A5114374179- Particle physics theoretical and experimental studies
- High-Energy Particle Collisions Research
- Quantum Chromodynamics and Particle Interactions
- Particle Detector Development and Performance
- Dark Matter and Cosmic Phenomena
- Cosmology and Gravitation Theories
- Neutrino Physics Research
- Computational Physics and Python Applications
- Radiation Detection and Scintillator Technologies
- Black Holes and Theoretical Physics
- Astrophysics and Cosmic Phenomena
- Particle Accelerators and Free-Electron Lasers
- Distributed and Parallel Computing Systems
- CCD and CMOS Imaging Sensors
- Radiation Effects in Electronics
- Atomic and Subatomic Physics Research
- Medical Imaging Techniques and Applications
- Advanced Semiconductor Detectors and Materials
- Nuclear reactor physics and engineering
- Advancements in Semiconductor Devices and Circuit Design
- Advanced Data Storage Technologies
- Superconducting Materials and Applications
- Fluid Dynamics and Heat Transfer
- Advanced X-ray and CT Imaging
- Big Data Technologies and Applications
Universität Hamburg
2011-2025
University of Göttingen
2018-2024
Institute for High Energy Physics
2015-2023
Universitat Autònoma de Barcelona
2015-2022
The University of Adelaide
2015-2022
University of Science and Technology of China
2020
University of the Witwatersrand
2020
Institute of High Energy Physics
2020
Chinese Academy of Sciences
2020
Bahçeşehir University
2019
For the high luminosity upgrade of LHC at CERN, ATLAS is considering addition a High Granularity Timing Detector (HGTD) in front end cap and forward calorimeters |z|= 3.5 m covering region 2.4 <|η|< 4 to help reducing effect pile-up. The chosen sensors are arrays 50 μm thin Low Gain Avalanche Detectors (LGAD). This paper presents results on single LGAD with surface area 1.3×1.3 mm2 2×2 pads or 3×3 each different implant doses p+ multiplication layer. They obtained from data collected during...
The ATLAS Forward Proton (AFP) detector is intended to measure protons scattered at small angles from the interaction point. To this end, a combination of 3D Silicon pixel tracking modules and Quartz-Cherenkov time-of-flight (ToF) detectors installed 210 m away point both sides ATLAS. Beam tests with an AFP prototype combining timing sub-detectors common readout have been performed CERN-SPS test-beam facility in November 2014 September 2015 complete system integration study performance....
Silicon detectors based on the HV-CMOS technology are being investigated as possible candidate for outer layers of ATLAS pixel detector High Luminosity LHC. In this framework H35Demo ASIC has been produced in 350 nm AMS (H35). The chip a large area (18.49 × 24.40 mm2) and includes four different matrices three test structures. paper radiation hardness properties, particular evolution depletion region with fluence is studied using edge-TCT Measurements structures from chips substrate...
Low Gain Avalanche Detectors (LGADs) are silicon sensors with a built-in charge multiplication layer providing gain of typically 10 to 50. Due the combination high signal-to-noise ratio and short rise time, thin LGADs provide good time resolutions. an active thickness about 45 μm were produced at CNM Barcelona. Their gains resolutions studied in beam tests for two different implantation doses, as well before after irradiation neutrons up 1015 neq/cm2. The showed expected decrease fixed...
Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of HL-LHC detector upgrades. Prototype sensors with sizes 50$\times$50 and 25$\times$100 $\mu$m$^{2}$ connected to existing ATLAS FE-I4 readout chip produced by CNM Barcelona. Irradiations up particle fluences $3\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$, beyond full expected at end lifetime, carried out Karlsruhe CERN. The performance devices has measured in laboratory beam tests...
The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close beamline (2–3 mm). This implies need of slim edges 100–200 μm width for sensor side facing beam minimise dead area. Another challenge is an expected non-uniform irradiation sensors.
3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of HL-LHC upgrade ATLAS detector. are already in use today IBL and AFP experiments. These based on 50x250 um2 large pixels connected to FE-I4 readout chip. Detectors this generation were irradiated fluences demonstrated excellent radiation hardness with operational voltages low 180 V power dissipation 12--15 mW/cm2 at a fluence about 1e16 neq/cm2, measured -25 degree C. Moreover, cope...
Abstract The High Granularity Timing Detector (HGTD) will be installed in the ATLAS detector to mitigate pile-up effects during Luminosity (HL) upgrade of Large Hadron Collider (LHC) at CERN. design HGTD is based on use Low Gain Avalanche Detectors (LGADs), with an active thickness 50 μm, that allow measure high-precision time arrival particles. improve particle-vertex assignment by measuring track a resolution ranging from approximately 30 ps beginning HL-LHC operations end. Performances...
The ATLAS Forward Proton (AFP) detector is designed to identify events in which one or two protons emerge intact from the LHC collisions. AFP will consist of a tracking detector, measure momentum protons, and time flight system reduce background multiple proton-proton interactions. Following an extensive qualification period, 3D silicon pixel sensors were selected for tracker. produced at CNM (Barcelona) during 2014. tracker module assembly quality control was performed IFAE 2015. first arm...
We present the construction of optical part ToF (time-of-flight) subdetector prototype for AFP (ATLAS Forward Proton) detector. The detector in conjunction with a 3D silicon pixel tracker will tag and measure protons originating central exclusive interactions p + → X p, where two outgoing are scattered very forward directions. is required to reduce so-called pileup backgrounds that arise from multiple proton same bunch crossing at high luminosity. background can fake signal interest, extra...
In order to increase its discovery potential, the Large Hadron Collider (LHC) accelerator will be upgraded in next decade. The high luminosity LHC (HL-LHC) period demands new sensor technologies cope with increasing radiation fluences and particle rates. ATLAS experiment replace entire inner tracking detector a completely silicon-only system. 3D pixel sensors are promising candidates for innermost layers of Pixel due their excellent hardness at low operation voltages power dissipation...
Charge multiplication (CM) occuring in highly radiation-damaged Si sensors is currently under discussion as an option to overcome the strong trapping of charge carriers innermost pixel layers future Super-LHC detectors.In this work, CM was studied p + -n epitaxial silicon pad diodes 75, 100 and 150 µm thickness after 24 GeV/c proton irradiation with 1 MeV neutron equivalent fluences order 10 16 cm -2 .Basic properties like development location region, proportionality between measured...
3D silicon detectors, in which the electrodes penetrate sensor bulk perpendicular to surface, have recently undergone a rapid development from R&D over industrialisation their first installation real high-energy-physics experiment.Since June 2015, ATLAS Insertable B-Layer is taking collision data with pixel detectors.At same time, preparations are advancing install detectors forward trackers such as Forward Proton detector or CMS-TOTEM Precision Spectrometer.For those experiments, main...
We present results of the timing performance studies optical part and front-end electronics time-of-flight subdetector prototype for ATLAS Forward Proton (AFP) detector obtained during test campaigns at CERN-SPS test-beam facility (120 GeV π+ particles) in July 2016 October 2016. The (ToF) conjunction with a 3D silicon pixel tracker will tag measure protons originating central exclusive interactions p + → X p, where two outgoing are scattered very forward directions. ToF is required to...
A new generation of 3D silicon pixel detectors with a small size 50$\times$50 and 25$\times$100 $\mu$m$^{2}$ is being developed for the HL-LHC tracker upgrades. The radiation hardness such was studied in beam tests after irradiation to fluences up $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$. At this fluence, an operation voltage only 100 V needed achieve 97% hit efficiency, power dissipation 13 mW/cm$^2$ at -25$^{\circ}$C, considerably lower than previous sensor generations planar sensors.