K.G. McCarthy

ORCID: 0000-0003-0624-4754
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About
Contact & Profiles
Research Areas
  • Advancements in Semiconductor Devices and Circuit Design
  • Semiconductor materials and devices
  • Radio Frequency Integrated Circuit Design
  • Analog and Mixed-Signal Circuit Design
  • Silicon Carbide Semiconductor Technologies
  • Electromagnetic Compatibility and Noise Suppression
  • Low-power high-performance VLSI design
  • Ferroelectric and Piezoelectric Materials
  • Integrated Circuits and Semiconductor Failure Analysis
  • Neuroscience and Neural Engineering
  • Advanced DC-DC Converters
  • Microwave and Dielectric Measurement Techniques
  • Microwave Dielectric Ceramics Synthesis
  • VLSI and Analog Circuit Testing
  • Energy Harvesting in Wireless Networks
  • Electrostatic Discharge in Electronics
  • Wireless Body Area Networks
  • CCD and CMOS Imaging Sensors
  • Acoustic Wave Resonator Technologies
  • Electronic Packaging and Soldering Technologies
  • Antenna Design and Analysis
  • Advancements in PLL and VCO Technologies
  • Microwave Engineering and Waveguides
  • Advanced Sensor and Energy Harvesting Materials
  • Innovative Energy Harvesting Technologies

University College Cork
2013-2024

KBR (United States)
2010-2012

National University of Ireland
2009

National Microelectronics Applications Centre (Ireland)
1996-2003

This letter presents a compact, single-feed, dual-band antenna covering both the 433-MHz and 2.45-GHz Industrial Scientific Medical (ISM) bands. The has small dimensions of 51 ×28 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . A square-spiral resonant element is printed on top layer for band. remaining space within spiral used to introduce an additional parasitic monopole bottom that at 2.45 GHz. Measured results show 10-dB...

10.1109/lawp.2015.2465831 article EN IEEE Antennas and Wireless Propagation Letters 2015-08-13

Compact MOSFET models for circuit simulation face several competing requirements, such as fast execution times, good accuracy and small memory requirements. This paper describes novel interpolation methods accurate evaluation of characteristics in weak, moderate, strong inversion regions. These form the basis a new table look-up model implemented SPICE3F5. The provides great flexibility adjustment accuracy, speed, consumption by providing choice interpolations data tables. Application to...

10.1109/tcad.2004.842818 article EN IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2005-02-28

A compact, planar antenna operating at 433 MHz is proposed for wireless smart systems with dimensions of 51 × 28 mm 2 including a ground plane, and printed on low‐cost FR4 material. Significant size reduction achieved using the variation an inverted‐F configuration square‐spiral section rectangular patch element. Fine‐tuning antenna's resonant frequency possible small capacitive stub. Sensor radio transceiver electronics can be accommodated above plane. The measured results indicate 10 dB...

10.1049/el.2013.4312 article EN Electronics Letters 2014-04-01

Modern analog circuits are heavily dependent on inductor performance, where the poor quality factor (Q) of silicon processes leads to degradation in circuit efficacy, especially at RF and microwave frequencies. Several techniques have been proposed enhance Q integrated on-chip inductors, but most effective method improvement is lower series resistance by increasing metal thickness. This paper presents cost-effective achieving a thick using standard 0.18-/spl mu/m multilayer BiCMOS process....

10.1109/tmtt.2005.848813 article EN IEEE Transactions on Microwave Theory and Techniques 2005-06-01

The paper introduces the context for emerging area of integrated power conversion. key applications driving this trend are outlined and principal competing technologies presented encompassing system in package, on chip embedded substrate solutions. A system-in-package, 30MHz dc-dc converter using a stacked co-packaging approach is demonstrated. Its enabling elements, including magnetics Si technology, IC with digital pulse width modulator on-chip capacitor, associated packaging techniques...

10.1109/estc.2010.5642892 article EN 2010-09-01

This paper describes a SPICE compatible subcircuit model of lateral pnp transistor, which was fabricated in 0.6 /spl mu/m CMOS process. The extraction dc parameter set for the device is more complicated than vertical because presence two parasitic bipolar transistors are formed by emitter/collector, base and substrate regions. Gummel-Poon does not predict current accurately. proposes method involves use incorporating three models [representing one junction (BJT's)]. development this model,...

10.1109/16.711364 article EN IEEE Transactions on Electron Devices 1998-01-01

A COMSOL Multiphysics <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</sup> model was created which provides accurate information on the resonant frequency, stress and power output of an ALN piezoelectric device. The maximum error in frequency found to be 4%. models accurately predicted trend for external impedances as well matched impedance energy harvesting. expected voltage current 1g acceleration also modeled.

10.1109/eurosime.2013.6529988 article EN 2013-04-01

In an RF system power amplifiers (PAs) typically consume the most power. This paper presents a buck converter design optimised for wideband code division multiple access (WCDMA) PA. The approach taken focuses on optimization of switch sizing based overall losses including output inductor losses. is 20 MHz switching and currents in range 200-500 mA. Experimented results are presented fabricated converter, with maximum measured efficiency 82%.

10.1109/apec.2009.4802705 article EN 2009-02-01

High-performance metal-insulator-metal (MIM) capacitors using novel Pb(Mg <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.33</sub> Nb xmlns:xlink="http://www.w3.org/1999/xlink">0.67</sub> ) xmlns:xlink="http://www.w3.org/1999/xlink">0.65</sub> Ti xmlns:xlink="http://www.w3.org/1999/xlink">0.35</sub> O xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> (PMNT) thin films were fabricated and investigated. The dielectric properties of the PMNT...

