A5052966628- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Optical Network Technologies
- Advanced Photonic Communication Systems
- Photonic Crystals and Applications
- Advanced Fiber Optic Sensors
- Semiconductor Quantum Structures and Devices
- Advanced Fiber Laser Technologies
- Housing, Finance, and Neoliberalism
- Neural Networks and Reservoir Computing
- Optical Coatings and Gratings
- Optical Coherence Tomography Applications
- Photonic Crystal and Fiber Optics
- Advanced Fluorescence Microscopy Techniques
- 3D IC and TSV technologies
- Microfluidic and Capillary Electrophoresis Applications
- Nanofabrication and Lithography Techniques
- Advanced MEMS and NEMS Technologies
- Advanced Optical Network Technologies
- Insurance and Financial Risk Management
- Nanowire Synthesis and Applications
- Thermal Radiation and Cooling Technologies
- Biosensors and Analytical Detection
- Electrowetting and Microfluidic Technologies
- Analytical Chemistry and Chromatography
International Energy Research Centre
2012-2024
University College Cork
2014-2024
Austrian Institute of Technology
2024
National University of Ireland
2000-2024
Infinera (United States)
2023
Eindhoven University of Technology
2022
Ayar Labs (United States)
2022
Tyndall National Institute
2013-2019
Newcastle University
2016-2019
Regional Studies Association
2019
Silicon photonics research can be dated back to the 1980s. However, previous decade has witnessed an explosive growth in field. is a disruptive technology that poised revolutionize number of application areas, for example, data centers, high-performance computing and sensing. The key driving force behind silicon ability use CMOS-like fabrication resulting high-volume production at low cost. This enabling factor bringing range areas where costs implementation using traditional photonic...
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design fabricate chips. While these bare Si-PICs are adequate testing new device circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them durable module. Photonic PICs is significantly more challenging, currently orders...
Abstract The recent wave of populism has focused attention on ‘left behind’ places as hotspots discontent. Seeking to remedy their neglect in urban and regional studies, the aim this paper is engage with problems stimulate fresh thinking about alternative approaches. Reflecting complex inter-connected issues facing such places, it argues that a new conception required address belonging attachment. outlines basis an expanded neo-endogenous development approach, identifying foundational...
We present the demonstration of an integrated frequency modulated continuous wave LiDAR on a silicon platform. The waveform calibration, scanning system, and balanced detectors are implemented chip. Detection ranging moving hard target at upto 60 m with less than 5 mW output power is demonstrated in this paper.
Abstract Silicon photonics has emerged as a mature technology that is expected to play key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and quantum information processing. The success of silicon been enabled by the unique combination performance, yield, high-volume capacity can only be achieved standardizing manufacturing technology. Today, standardized platforms...
Heterogeneous integration of III-V materials onto silicon photonics has experienced enormous progress in the last few years, setting groundwork for implementation complex on-chip optical systems that go beyond single device performance. Recent advances on field are expected to impact next generation communications attain low power, high efficiency and portable solutions. To accomplish this aim, intense research hybrid lasers, modulators photodetectors is being done implement modules photonic...
This Special Issue aims to further understanding and explanation of the funding, financing governing urban infrastructure amidst its engagements with contemporary financialisation. Drawing upon empirical material from international cases Europe, North America, Africa Asia, it identifies critical issues advance work in this area. These themes concern: impacts financialisation shifting definitions conceptualisations infrastructure; worth adopting more actor-oriented grounded approaches...
We report on the first monolithically integrated microring-based optical switch in switch-and-select architecture.The fabric delivers strictly non-blocking connectivity while completely canceling firstorder crosstalk.The 4×4 switching circuit consists of eight silicon spatial (de-)multiplexers interconnected by a Si/SiN dual-layer crossing-free central shuffle.Analysis on-state and off-state power transfer functions reveals extinction ratios individual ring resonators exceeding 25 dB,...
Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be into functional optoelectronic systems. Photonic packaging however often a major barrier impeding scalable deployment PIC technologies given its high cost limited throughput. This perspective addresses the technical challenges discusses promising strategies research directions to overcome "packaging bottleneck".
