A5037912201- Thermal properties of materials
- Graphene research and applications
- Electronic Packaging and Soldering Technologies
- Carbon Nanotubes in Composites
- Heat Transfer and Optimization
- 3D IC and TSV technologies
- Tribology and Wear Analysis
- Thermal Radiation and Cooling Technologies
- Aluminum Alloys Composites Properties
- Graphene and Nanomaterials Applications
- Advanced Sensor and Energy Harvesting Materials
- Advancements in Battery Materials
- Supercapacitor Materials and Fabrication
- Advanced ceramic materials synthesis
- Metal and Thin Film Mechanics
- Adhesion, Friction, and Surface Interactions
- Advanced Thermoelectric Materials and Devices
- Injection Molding Process and Properties
- nanoparticles nucleation surface interactions
- Diamond and Carbon-based Materials Research
- Carbon and Quantum Dots Applications
- Metallurgical and Alloy Processes
- Nanofabrication and Lithography Techniques
- Nanomaterials and Printing Technologies
- Nanofluid Flow and Heat Transfer
Chalmers Industriteknik
2024
Chalmers University of Technology
1999-2024
Smart High Tech (Sweden)
2013-2022
Göteborgs Stads
2014
Shanghai University
2011-2012
Shanghai Institute of Microsystem and Information Technology
2011
Abstract Due to substantial phonon scattering induced by various structural defects, the in‐plane thermal conductivity ( K ) of graphene films (GFs) is still inferior commercial pyrolytic graphite sheet (PGS). Here, problem solved engineering structures GFs in aspects grain size, film alignment, and thickness, interlayer binding energy. The maximum reaches 3200 W m −1 outperforms PGS 60%. superior strongly related its large intact grains, which are over four times larger than best PGS....
Abstract The high thermal conductivity of graphene and few-layer undergoes severe degradations through contact with the substrate. Here we show experimentally that management a micro heater is substantially improved by introducing alternative heat-escaping channels into graphene-based film bonded to functionalized oxide amino-silane molecules. Using resistance temperature probe for in situ monitoring demonstrate hotspot was lowered ∼28 °C chip operating at 1,300 W cm −2 . Thermal probed...
The present work is to introduce nanoparticles in micro-sized metal particles study particle distribution polymer matrix. Previous examinations of the silver-filled reveal that fillers appear as full density silver flakes, while nanoparticle highly porous agglomerates, similar open-cell foams. Actually little has been carried out cross-sectional area a particle-particle-contact isotropically conductive adhesives (ICA). In this study, transmission electron microscope chosen main measure...
Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, their specific contact resistances extracted from electrical measurements approximately 1.2 × 10−3 Ω cm2 4.5 10−4 cm2, respectively. Detailed facts importance to specialist readers published as "Supporting Information". Such documents peer-reviewed, but not copy-edited...
Through-silicon vias (TSVs) filled with densified and transferred carbon nanotube (CNT) forests are experimentally demonstrated. The filling is achieved by a postgrowth low-temperature transfer process at 200 instead of direct CNT growth in the normally requiring high temperature. A vapor densification method also applied to densify as-grown forests, which allows for packing more CNTs reduce their resistances. CNT-filled TSVs fabricated based on these two key steps show CMOS compatibility...
During the last decades, there has been growing interest in using therapeutic messager RNA (mRNA) together with drug delivery systems. Naked, unformulated mRNA is, however, unable to cross cell membrane and is susceptible degradation. Here we use graphene quantum dots (GQDs) functionalized polyethyleneimine (PEI) as a novel system. Our results show that these modified GQDs can be used deliver intact functional Huh-7 hepatocarcinoma cells at low doses and, are not toxic, although cellular...
Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at between two materials, greatly conductance when solid surface attached together. The last decade has provided significant development high-performing TIMs, and this paper makes a summarized review recent progress topic. Current state of art commercial TIM types presented, discussed in regards their advantages...
A template-assisted method that enables the growth of covalently bonded three-dimensional carbon nanotubes (CNTs) originating from graphene at a large scale is demonstrated. Atomic force microscopy-based mechanical tests show CNT structure can effectively distribute external loading throughout network to improve strength material.
During the last decade, graphene foam emerged as a promising high porosity 3-dimensional (3D) structure for various applications. More specifically, it has attracted significant interest solution thermal management in electronics. In this study, we investigate possibility to use such porous materials heat sink and container phase change material (PCM). Graphene (GF) was produced using chemical vapor deposition (CVD) process attached test chip sintered silver nanoparticles (Ag NPs). The...
Abstract Graphene and carbon nanotubes have received much attention for thermal management application due to their unique performance. Theoretical work suggests that a covalent bond can combine 1D with 2D graphene together extend the excellent property three dimensions heat dissipation. This paper experimentally demonstrates high dissipation capability of freestanding 3D multiwall nanotube (MWCNT) hybrid material. Using high‐resolution transmission electron microscopy pulsed photothermal...
Finite element (FE) simulation is adopted as a fundamental tool to evaluate the mechanical reliability of packaging structures for electronic devices. Nevertheless, determination properties sintered silver nanoparticles (AgNP) remains challenging traditional tensile test difficult be performed at limited size. In current study, spherical nanoindentation utilized measure applied load-penetration depth responses AgNP reinforced by SiC microparticles various weight ratios (0.0, 0.5, 1.0 and 1.5...
Thermal treatment of carbon nanotubes (CNTs) can significantly improve their mechanical, electrical and thermal properties due to reduced defects increased crystallinity. In this work we investigate the effect annealing at 3000 °C vertically aligned CNT arrays synthesized by chemical vapor deposition (CVD) on graphite. Raman measurements show a drastically amount and, together with transmission electron microscope (TEM) diffraction measurements, an average crystallite size around 50%, which...
Carbon nanotube (CNT) array thermal interface materials (TIMs) are promising candidates for high-performance applications in terms of performance. However, order to be useful commercial applications, the reliability interfaces is an equally important parameter, which so far has not been thoroughly investigated. In this study, CNT TIMs investigated through accelerated aging. The roles height and substrate configuration studied their relative impact on resistance degradation. After aging,...
A novel carbon fiber solder matrix composite for thermal management of microelectronic devices.