A5085564117- Advanced MEMS and NEMS Technologies
- Silicon Carbide Semiconductor Technologies
- Heat Transfer and Optimization
- Sensor Technology and Measurement Systems
- Induction Heating and Inverter Technology
- Particle accelerators and beam dynamics
- Particle Accelerators and Free-Electron Lasers
- Advancements in Semiconductor Devices and Circuit Design
- Parallel Computing and Optimization Techniques
- Particle Detector Development and Performance
- Electromagnetic Compatibility and Noise Suppression
- Wireless Sensor Networks for Data Analysis
- Software Engineering and Design Patterns
- Thermal properties of materials
- Low-power high-performance VLSI design
- Mechanical and Optical Resonators
- Radiation Effects in Electronics
- 3D IC and TSV technologies
- Analog and Mixed-Signal Circuit Design
- Distributed and Parallel Computing Systems
- Semiconductor materials and devices
- Embedded Systems Design Techniques
- Electronic Packaging and Soldering Technologies
- Acoustic Wave Resonator Technologies
- Magnetic confinement fusion research
Lodz University of Technology
2013-2022
Stocznia Gdynia (Poland)
2018
University of Łódź
2007-2016
Medical University of Lodz
2012-2015
Université de Toulouse
2009
Centre National de la Recherche Scientifique
1987-2009
Deutsches Elektronen-Synchrotron DESY
2008
Mikroelektronika (Czechia)
2007
Laboratoire d'Analyse et d'Architecture des Systèmes
1988-2003
Institut d'Économie Industrielle
1988
With ever-increasing requirements for higher power hybrid and integrated circuits, thermal design considerations means analysis have become of fundamental importance. A new approach analyzing the heat flow across devices substrates is described. Semi-analytic solutions are derived within context a multilayer model. These amenable to straightforward computer evaluation can serve as basis computer-aided design. Important features in structures, such spreading coupling, treated, an example,...
A comprehensive approach to generation of electrothermal models silicon carbide (SiC) power Schottky diodes is presented. Both the electrical and thermal parts model are behavioral. The one was developed in order accurately represent nonlinear properties SiC merged PiN (MPS) diodes. Its parameters automatically obtained with a dedicated numerical procedure. derivation differs from earlier approaches because it based on analysis constant spectrum temperature response modeled device. Simple...
This paper investigates the influence of nonlinearities on electronic device thermal transient responses. The discussions in are based practical examples where responses a power recorded various boundary conditions for different values dissipated power. Then, measurement results analysed using Network Identification by Deconvolution method and differences between particular cases discussed detail. presented experimental demonstrate that due to temperature dependence model parameters might...
This paper presents a thermal model of electronic circuit based on an analytical solution the heat equation. In particular, question modelling radiation cooling is discussed. The proposed with temperature dependent exchange coefficient applied for analysis integrated circuit. Simulation results are validated both infrared and p–n junction measurements.
One of the remaining problems in iris recognition is implementation its efficient hardware systems. The difficulty arises from fact that methods forming part this type authentication process are fairly complex. Furthermore, next generation algorithms for will become even more complex to enhance reliability and functionality currently used solutions. An example such an intensive processing task image quality assessment segmentation using video signal obtained at-a-distance on-the-move. Thus,...
This work describes the web applications based on J2EE platform indicating model-view-controller (MVC) model, struts framework and file upload issues. The development of internet technology will to standardize mechanisms used in implementation was basis background for platform. project international office TUL service is an application above mentioned environment. specification closely connected with activities needs staff office. article presents use MVC model example open source...
This paper introduces Perplexus, a European project that aims to develop scalable hardware platform made of custom reconfigurable devices endowed with bio-inspired capabilities. will enable the simulation large-scale complex systems and study emergent behaviors in virtually unbounded wireless network computing modules. The final infrastructure be used as tool for three applications: neurobiological modeling, culture dissemination cooperative collective robotics. Perplexus provide novel...
Fast evolution of high-performance cameras in recent years has made them promising tools for observing transient and fast events large-scale scientific experiments. Complex experiments, such as ITER, take advantage imaging system consisting several working the range visible infrared light. However, application devices requires a usage data acquisition systems able to read transfer large amount data, reaching even 10 Gbit/s single camera. The MTCA.4 form factor fulfils requirements demanding...
Atmospheric pressure is the most objective weather factor because regardless of if outdoors or indoors it affects all objects in same way. The majority previous studies have used average daily values atmospheric a bioclimatic analysis and found no correlation with blood changes. main our research was to assess relationship between recorded frequency 1 measurement per minute results 24-h monitoring patients treated hypertension different seasons moderate climate City Łódź (Poland).The study...
The proper design and simulation of modern electronic microsystems oriented towards environment monitoring requires accurate models various ambient sensors. In particular, this paper presents a comprehensive model an ion sensitive field effect transistor (ISFET). can be employed straightforwardly for simulations at device, circuit or system level. First, the was validated with electrical measurements real structures performed different concentration temperature values. Then, ISFET sensor...
This paper presents a method for thermal simulation of electronic circuits using an analytical solution the three-dimensional heat equation resulting from appropriate circuit model. The temperature fields in multilayered structures are computed analytically employing Green's functions method. entire methodology is illustrated detail on particular examples containing multiple sources. Compared to previous papers published by authors, has been extended including possibility simulating...
Iris recognition is accepted as one of the most efficient biometric method. Implementing this method to practical system requires special image preprocessing where iris feature extraction plays a crucial role. Recognition preceeded by localization which consists in finding boundaries well eyelids. In paper short introduction into and wavelet-based identification optimized for embedded systems described. Proposed solution was applied high resolution images taken under near infrared light
This paper studies hot spot and thermal coupling problems in future multicore architectures as CMOS technology scales from 65 nm feature size to 15 nm. We demonstrate that the between neighboring cores will dramatically increase smaller sizes. The simulation were based on solving heat equation using analytical Green's function method. Our simulations indicate just after 100 ms of operation 20% 42% steady state might reach even 65%. finding uncovers a major challenge for design multi-core...
Linear accelerators, like the Free-electron LASer in Hamburg (FLASH) or European X-Ray Free Electron Laser (E-XFEL) take advantage of digital Low Level Radio Frequency (LLRF) system to control phase and amplitude an electromagnetic field inside superconducting cavities. The real-time LLRF system, processing data within a few microseconds, has fulfil performance requirements provide comprehensive monitoring diagnostics. AMC-based controller (DAMC-TCK7) board was developed as general purpose...
All 3-core cables require fillers to fill the space between insulated cores and belt insulation or a sheath. The equations given in IEC 287 Neher-McGrath paper (1957) for internal thermal resistance of were developed cables. For such cables, it was assumed that filler materials have same resistivities. In reality, variety are used as fillers. majority these will higher resistivity than insulation. previous paper, new formula compute value belted taking into account filler. this screened...