectivity between circuit (PIC) and commercial transimpedance amplifiers (TIAs). Error free...

10.1109/jlt.2020.2967235 article EN cc-by Journal of Lightwave Technology 2020-01-16

The emerging fields of silicon (Si) photonic micro–electromechanical systems (MEMS) and optomechanics enable a wide range novel high-performance devices with ultra-low power consumption, such as integrated optical MEMS phase shifters, tunable couplers, switches, optomechanical resonators. In contrast to conventional <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" id="m1"> <mml:mrow> <mml:msub> <mml:mi>SiO</mml:mi> </mml:mrow> <mml:mn>2</mml:mn> </mml:msub>...

10.1364/prj.441215 article EN Photonics Research 2021-11-30

The growth of the global photonics market and technology investment creates a need for skilled professionals with multidisciplinary knowledge. development successful training these requires special attention to implemented educational approaches. Current methods teaching learning include tutoring by team experts different backgrounds projects among teams students. In cases, detailed feedback is needed from students teachers in order improve course keep consistent alignment outcomes,...

10.1117/12.2523352 article EN 2019-07-02

We give an overview the progress of our work in silicon photonic programmable circuits, covering technology stack from chip over driver electronics, packaging technologies all way to software layers. On side, we show recent results large-scale circuits with different tuning technologies, including heaters, MEMS and liquid crystals, their respective electronic driving schemes. look into scaling potential these as number tunable elements a circuit increases. Finally, elaborate on routines for...

10.1117/12.2647293 article EN 2023-03-13

The packaging of high speed Photonic Integrated Circuits (PICs) should maintain the electrical signal integrity. standard PICs relies on wire bonds. This is not desirable because bonds degrade quality signal. research presented in this paper proposes to replace with an interposer multilevel transmission lines. By attaching PIC by flip chip onto interposer, use avoided. main concern for designing lines vertical transition, which must be designed avoid return and radiation losses. In paper, a...

10.1117/12.2227628 article EN Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE 2016-05-13

In this paper we present a transmission line design to achieve phase matched lines for high-speed optical modulators. The layout presented is that start off equally spaced. mathematical relation matching between the derived by making path length difference zero. Example layouts using co-planar waveguide are generated based upon specifications of some Mach-Zehnder Modulators (MZM) and in-phase/quadrature (IQ) MZMs have been designed. method then verified comparing in commercial full-wave...

10.1049/cp.2014.0673 article EN 2014-01-01

We present our work to extend silicon photonics with MEMS actuators enable low-power, large scale programmable photonic circuits. For this, we start from the existing iSiPP50G platform of IMEC, where add free-standing movable waveguides using a few post-processing steps. This allows us implement phase shifters and tunable couplers electrostatically actuated MEMS, while at same time maintaining all original functionality platform. The devices are protected wafer-level sealing approach...

10.1117/12.2614213 article EN 2022-03-04

Abstract As a rapidly growing field, biophotonics demonstrates an increasingly higher demand for interdisciplinary professionals and requires the implementation of structured approach to educational outreach activities focused on appropriate curriculum, teaching learning audiences with diverse technical backgrounds styles. Our study shows main findings upon applying this workshops delivered 2 consecutive years while updating improving outcomes, strategies, workshop content based student...

10.1002/jbio.202300491 article EN cc-by Journal of Biophotonics 2024-04-25

With the maturing and increasing complexity of Silicon Photonics technology, novel avenues are pursued to reduce power consumption provide enhanced functionality: exploiting mechanical movement in advanced Photonic Integrated Circuits provides a promising path access strong modulation effective index low by employing mechanically stable thus non-volatile states.In this paper, we will discuss recent achievements development MEMS enabled systems outline roadmap towards reconfigurable general Circuits.

10.1364/ofc.2019.m2d.3 article EN Optical Fiber Communication Conference (OFC) 2022 2019-01-01

We present our work in the European project MORPHIC to extend an established silicon photonics platform with low-power and non-volatile <i>micro-electromechanical</i> (MEMS) actuators demonstrate large-scale programmable <i>photonic integrated circuits</i> (PICs).

10.1117/12.2631231 article EN 2022-05-26

Programmable photonic chips allow flexible reconfiguration of on-chip optical connections, controlled through electronics and software. We will present the recent progress such complex circuits powered by silicon MEMS actuators.

10.1364/networks.2022.nem2c.3 article EN Optica Advanced Photonics Congress 2022 2022-01-01

A swept source optical coherence tomography (SS-OCT) system with the interferometer engine being a photonic integrated circuit (PIC) has been developed. Furthermore, an Arrayed Waveguide Grating (AWG), representing grating on PIC, for spectral domain OCT (SD-OCT) in fiber-based system. With measured sensitivities of ~87 dB and ~80 (SD-OCT), scattering tissue imaging becomes feasible OCT-on-chip systems. In this study, we present two systems first results biological in-vivo ex-vivo.

10.1117/12.2526903 article EN 2019-07-19

High bandwidth density silicon photonic interconnects offer the potential to address massive increase in demands for data center traffic and high performance computing. One of major challenges realizing photonics transceivers is integration packing ICs (PIC) with electronic (EIC). This paper presents our version one, 2.5D integrated multi-chip module (MCM) transceiver 4 channel wavelength division multiplexing (WDM) operation, targeting 10 Gbps per channel. We identify five key areas...

10.1117/12.2544008 article EN 2020-01-31

We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a interposer to integrate four-channel cascaded microdisk receiver with four electronic transimpedance amplifiers.

10.1364/cleo_si.2020.sf1l.3 article EN Conference on Lasers and Electro-Optics 2020-01-01

Programmable photonic circuits electronically reconfigure the flow of light on a chip. This requires hundreds or thousands phase shifters and tunable couplers. Silicon MEMS offer both high integration density low power consumption.

10.1364/psc.2020.psth1f.1 article EN OSA Advanced Photonics Congress (AP) 2020 (IPR, NP, NOMA, Networks, PVLED, PSC, SPPCom, SOF) 2020-01-01

We present a silicon photonics technology extended with low-power MEMS scalable to large circuits. This enables us make photonic waveguide meshes that can be reconfigured using electronics and software.

10.1364/iprsn.2021.im2a.1 article EN OSA Advanced Photonics Congress 2021 2021-01-01

To compensate for velocity mismatch in travelling wave opto-electronic devices, the microwave of propagating RF signal is reduced by introducing capacitively loaded elements. For high speed operation, these elements must be electrically isolated from one another, which typically achieved using ion-implantation to render p-doped material non-conducting. We propose and demonstrate through optical electrical simulations that can avoided a quasi-shallow etch isolate capacitive High isolation...

10.1117/12.2224583 article EN Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE 2016-04-27

Designing photonic integrated circuits (PICs) with packaging in mind is important since this impacts the performance of final product. In coherent optical communication applications there are a large number DC and RF lines that need routed to connect PIC outer packaging. These should be impedance matched devices, isolated from each other, low loss protected against electromagnetic interference (EMI) over frequency range interest achieve required for application. Multilevel temperature...

10.1117/12.2225962 article EN Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE 2016-05-13

We present our work to extend silicon photonics with MEMS actuators enable low-power, large scale programmable photonic circuits.For this, we start from the existing iSiPP50G platform of IMEC, where add free-standing movable waveguides using a few post-processing steps.This allows us implement phase shifters and tunable couplers electrostatically actuated MEMS, while at same time maintaining all original functionality platform.The devices are protected wafer-level sealing approach interfaced...

10.1117/12.2647371 article EN 2023-03-15
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