A5112364116- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Photonic Crystals and Applications
- Advanced Photonic Communication Systems
- Optical Network Technologies
- Nanofabrication and Lithography Techniques
- Optical Coherence Tomography Applications
- Nonlinear Optical Materials Studies
- Islamic Finance and Communication
- Islamic Studies and Radicalism
- Advanced Surface Polishing Techniques
- Optical Coatings and Gratings
- Laser Material Processing Techniques
- 3D IC and TSV technologies
- Computer Science and Engineering
- Perovskite Materials and Applications
- Advanced Photocatalysis Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Layered Double Hydroxides Synthesis and Applications
- Education and Character Development
- SMEs Development and Digital Marketing
- Educational Methods and Impacts
- Halal products and consumer behavior
- Advanced optical system design
- Contemporary Christian Leadership and Education
Toyohashi University of Technology
2025
Comilla University
2025
Karlsruhe Institute of Technology
2013-2021
Universitas Nahdlatul Ulama Indonesia
2021
Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between chips and can greatly simplify system assembly. As a key advantage, the shape trajectory bonds be adapted mode-field profiles positions chips, thereby offering an attractive alternative conventional assembly techniques that rely on technically complex costly high-precision alignment. However, while fundamental advantages bonding concept have...
Photonic wire bonding is demonstrated to enable highly efficient coupling between multicore fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides the fiber facet tapered silicon-on-insulator waveguides. can easily compensate inaccuracies core placement in cross-section, does not require active alignment, well suited for automated fabrication. We report design, fabrication, characterization bonds. In a...
Efficient coupling of III-V light sources to silicon photonic circuits is one the key challenges integrated optics. Important requirements are low losses, as well small footprint and high yield overall assembly, along with ability use automated processes for large-scale production. In this paper, we demonstrate that wire bonding addresses these by exploiting direct-write two-photon lithography in-situ fabrication three-dimensional freeform waveguides between optical chips. a series...
Abstract Combining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along small linewidths. However, fabrication of such devices still relies technologically demanding monolithic integration heterogeneous material systems requires costly high-precision package-level assembly, often based active alignment,...
Wafer-level probing of photonic integrated circuits is key to reliable process control and efficient performance assessment in advanced production workflows. In recent years, optical surface-coupled devices such as vertical-cavity lasers, top-illuminated photodiodes, or silicon with surface-emitting grating couplers has seen great progress. contrast that, wafer-level edge-emitting hard-to-access vertical facets at the sidewalls deep-etched dicing trenches still represents a major challenge....
We demonstrate coupling of a horizontal-cavity surface-emitting laser (HCSEL) to silicon photonic chip using wire bonding. The technique does not require high-precision alignment the chips. Measured losses amount approximately 4.2 dB.
We demonstrate an eight-channel hybrid multi-chip module comprising InP lasers, silicon photonic modulators, and parallel single-mode fibers, all connected via wire bonds. transmit 28 GBd PAM-4 signals at a total data rate of 448 Gbit/s over 2 km.
A four-core fiber is coupled to a silicon photonic chip by wire bonding. The technique does not require active alignment and well suited for automated fabrication. Measured coupling losses amount 1.7 dB.
We demonstrate low-loss coupling to single-mode fibers and photonic integrated circuits (PIC) using in-situ fabrication of free-form microlenses on device facets. Measured losses down 0.8 dB (0.5 dB) are achieved for chip-fiber (fiber-fiber) interfaces.
We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using wire bonding. confirm that back-reflections from the chip do not deteriorate linewidth lasers.
We demonstrate a 3D printed ultra-broadband and highly efficient out-of-plane coupler for photonic integrated circuits. The coupling efficiency at λ = 1550 nm is −0.8 dB with 1 bandwidth exceeding 100 nm.
We demonstrate a four-channel hybrid multi-chip module comprising InP lasers, silicon-organic (SOH) modulators, and single-mode fibers, all connected via photonic wire bonds. transmit 56 GBd QPSK 16QAM signals at total data rate of 784 Gbit/s over 75 km.
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling light to etched facets nanophotonic waveguides. The technique is widely applicable different integration platforms.
We demonstrate an InP/Silicon integrated ECL using a photonic wirebond as intra-cavity coupling element. In our proof-of-concept experiments, we 50 nm tuning range, SMSR above 40 dB, and linewidths of 750 kHz.
A compact micro-optical interferometer is presented that combines two optical 90° hybrids or, alternatively, four delay interferometers into one structure sharing tunable line. The can function as a frontend of either coherent receiver or self-coherent by adjusting the waveplates and We built prototype on LIGA bench. characterized device demonstrated its functionality successful reception 112 Gbit/s signal.
We propose and experimentally demonstrate a novel class of photonic integrated circuits (PIC) that can be configured by hardwiring functional building blocks using 3D-printed single-mode waveguides. The concept allows realizing multitude functionalities with single PIC design.
Limitations of silicon photonics can be overcome by hybrid integration or photonic multi-chip systems. We give an overview on recent progress regarding silicon-organic (SOH) as well enabled wire bonding.
Photonic wire bonding exploits three-dimensional (3D) two-photon lithography to fabricate single-mode connections between nanophotonic circuits that are located on different chips. The shape of the photonic bonds can be adjusted positions chips such high-precision alignment becomes obsolete. technique enables multi-chip modules combine strengths optical integration platforms.
Limitations of silicon photonics can be overcome by hybrid integration photonic or plasmonic circuits with organic materials multi-chip systems. We give an overview on our recent progress regarding both silicon-organic (SOH) and enabled wire bonding.
The functionality of silicon photonics can be extended by combination with organic materials and multi-chip integration. We give an overview the underlying concepts silicon-organic hybrid (SOH) integration photonic wire bonding.
Photonic wire bonding enables advanced multi-chip assemblies that combine the specific strengths of different photonic integration platforms. The technique is based on in-situ fabrication 3D freeform waveguides by two-photon polymerization. We introduce concept and show first experimental demonstrations.