A5044270098- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Nanomaterials and Printing Technologies
- Electromagnetic wave absorption materials
- Additive Manufacturing and 3D Printing Technologies
- Semiconductor materials and interfaces
- Advanced materials and composites
- Material Properties and Processing
- Aluminum Alloy Microstructure Properties
- Metamaterials and Metasurfaces Applications
- Energetic Materials and Combustion
- Advanced Antenna and Metasurface Technologies
- High-Temperature Coating Behaviors
- Environmental Toxicology and Ecotoxicology
- Marine Biology and Environmental Chemistry
- High Entropy Alloys Studies
- Nanofabrication and Lithography Techniques
- Electrocatalysts for Energy Conversion
- High-Velocity Impact and Material Behavior
- Adhesion, Friction, and Surface Interactions
- Photorefractive and Nonlinear Optics
- Lignin and Wood Chemistry
City University of Hong Kong
2022-2025
Henan Agricultural University
2024
Beijing Institute of Technology
2012-2023
Yantai University
2011-2022
University of California, Los Angeles
2014-2022
Shandong Institute of Commerce & Technology
2022
Delft University of Technology
2002-2020
Beijing Normal University - Hong Kong Baptist University United International College
2020
Jinan University
2020
Lanzhou University
2018-2019
In the big data era, Si chips are integrated more and to satisfy fast growing demand from customers. addition, in post-COVID-19 virus trend of distance teaching home office has increased greatly need advanced consumer electronic products. To provide processing tolerance build a wider temperature window manufacturing, it becomes necessary develop low melting solders because hierarchy is needed packaging technology. Much research been on Pb-free Sn-based with point 180 230 °C. this review, we...
In the present era of big data and internet things, use microelectronic products in all aspects our life is manifested by ubiquitous presence mobile devices as i-phones wearable i-products. These are facing need for higher power greater functionality applications such i-health, yet they limited physical size. At moment, software (Apps) much ahead hardware technology. To advance hardware, end Moore's law two-dimensional integrated circuits can be extended three-dimensional (3D ICs). The...
In this paper, we report the synthesis of three kinds novel nanosheet hierarchical cobalt particles by adjusting [C4H4O6]2−/Co2+ ratio through a liquid reduction method. We investigated electromagnetic properties in detail over microwave frequency range 1–18 GHz. The results show that real part permittivity decreases and imaginary permeability increases with an increase ratio. displays two resonance peaks range. = 6 have maximum reflection loss −48.03 dB at 13.61 GHz, effective absorption...
The development of big data and artificial intelligence technology is increasing the need for electronic devices to become smaller, cheaper, more energy efficient, while also having enhanced functionalities. However, miniaturization silicon chip approaching its Moore's law (i.e., physical) limits. Thus, application three-dimensional integrated circuits (3D ICs), in which multiple chips are stacked vertically, provides most achievable approach advancement post-Moore electronics. In recent...
The IMC (interfacial intermetallic compound) produced by the metallurgical reaction between solder and Cu plate enables packaging of IGBT (insulated gate bipolar transistor) modules. In this paper, growth behavior IMCs Sn58Bi/Cu Sn58Bi-0.05AlN/Cu at different times (10, 30 60 min) temperatures (200, 250 300 °C) was investigated, which can provide a reference for connection IGBT. It shown that interfacial thickness both solders increased with time temperature, but suppressed Sn58Bi containing...
Due to the demand for high-performance electronic products, there has been a rapid development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D stacking relies on microbumps and through silicon vias (TSVs) connect multiple Si dies vertically. These products usually need consume high power, combined with limited heat dissipation due dense packing, resulting issue of Joule heating. problem heating impacts reliability products. This study investigated factors...
In system level electromigration test of 2.5D integrated circuits, a failure mode due to synergistic effect Joule heating and has been found. the circuit, there are three levels solder joints, two Si chips (one them through-Si-via), one polymer substrate. addition, redistribution layers; between every joints. We found that layer flip chip joints micro-bumps is weak-link failed easily by burn-out in test. The time-dependent with sudden resistance increase. Preliminary simulation results show...
SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after at 100 °C for 10 min. intermetallic compound (IMC) growth kinetics measured to be ripening-control activation energy 18.0 kJ/mol; however, the interfacial reaction rate very slow, leading formation of thin IMC layer. HEA has potential applications in advanced electronic packaging technology, especially biomedical devices.
With a layer of Cu nanoparticle slurry, it's promising to achieve fast CuCu direct bonding at low temperature. To have deeper insight and better control the process, we apply molecular dynamics method simulate melting sintering behavior nanoparticles during process. The points from 2 nm 9 are simulated be 963 K 1298 K. smaller diameter nanoparticle, less stable it is. At same temperature, time for is than half that 8 nanoparticles. Based on these atomic insights, if can synthesis as small...
In the era of big data, advantages 3D packaging are becoming increasingly significant. addition, mismatch between coefficient thermal expansion (CTE) PCB and BGA components leads to dynamic warpage system, innovation low-temperature soldering have been a new trend. We developed fully mixed solder joint SAC305(Sn-3.0Ag-0.5Cu wt.%) ball Sn–58Bi(wt.%) paste by solid-liquid bonding technology. The mixing degree diffusion process two were calculated simulated mathematical calculation COMSOL...
Advanced high-energy-density sodium-ion batteries (SIBs) are inseparable from cathode materials with high specific capacities. Layered manganese-rich oxides (Na
With fast developments in the environmental-friendly industry, electrically conductive adhesive (ECA) composites with high electrical conductivity, mechanical strength, and electrochemical migration resistance as well low cost are highly desirable for emerging power electronics applications. In this study, a category of ECAs, namely, size-controllable sonochemical low-melting-point-alloy (LMPA) particle-incorporated transient liquid-phase ECAs (TLP-ECAs), excellent considerable has been...
Elemental two-dimensional (2D) materials, commonly referred to as Xenes, have attracted recent attention due their many unique/remarkable chemical and physical properties. Xenes hold immense promise for multifarious applications across...
Abstract The development of efficient electrocatalysts for ethanol oxidation reaction (EOR) is crucial the potential commercialization direct fuel cells, yet it faces significant challenges between catalytic performance and cost‐effectiveness. 2D materials have recently emerged as a promising group due to their large surface area, charge transport, tunable band structures, excellent activity. In this study, novel layered noble‐metal dichalcogenide, PtSe 2 , explored electrocatalysis from...
A novel compact planar microstrip-fed quaisi-Yagi antenna is investigated. The feeding structure directly realised by a microstrip line and has the advantage of avoiding introduction balun, transition, tapered or truncated structures, thereby decreasing design complexity. proposed shows measured impedance bandwidth from 2.74 to 4.25 GHz for return loss less than −10 dB, exhibits 13 dB front-to-back (F/B) ratio, –15 cross-polarisation, 8.77 absolute peak gain, 60° half power beam width (HPBW)...
Polarization holography is the superposition of differently polarized beams. Due to its ability record polarization states, some extraordinary optical phenomena were found in holography. For example, recently reported null-reconstruction phenomenon volume hologram odd for conventional which only records amplitude and phase. In this paper, we perform a thorough investigation null reconstruction recorded by orthogonal circularly waves. To explore mechanism behind phenomenon, an interferometry...
As advanced silicon manufacturing processes slow down in scaling, three-dimensional stacking of chips has become a future trend microelectronic industry. High-density bonding technology is one the core technologies used to achieve stacking. In this work, we explored new that possible manufacture high-density interconnects. We fabricated series sandwich structure solder joints with different thicknesses using SnBiIn-based nanoparticles under low temperature 100 °C. The intermetallic compound...