A5044741230- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Photonic Crystals and Applications
- Nanofabrication and Lithography Techniques
- Flexible and Reconfigurable Manufacturing Systems
- Manufacturing Process and Optimization
- Optical Coherence Tomography Applications
- Advanced X-ray Imaging Techniques
- Optical Network Technologies
- Advanced Photonic Communication Systems
- Product Development and Customization
- Nonlinear Optical Materials Studies
- Advanced MEMS and NEMS Technologies
- Astrophysical Phenomena and Observations
- Laser-Plasma Interactions and Diagnostics
- Advanced Surface Polishing Techniques
- Advanced Data Storage Technologies
- Advanced Fiber Optic Sensors
- Neural Networks and Reservoir Computing
- Crystallography and Radiation Phenomena
- Plasma Diagnostics and Applications
- Laser Material Processing Techniques
- Advancements in Photolithography Techniques
- AI-based Problem Solving and Planning
- Reinforcement Learning in Robotics
Karlsruhe Institute of Technology
2000-2021
FZI Research Center for Information Technology
2001-2010
Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between chips and can greatly simplify system assembly. As a key advantage, the shape trajectory bonds be adapted mode-field profiles positions chips, thereby offering an attractive alternative conventional assembly techniques that rely on technically complex costly high-precision alignment. However, while fundamental advantages bonding concept have...
Photonic wire bonding is demonstrated to enable highly efficient coupling between multicore fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides the fiber facet tapered silicon-on-insulator waveguides. can easily compensate inaccuracies core placement in cross-section, does not require active alignment, well suited for automated fabrication. We report design, fabrication, characterization bonds. In a...
Efficient coupling of III-V light sources to silicon photonic circuits is one the key challenges integrated optics. Important requirements are low losses, as well small footprint and high yield overall assembly, along with ability use automated processes for large-scale production. In this paper, we demonstrate that wire bonding addresses these by exploiting direct-write two-photon lithography in-situ fabrication three-dimensional freeform waveguides between optical chips. a series...
Abstract Early and efficient disease diagnosis with low-cost point-of-care devices is gaining importance for personalized medicine public health protection. Within this context, waveguide-(WG)-based optical biosensors on the silicon-nitride (Si 3 N 4 ) platform represent a particularly promising option, offering highly sensitive detection of indicative biomarkers in multiplexed sensor arrays operated by light visible-wavelength range. However, while passive Si -based photonic circuits lend...
X-ray grating-based interferometry promises unique new diagnostic possibilities in medical imaging and materials analysis. To transfer this method from scientific laboratories or small-animal applications to clinical radiography applications, compact setups with a large field of view (FoV) are required. Currently the FoV is limited by grating area, which restricted due complex manufacturing process. One possibility increase tiling individual tiles create one area mounted on carrier...
Whispering-gallery mode (WGM) microdisk lasers show great potential for highly sensitive label-free detection in large-scale sensor arrays. However, when used practical applications under normal ambient conditions, these devices suffer from temperature fluctuations and photobleaching. Here we demonstrate that challenges can be overcome by a novel referencing scheme allows simultaneous compensation of drift The technique relies on reference structures protected locally dispensed passivation...
Complex photonic-integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity circuit, particular it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC relies on 3D-printed freeform overpasses (WOP). We experimentally demonstrate viability our approach using example 4 × switch-and-select...
Grating based X-ray differential phase contrast imaging (DPCI) allows for high of materials with similar absorption characteristics. In the last years' publications, small animals or parts human body like breast, hand, joints blood vessels have been studied. Larger object s could not be investigated due to restricted field view limited by available grating area. this paper, we report on a new stitching method increase area significantly: individual gratings are merged carrier substrate....
We demonstrate coupling of a horizontal-cavity surface-emitting laser (HCSEL) to silicon photonic chip using wire bonding. The technique does not require high-precision alignment the chips. Measured losses amount approximately 4.2 dB.
Grating-based x-ray differential phase-contrast imaging (DPCI) is capable of acquiring information based on phase-shift and dark-field signal, in addition to conventional absorption-contrast. Thus DPCI gives an advantage investigate composite materials with component wise similar absorption properties like soft tissues. Due technological challenges fabricating high quality gratings over a large extent, the field view (FoV) systems limited grating area couple square centimeters. For many...
We demonstrate an eight-channel hybrid multi-chip module comprising InP lasers, silicon photonic modulators, and parallel single-mode fibers, all connected via wire bonds. transmit 28 GBd PAM-4 signals at a total data rate of 448 Gbit/s over 2 km.
We demonstrate low-loss coupling to single-mode fibers and photonic integrated circuits (PIC) using in-situ fabrication of free-form microlenses on device facets. Measured losses down 0.8 dB (0.5 dB) are achieved for chip-fiber (fiber-fiber) interfaces.
We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using wire bonding. confirm that back-reflections from the chip do not deteriorate linewidth lasers.
Multi-photon lithography allows us to complement planar photonic integrated circuits (PIC) by in-situ 3D-printed freeform waveguide structures. However, design and optimization of such waveguides using time-domain Maxwell's equations solvers often requires comparatively large computational volumes, within which the structure interest only occupies a small fraction, thus leading poor efficiency. In this paper, we present solver-independent transformation-optics-(TO-) based technique that...
Assembly of products from the micro and meso domain like micro-optical systems and/or micro-mechanical actuators is often done manually with increasing product volumes more automatically. According to specific needs associated size, such implementations should be realised in an adapted way without just downscaling macro process equipment solutions. This leads Mini-/Microfactory concepts which have been under development since years different working groups. The paper presents new microFLEX...
We demonstrate a 3D printed ultra-broadband and highly efficient out-of-plane coupler for photonic integrated circuits. The coupling efficiency at λ = 1550 nm is −0.8 dB with 1 bandwidth exceeding 100 nm.
This paper presents the hot-embossing replication of self-centering fiber alignment structures for high-precision, single-mode optical connectors. To this end, a metal mold insert was fabricated by electroforming polymer prototype patterned means deep proton writing (DPW). achieve through-hole structures, we developed postembossing process step to remove residual layer inherently present in hot-embossed structures. The geometrical characteristics replicas are compared, before and after...
Abstract A novel method is demonstrated for ordered deposition of thin lamellar objects from a liquid environment onto solid substrates by solid/fluid/solid-driven organisation. Surface functionalisation forms template pattern that accumulates the site-selective wetting target area without need physical fluid containment. Contrary to conventional handling methods, no mechanical contact occurs, which facilitates wrinkles or ruptures. An additive and subtractive process creation such templates...