Kun Fang

ORCID: 0000-0002-9927-4559
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Research Areas
  • Electronic Packaging and Soldering Technologies
  • Microstructure and Mechanical Properties of Steels
  • Welding Techniques and Residual Stresses
  • 3D IC and TSV technologies
  • Advanced Welding Techniques Analysis
  • Microstructure and mechanical properties
  • Metal Alloys Wear and Properties
  • Silicon Carbide Semiconductor Technologies
  • Building Energy and Comfort Optimization
  • Aluminum Alloy Microstructure Properties
  • Mechanical stress and fatigue analysis
  • Urban Heat Island Mitigation
  • Solidification and crystal growth phenomena
  • Advanced Wireless Communication Techniques
  • Solar Thermal and Photovoltaic Systems
  • Structural Integrity and Reliability Analysis
  • UAV Applications and Optimization
  • Wireless Communication Networks Research
  • Metallurgy and Material Forming
  • Structural Health Monitoring Techniques
  • Advancements in Semiconductor Devices and Circuit Design
  • Adhesion, Friction, and Surface Interactions
  • Advanced MEMS and NEMS Technologies
  • Corrosion Behavior and Inhibition
  • Mobile Ad Hoc Networks

Harbin Institute of Technology
2012-2020

Qualcomm (United States)
2016-2018

Tianjin University
2015-2017

China United Network Communications Group (China)
2016

Air Force Engineering University
2016

Auburn University
2011-2014

Delft University of Technology
2009

Low-temperature Ag sintering provides a lead-free die attachment method that is compatible with high-temperature (300 °C) power electronics applications. The reliability of sintered attach for Si and SiC has been studied on both thick film substrates lower current applications direct bond copper (DBC) higher Pressureless low-pressure were evaluated. Sintering low pressure yielded porosity (15-17%) versus pressureless (~30%). Reliability was evaluated thermal aging cycling (-55 °C to + 300...

10.1109/tpel.2016.2631128 article EN IEEE Transactions on Power Electronics 2016-11-22

10.33012/2025.19979 article EN Proceedings of the Institute of Navigation ... International Technical Meeting/Proceedings of the ... International Technical Meeting of The Institute of Navigation 2025-02-13

It is of great importance to study how the process parameters influence continuum flow properties and mesomicrostructural features during friction stir welding (FSW) titanium alloys. In present paper, microstructure evolution dynamic recrystallisation (DRX) was simulated by cellular automaton method based on metal plastic analysis. The established model can accomplish multiscale modelling macroscopical behaviour, mesostructural dislocation activities, microstructural grain growth dynamics...

10.1179/1743284713y.0000000389 article EN Materials Science and Technology 2013-10-31

Analog and digital integrated circuits capable of operating reliably at 300 °C for 2000 hours were designed fabricated in silicon carbide. These are critical the development tools instrumentation geothermal exploration. Lateral MOSFETs resistors built on Si-face, 4°-off, N+ 4H-SiC substrates. Compact models these devices then generated used to design circuits, including operational amplifiers, ring oscillators, counters, shift registers logic gates. The packaged using specially developed...

10.1109/wipda.2013.6695562 article EN 2013-10-01

10.1016/j.jmatprotec.2013.12.017 article EN Journal of Materials Processing Technology 2014-01-04

Microstructure evolution of nanostructured bainite in tempered zone during welding and regeneration has been analysed. The effect heat input on microstructure mechanical properties is investigated. Results show that cementite precipitation occur zone. When reduced, the size amount decrease, while volume per cent retained austenite increases. At same time, tensile strength increases with decreasing. A welded joint bainitic steel performance almost as base metal obtained by laser beam regeneration.

10.1179/1362171814y.0000000227 article EN Science and Technology of Welding & Joining 2014-06-26

A well-designed wireless sensor deployment method not only directly influences the number of deployed sensors and data accuracy, but also on network topology. As most energy cost comes from transmission receiving packets, clustering optimization in becomes an important issue for energy-efficient coordination among densely nodes communication. In a typical hierarchical network, total intra-cluster communication distance cluster heads to base station depend heads. This work presents novel...

10.1177/1475921717689967 article EN Structural Health Monitoring 2017-02-03

In this study, the pitting corrosion depth of high-strength steel wire surface divided by dense grids was obtained. The empirical threshold method employed to make a decision on state for each grid. Connected corrosive were identified traversing and deemed individual pits. Then, pits characterised pit area volume, planar projection shape three-dimensional morphology. By comparing it found that applied stress has an influence growth direction pit, i.e., grows mainly along compared under...

10.1080/15732479.2020.1730408 article EN Structure and Infrastructure Engineering 2020-02-25

Nanobainite steel is a new strong structural material with an ultimate tensile strength of 2500 MPa, and toughness in excess 30-40 MPam1/2. However, so far, no suitable methods can realize its welding because poor weldabilities. This paper reviews recent researches on nanobainite points out their merits demerits. Three problems during welding, cold cracks, formation brittle martensite, cementite precipitation, are presented. Several possible provided discussed. intended to provide...

10.4028/www.scientific.net/amr.482-484.2405 article EN Advanced materials research 2012-02-01

Higher operating temperature (200 °C) SiC power devices simplify the thermal management system for electronics modules in hybrid and electric vehicle applications. However, common lead-free solders have a melting point of only 217 °C-229 °C, limiting their use this application. In paper, Bi-Ag-X solder paste with solidus approximately 265 °C was characterized on direct bond copper (DBC) CuMo reactively brazed alumina substrates. The Cu surfaces were plated Ni:B Au. During high-temperature...

10.1109/tcpmt.2014.2345500 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2014-09-08

We present iterative turbo-like equalizers for multiple-input multiple-output (MIMO) orthogonal frequency-division multiplexing (OFDM) systems subject to frequency-selective channels with rapid time variation. The proposed are obtained from a Bayesian approach based on the unbiased minimum mean-squared error (MMSE) criterion, but also admit probabilistic data association (PDA) interpretation. Two discussed: basic version that makes use of symbol-level variance estimation, and an enhanced...

10.1109/spawc.2009.5161742 article EN 2009-06-01

With the rapid advancements in smart sensing technology and wireless communication technology, sensor network (WSN) offers an alternative solution to structural health monitoring (SHM). In WSNs, dense deployment of nodes aids identification dynamic characteristics, while data transmission is a significant issue since channels typically have lower bandwidth limited power supply. This paper provides optimization scheme for SHM, terms both energy consumption modal accuracy. A spherical model...

10.1088/0964-1726/24/11/115034 article EN Smart Materials and Structures 2015-10-22

In this paper, The research was based on the thermal comfort questionnaires of people and parameters test environment in semi-open lobby ten starred hotels Sanya. Through analyzing questionnaire, highest acceptable temperature summer 30.6 °C space with natural ventilation. It is not scientific to just use sensation judge human body, so satisfaction, preference all should be considered body evaluation.

10.1016/j.proeng.2015.09.060 article EN Procedia Engineering 2015-01-01
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