A5017672700- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Photolithography Techniques
- Advanced Optical Sensing Technologies
- CCD and CMOS Imaging Sensors
- Phase-change materials and chalcogenides
- Electron and X-Ray Spectroscopy Techniques
- Surface Roughness and Optical Measurements
- Advanced Wireless Communication Techniques
- Iterative Learning Control Systems
- Advanced Adaptive Filtering Techniques
- Industrial Vision Systems and Defect Detection
- Manufacturing Process and Optimization
- Advanced optical system design
- Welding Techniques and Residual Stresses
- Optical Coherence Tomography Applications
- Adhesion, Friction, and Surface Interactions
- Magnetic properties of thin films
- Photonic Crystals and Applications
- Engineering Applied Research
- Advanced Measurement and Metrology Techniques
- Optical Systems and Laser Technology
- Optical measurement and interference techniques
- Power Line Communications and Noise
- Semiconductor Quantum Structures and Devices
- Blind Source Separation Techniques
Toshiba (Japan)
2003-2023
NTT (Japan)
1984
This paper presents a time-to-digital converter/analog-to-digital-converter (TDC/ADC) hybrid LiDAR system-on-chip (SoC) to realize reliable self-driving systems. The smart accumulation technique (SAT) is proposed achieve both 200-m and high-pixel-resolution range imaging, which was untrodden with conventional LiDARs. "smart" realized by simple object recognition strategy small circuit overhead. When compared accumulations, the enhanced without degrading pixel resolution. Moreover, TDC/ADC...
A new decision method for band-limited digital FM that employs discriminator detection is presented. This adopts a multilevel scheme to soften the intersymbol interference effects caused by severe band limitation. It shown applying this significantly improves bit error rate (BER) performance of using detection. Theoretical BER evaluation proves superiority method, and establishes optimum values fundamental transmitter parameters. Experimental results are provided support method.
This article presents a 40-channel high-resolution automotive LiDAR system-on-chip (SoC), which utilizes the world's first dual-data converter (DDC). The proposed DDC consolidates functions of ADC and TDC into single circuitry achieves acquisition both high-precision time voltage data from input, realizing 5× smaller analog front-end (AFE) area than prior arts. Such innovations lead us to 40channel AFE integration SoC without silicon cost increase, characterizes our system with 2× higher...
EUV lithography is expected to be not only for hp 2Xnm node device production method but also 1X nm node. We have already developed the mask inspection system using 199nm wavelength with simultaneous transmitted and reflected illumination optics, which utilize p-polarized and s-polarized high defect detection sensitivity, we a new image contrast enhancement changes digitizing rate of imaging sensor depending on signal level. Also, evaluate structure improve defect detection sensitivity....
A new decision method for band-limited digital FM that employs discriminator detection is presented. This adopts a multilevel scheme to soften the intersymbol interference effects caused by severe band limitation. It shown applying this significantly improves bit error rate (BER) performance of using detection. Theoretical BER evaluation proves superiority method, and establishes optimum values fundamental transmitter parameters. Experimental results are provided support method.
Lithography potential expands for 45nm node to 32nm device production by the development of immersion technology and introduction phase shift mask. We have already developed mask inspection system using 199nm wavelength with simultaneous transmitted illumination reflected optics, is an effectual candidate hp inspection. Also, it has high defect sensitivity because its optical resolution, so as be utilized leading edge next generation lithography. EUV lithography 13.5nm exposure dominant...
A safe and reliable self-driving system is a key enabling technology for society without traffic jams or accidents; LiDAR plays an essential role such systems. To ensure higher levels of safety comfort, early detection small objects (e.g., debris/children) crucial. achieve this, state-of-the-art LiDARs [1-3] must attain even more finely scaled pixel resolution: example, 0.1-degree angle resolution (a 2× finer than [3]) required to detect 20×20cm <sup...
A novel EUV mask inspection tool with 199nm laser source and super-resolution technique has been developed. This is based on NPI-5000PLUS, which a photo-mask for hp2X nm node beyond. In order to implement only short time set-up, reflected illumination type alignment optics guide mark adjust coordinate visible light are equipped. Moreover, inspect masks beyond, the image detection polarized incorporated in this tool. Image contrast enhancement was confirmed by experiments simulations.