10.1109/led.2010.2052585 article EN IEEE Electron Device Letters 2010-07-29

The fabrication of a novel ultrasharp silicon microneedle array for use as physiological signal monitoring electrode is described. This work uses anisotropic potassium hydroxide wet etching and double-sided wafer patterning to simultaneously create on the front side wafer, through-silicon via from back side. technique eliminates limitations associated with other approaches that are used front-to-back electrical contact. Wearable prototypes have been assembled using these arrays,...

10.1016/j.proeng.2011.12.244 article EN Procedia Engineering 2011-01-01

The paper introduces the trend of integration and miniaturization power converters with potential for enhanced efficiency, form factor reduction cost reduction. To demonstrate concept highly integrated switched mode supply magnetic, a system-in-package DC-DC converter using stacked co-packaging approach is developed. A system was taken to design, functional integration, 3-D packaging realizing in package solution (PwrSiP). target capable handling an input voltage 5V frequencies up 40MHz. IC...

10.1109/ectc.2013.6575844 article EN 2013-05-01

This paper presents a method for measuring the complex permittivity of dielectric material on dielectric/metal stack without etching layer. A series circular capacitor test structures were designed and fabricated. For first time, unwanted capacitance <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Cp</i> , which is formed by oxide layer between bottom metal silicon substrate, was defined systematically investigated. The technique shown to be...

10.1109/ted.2012.2190365 article EN IEEE Transactions on Electron Devices 2012-05-10

Despite Wireless Sensor Networks (WSNs) significantly developing over the past decade, these networks, like most wireless remain susceptible to malicious interference and spectrum coexistence. Other vulnerabilities arise as WSN applications adopt open standards typically resource energy-constrained commercial-off-the-shelf equipment. Deployments include safety-critical such internet of things, medical, aerospace space deep-sea exploration. To manage safety privacy requirements across a...

10.1016/j.adhoc.2021.102562 article EN cc-by-nc-nd Ad Hoc Networks 2021-06-02

10.1016/s0026-2714(00)00138-4 article EN Microelectronics Reliability 2000-08-01

The detailed design and optimisation of a high current monolithic point-of-load (POL) buck converter is presented in this paper. approach taken to identify the major issues which account for power losses represent them as function device width. Having identified these loss sources quantified them, optimum sizes are obtained with 20 MHz switching frequency.

10.1109/apec.2008.4522918 article EN Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition 2008-02-01

The extremely high level of integration currently required within the wireless industry poses significant challenges at all technology steps from materials through processing to packaging. Capacitor design is a very important element this challenge. Recently there has been strong interest in use PMNT (Pb(Mg,Nb)TiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ) as thin-film layer semiconductor processes [1]. dielectric constant makes...

10.1109/icmts.2008.4509335 article EN 2008-03-01

The authors present the design of a tunable 433 MHz antenna that is tailored for wearable wireless sensor applications. This study first presents detailed analysis measured impedance characteristics chosen under test (AUT) in varying proximity to human subject. Instead limiting head and hand only, this measures AUT at distances from 11 different body positions. A novel equivalent circuit model then developed enables both free‐space total on‐body variation be rapidly computed using simulator...

10.1049/iet-map.2015.0712 article EN IET Microwaves Antennas & Propagation 2016-11-15

This paper introduces a switch supply dynamic comparator that, by means of reservoir capacitor, exhibits reduced effective voltage during the decision phase without requiring dedicated DC-DC down converter, pin, or external rail. The proposed achieves 28% reduction in power consumption compared to conventional design. An ultra-low-power 14-bit SAR ADC is implemented using comparator, where bootstrap also replaced with clock-boosting switch, enabling further compromising achievable SNDR. was...

10.1109/biocas58349.2023.10388868 article EN 2022 IEEE Biomedical Circuits and Systems Conference (BioCAS) 2023-10-19

This paper presents the design of a low-power capacitively-coupled CMOS instrumentation amplifier (INA) for long term bio potential measurement and recording applications. The increased demand low cost, portable wearable medical monitoring equipment EEG (electroencephalogram) ECG (electrocardiogram) is in turn giving rise to need very power, but high precision, analogue front ends. signals are differential characterized by amplitude (up 100µV up 5mV ECG), relatively bandwidth (0.5Hz –...

10.1049/cp.2010.0487 article EN 2010-01-01

This paper assesses the skin penetration mechanisms and insertion forces of a microneedle-based dry electrode for physiological signal monitoring. Using force-displacement measurements, it is shown that these ultrasharp microneedles, fabricated using bulk micromachining process which have tip radii as low 50 nm, penetrate in-vivo human smoothly without measurable rupturing action. Skin staining techniques been used to demonstrate 95% achieved at just 20 mN per needle. These very facilitate...

10.1109/biocas.2013.6679642 article EN 2022 IEEE Biomedical Circuits and Systems Conference (BioCAS) 2013-10-01

This paper addresses the issue of thin-film characterization through wafer-probe measurements and electromagnetic simulation (EM simulation). The parameters are optimized to get best fit between measured simulated S-parameters. Based on results obtained an optimization methodology for modeling test structure is presented. has been verified by investigating S-parameters Coplanar-Waveguide (CPW) transmission lines with a known SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML"...

10.1109/rme.2009.5201350 article EN 2009-07-01

This paper presents a method for measuring the complex permittivity of dielectric material on dielectric/metal stack. A series circular capacitor and transmission line test structures are designed fabricated. The methodology has been verified by constant known SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> layer using Capacitance-Voltage (C-V) measurement scattering parameter (S-parameter) measurements. combination C-V S-parameter...

10.1109/icmts.2009.4814646 article EN 2009-03-01
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