J. Dobrzynska

ORCID: 0000-0002-9559-1426
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Diamond and Carbon-based Materials Research
  • Semiconductor materials and devices
  • Advanced Sensor and Energy Harvesting Materials
  • Silicon Carbide Semiconductor Technologies
  • Metal and Thin Film Mechanics
  • Carbon Nanotubes in Composites
  • Graphene research and applications
  • Advanced MEMS and NEMS Technologies
  • Synthesis and properties of polymers
  • Electrowetting and Microfluidic Technologies
  • Mechanical and Optical Resonators
  • 3D IC and TSV technologies
  • Conducting polymers and applications
  • Advancements in Semiconductor Devices and Circuit Design
  • Neuroscience and Neural Engineering
  • Muscle activation and electromyography studies
  • Tribology and Wear Analysis
  • Tactile and Sensory Interactions

ABB (Switzerland)
2016-2021

École Polytechnique Fédérale de Lausanne
2010-2012

We have developed a flexible-substrate-based three-axial force sensor, composed of finger-shaped electrode capacitors, whose operation is based on the measurement capacitance change induced upon applying load. The design supports high sensitivity to shear forces. An overall flexibility sensor and elasticity capacitor's dielectric obtained by integrating three polymers in sensor's technology process, namely polyimide, parylene-C, polydimethylsiloxane, combined with standard metallization...

10.1088/0960-1317/23/1/015009 article EN Journal of Micromechanics and Microengineering 2012-11-30

10.1016/j.sna.2011.11.006 article EN Sensors and Actuators A Physical 2011-11-18

We have realized a flexible force sensor, composed of four redundant capacitors, the operation which is based on measurement load-induced capacitance change. use polyimide both as substrate and elastic dielectric between two levels finger-shaped aluminum electrodes. In particular we developed technology for realization micro-features with gentle slopes to facilitate subsequent metallization processes. Thereby, could improve step coverage electrical contacting levels, well mechanical...

10.1016/j.proeng.2010.09.132 article EN Procedia Engineering 2010-01-01

A TCAD-based approach is proposed to investigate the most relevant transport mechanisms of diamond-like carbon (DLC) films at different biases and ambient temperatures. Starting from band structure boundary conditions a metal-insulator-metal (MIM) device, trap levels have been determined against experiments along with Poole-Frenkel conduction effect. The affinity DLC under study has extracted on corresponding metal-insulator-semiconductor (MIS) diode. clear polarization effect found in...

10.1109/iedm.2016.7838557 article EN 2021 IEEE International Electron Devices Meeting (IEDM) 2016-12-01

We report a process for the realization of polyimide films with custom-designed microporosity based on heat-induced depolymerization polyimide-embedded polypropylene carbonate microstructures. The foam-like microstructures are up to 40 µm thick and incorporate air cavities width ranging from 20 200 µm, length 5 mm height µm. model mechanical stress–strain properties microcavities using both analytical numerical methods. simulation data in good agreement results nanoindentation...

10.1088/0960-1317/21/10/105016 article EN Journal of Micromechanics and Microengineering 2011-09-08

An electroactive passivation for high-voltage diodes with bevel termination has been investigated based on diamondlike carbon (DLC) films. Variations of the DLC properties, i.e., conductivity and geometry, have by experiments numerical simulations to purpose gaining an insight their influence diode leakage current breakdown voltage. The role played DLC/Si interface characterizing metal-DLC-Si devices. Both boron nitrogen doping investigated, a TCAD setup provided accounting main transport...

10.1109/jestpe.2019.2921871 article EN IEEE Journal of Emerging and Selected Topics in Power Electronics 2019-08-15

A new concept for encapsulation of discrete bipolar high-power devices using epoxy mold compound (EMC) is demonstrated on silicon 4.5-kV press-pack fast recovery diodes (FRDs) with wafer diameter up to 130 mm and molybdenum pressure-release buffer 140 in diameter. The wafers can be bonded disks the low-temperature bonding (LTB) process or they fixed mechanically by EMC without direct (free floating). encapsulated applied as housing-less inserted into hermetic ceramic housings pole piece 143...

10.1109/tcpmt.2022.3160102 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2022-03-16

The diamond-like carbon (DLC) is important for passivation of junction termination in high power devices due to its excellent electrical, mechanical, and thermal properties. While the role conductivity polarization DLC layer on blocking capability a p-n has been explained recently, behavior still needs be addressed. For this purpose, diode leakage current was measured large area diodes with negative bevel coated by typical industrial range between 300 413 K. An unusual deviation from...

10.1109/jeds.2021.3073232 article EN cc-by IEEE Journal of the Electron Devices Society 2021-01-01

Diamond-like carbon (DLC) is a very attractive material for Microelectronics, as it can be used to create robust passivation layers in semiconductor devices. In this work, the modelling of DLC TCAD framework addressed, with special attention role played bevel coating large-area high-voltage diodes. The simulations are nicely compared experiments, giving rise detailed explanation by conductivity on diode performance.

10.1109/sispad.2019.8870354 article EN 2019-09-01

The sensitivity of discrete large-area power devices to the design aspects termination region and charging effects electroactive passivation layer on top is presented in this work. junction featuring variation lateral doping (VLD) revisited for such by focusing interaction with material top. To purpose, an ideal dielectric (SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ) compared differently-doped diamond-like carbon (DLC)...

10.1109/ted.2020.3013238 article EN IEEE Transactions on Electron Devices 2020-08-13

Keywords: artificial skin ; tactile sensing skin-like sensor capacitive flexible polymer force three-axial 3D porous polyimide foam microporosity These Ecole polytechnique federale de Lausanne EPFL, n° 5595 (2013)Programme doctoral Microsystemes et MicroelectroniqueFaculte des sciences techniques l'ingenieurInstitut microtechniqueLaboratoire microsystemes 2Jury: A. Kis (president), S. Lacour, Ph. Passeraub, O. Paul Public defense: 2013-3-4 Reference doi:10.5075/epfl-thesis-5595Print copy in...

10.5075/epfl-thesis-5595 article EN 2013-01-01

Diamond-Like Carbon (DLC) is well established material for the passivation of high voltage negative beveled power diode. In our previous works, conduction mechanism DLC has been carefully described through characterization and physical modeling Metal-Insulator-Semiconductor (MIS) structures. addition, effects on breakdown leakage current have clarified comparing available experiments with numerical simulations. However, role played by temperature dependence still lacking. this work, it...

10.1109/eurosoi-ulis53016.2021.9560184 article EN 2021-09-01
Coming Soon ...