This paper introduces several key RX techniques to realize a 200m-range and low-cost high-pixel-resolution solid-state LiDAR for autonomous self-driving systems. In-Sensor Scanning 2D-SPAD array can remove the mechanical mirror improve pixel-resolution by implying short dead time active-quenching SPADs. For ToF calculating SoC, we adopt world first dual-data converter (DDC) which consolidates functions of ADC TDC into single circuitry, achieving acquisition both high-precision time/voltage...
The lithography potential of an ArF (193nm) laser exposure tool with high numerical aperture (NA) will expand its to 45nm node production and even beyond. Consequently, a mask inspection system wavelength nearly equal 193nm is required so as detect defects the masks using resolution enhancement technology (RET). A novel high-resolution platform DUV has been developed, which works at 199nm. close tool. In order adapt 199nm optics for hp2x nm beyond defect detection on next generation...
Recently, technologies of ArF laser exposure tools and alternating phase shifting masks (Alt-PSM) are expected to be used in actual production. To utilize such newly developed technologies, it is inevitable develop a mask inspection technology check them properly. But currently difficult precisely because sufficient image contrast hard obtain with any conventional tools. Among many observation methods, the differential interference (DIC) one few methods that can observe differentiated shift...
In this paper, we will report on our experimental and simulation results the impact of EUVL mask absorber structure inspection system optics defect detection sensitivity. We employed a commercial simulator EM-Suite (Panoramic Technology, Inc.) which calculated rigorously using FDTD (Finite-difference time-domain) method. By various optical constants stacks, image contrasts signals as obtained from system. evaluated contrast capability detecting defects masks by new tool made NuFlare Inc....
This paper describes a novel technology Variable Sensitivity Detection (VSD) for de-sensing SRAF nuisance defects in mask inspection system. The point of our approach is to search the nearest thin-line each defect candidate and estimate line-width with transmitted reflected images. dependence image contract on calculated rigorous model. de-senses lineend shortening edge roughness patterns without compromising sensitivity main features. Total counts detection were drastically reduced. VSD was...
In order to increase the recording density and decrease track pitch of digital versatile discs (DVD) media using land-and-groove format, it is essential suppress magnitude cross-erasure recorded marks. A computational analysis estimate mark erasure shapes was carried out, comparisons with experimental results have shown good agreement. The reduced under conditions given in this paper by increasing duty ratio land width groove (L/G) while keeping constant.
We developed the cyber-physical system(CPS) which can achieve stable and high quality laser welding process by automated control of conditions with AI judgement states simulation-based database. The system has monitoring, recognition, judgment, achieved autonomous welding. In this presentation, we will introduce some practical examples for CPS its application assurance.
In accordance with the increase of recording density DVD media, track pitch is required to be smaller and cross-erase phenomena becomes more prominent. order realize large capacity by using land-and-groove format, it essential suppress magnitude cross-erasure. this paper, computational analysis estimate mark erasure shapes described phenomenon obtained from discussed in terms duty ratio land width groove (L/G). The mainly consists two parts, electromagnetic thermal analysis. former computes...
We developed a Finite-Difference Time Domain (FDTD) Method based simulator that can analyze Dual-Layered phase-change disc structure. Because of substrate thickness error, it is necessary to consider spherical aberration. The electric field distributions have been calcuated on Single-Layered and discs. found differences between the electic focused groove land. These calculation results explain corresponding experimental clearly.
Email Share with Facebook Tweet This Post on reddit LinkedIn Add to CiteULike Mendeley BibSonomy Get Citation Copy Text S. Maruyama, M. Hirono, K. Yusu, T. Tsukamoto, N. Morishita, Tanaka, and H. Satoh, "Computational Analysis of Electric Field Distribution in Dual-Layered Phase-Change Disc," Optical Data Storage, OSA Technical Digest Series (Optica Publishing Group, 2003), paper TuE42P. Export BibTex Endnote (RIS) HTML Plain alert Save article