A novel process for fiber-packaging submicrometer silicon waveguides is presented. The uses fibers polished at an angle to reflect light between a horizontal core and the slightly off-vertical input output path of grating coupler. necessity reflective coating on fiber facet overcome through use total internal reflection technique epoxy distribution based capillary action. Simulations alignment tolerance are presented, along with measurements confirming applicability passive alignment. peak...
This article reflects upon a comparative analysis of the 28 ‘City Deals’ agreed between UK government, Scottish government and city-regional groupings in England Scotland since 2011. The City Deals have sought to incentivise local actors identify prioritise ‘asks’ devolved governments, fund, finance deliver infrastructure other economic development interventions, reform city/city-region governance structures ‘unlock’ urban growth. Our is based 32 in-depth interviews with lead Deals,...
Austerity states, institutional dismantling and the governance of sub-national economic development: demise regional development agencies in England. Territory, Politics, Governance. Contributing to interpretations geographies austerity, paper explains how, why what forms austerity states are constructed by actors particular political-economic contexts geographical temporal settings, how whom they articulated pursued, worked through public policy territorial architectures. Empirically, focus...
Abstract With the increasing use of ultrasonography, especially in medical imaging, novel fabrication techniques together with sensor designs are needed to meet requirements for future applications like three-dimensional intercardiac and intravascular imaging. These require arrays many small elements selectively record sound waves coming from a certain direction. Here we present proof concept an optical micro-machined ultrasound (OMUS) fabricated semi-industrial CMOS line. The is based on...
In this article we describe a cost-effective approach for hybrid laser integration, in which vertical cavity surface emitting lasers (VCSELs) are passively-aligned and flip-chip bonded to Si photonic integrated circuit (PIC), with tilt-angle optimized opticalinsertion into standard grating-couplers.A of 10° is achieved by controlling the reflow solder ball deposition used electrical-contacting mechanical-bonding VCSEL PIC.After VCSEL-to-PIC insertion loss -11.8 dB, indicating an excess...
Wafer-level mass production of photonic integrated circuits (PIC) has become a technological mainstay in the field optics and photonics, enabling many novel disrupting wide range existing applications. However, scalable packaging system assembly still represents major challenge that often hinders commercial adoption PIC-based solutions. Specifically, chip-to-chip fiber-to-chip connections rely on so-called active alignment techniques, where coupling efficiency is continuously measured...
A technology for hybridly integrating a discrete edge-emitting laser with submicrometer silicon-on-insulator waveguide is presented. This based on ceramic microoptical bench which compatible high-speed electrical direct modulation. The use of passive- and self-alignment techniques demonstrated to be suitable assembling the die optical components. placement tolerance less than 1 dB loss over 4 <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML"...
Fiber optic interconnection processes and hybrid integration of electronic devices for high speed Si photonic systems are presented. Thermal effects arising from these also investigated. An overview ePIXfab which offers affordable access to an advanced foundry service is This includes the presentation fundamental packaging design rules can greatly reduce time cost associated with development complex devices.
Widespread adoption of silicon photonics into datacenters requires that the integration driving electronics with be an essential component transceiver development. In this article, we describe our photonic design: a 2.5D integrated multi-chip module (MCM) for 4-channel wavelength division multiplexed (WDM) microdisk modulation targeting 10 Gbps per channel. A interposer is used to provide connectivity between circuit (PIC) and commercial transimpedance amplifiers (TIAs). Error free...
Single-mode optical coupling between fiber and photonic integrated circuit (PIC) requires precision alignment bonding, significantly adds to the cost of packaging. This article describes how a pair micro-lens arrays—one on Si-PIC other fiber-array—can be used achieve fiber-to-PIC grating-coupling with an insertion-loss 1.7 dB (i.e., efficiency 68%) at 1300 nm, 1 tolerance <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math...
We show, for the first time, dense WDM (8×20 Gbit/s) transmission at 2 μm enabled by advanced modulation formats (4-ASK Fast-OFDM) and development of key components, including a new arrayed waveguide grating (AWGr) μm. The AWGr shows -12.8±1.78 dB excess loss with an 18-dB extinction ratio thermal tunability 0.108 nm/°C.