Summary Background and objectives The association between mortality physical activity based on self-report questionnaire in hemodialysis patients has been reported previously. However, because is a subjective assessment, evaluating true difficult. This study investigated the prognostic significance of habitual 7-year survival cohort clinically stable adequately dialyzed patients. Design, setting, participants, & measurements A total 202 Japanese outpatients who were undergoing...

Cysteine synthase [O-acetyl-L-serine(thiol)-lyase, EC 4.2.99.8] (CSase), which is responsible for the terminal step of cysteine biosynthesis, catalyzes formation L-cysteine from O-acetyl-L-serine (OAS) and hydrogen sulfide. Three T-DNA vectors carrying a spinach (Spinacia oleracea) cytoplasmic CSase A cDNA (K. Saito, N. Miura, M. Yamazaki, H. Horano, I. Murakoshi [1992] Proc Natl Acad Sci USA 89: 8078-8082) were constructed as follows: pCSK3F, driven by cauliflower mosaic virus (CaMV) 35S...

This paper outlines package stacking process guidelines for a package-on-package (PoP) configuration. PoP stacks currently in production or development consist of bottom containing high performance logic device designed to receive mating top typically capacity combination memory devices. System manufactures achieve lowest cost and maximum logistical benefits, when these two components are sourced from different IC suppliers then stacked the final board assembly flow. Thus, is key technology...

Krüppel-like factor 5 (KLF5) plays an oncogenic role and has diverse functions in cancer cells. However, correlation between KLF5 clinical outcome not been determined patients with colorectal liver metastasis. Herein, we analyzed 65 who developed Clinical effects were assessed through immunohistochemical analysis of primary lesions metastatic lesions. High expression these tissues correlated the presence vascular invasion, elevated serum carbohydrate antigen 19-9 levels, large diameters...

The cDNA clones that encode a putative mitochondrion-localizing isoform of cysteine synthase (O-acetyl-L-serine(thio1)-lyase, 0-acetyl-L-serine acetate-lyase (adding hydrogen sulfide), EC 4.2.99.8), which is denoted as C, were isolated from spinach (Spinacia oleracea L.).The encodes polypeptide 368 amino acids containing transit peptide 3 0 4 at the N terminus.This leader sequence exhibited several structural features common to other mitochondrion-targeting peptides.Homology was also...

This paper describes the first design and fabrication of a large 2.5D glass interposer with 50 μm pitch chip-level interconnections made 6 layers 3 re-distribution (RDL) wiring. Many applications including high-performance networking cloud computing data centers require ultra-high-bandwidth magnitude 512 GB/s. Silicon-based interposers are only approaches being pursued by industry to meet this need, enabled sub-micron BEOL wiring in wafer fabs. Such interposers, however, too expensive for...

Interposer technology is becoming important to interconnect ultra-high performance ICs with density I/Os. Silicon interposers fabricated by back-end of line (BEOL) wafer processes address these wiring requirements, but are limited their high cost and electrical losses. Organic have limitations too. Their due poor dimensional stability, which require larger capture pads, limit the I/O Glass has been proposed Georgia Tech [1-4] as a superior interposer material both silicon organic in recent...

We have developed novel optoelectronic packages and optical transmission system using an connector with external waveguide to achieve low-loss chip-to-chip interconnections for computer systems. In order connect the package connector, we also proposed a socket as coupling structure realize all passive alignment high efficiency. demonstrated high-speed error-free signal four channels at 10-Gb/s/ch up 12-Gb/s/ch. Optical input output (I/O) interfaces, including devices controller integrated...

This paper presents the first demonstration of an ultra-thin glass BGA package that is assembled on to mother board with standard SMT technology. Such a has many new advances include glass, high speed through via hole formation and copper metallization, double-side RDL wiring advanced 3 micron ground rules, Cu-SnAg microbump assembly 10mm silicon test die. Glass, as package, overcomes shortcomings organic packages in bump pitch, CTE mismatch Si warpage interposers electrical performance...

We report on a patient with tuberous sclerosis complex and polycystic kidney disease who developed bilateral chromophobe cell renal carcinoma. discuss the complex, associated carcinoma, carcinoma; recently established subtype rather favorable prognosis. In multiple space‐occupying lesions, diagnosis of angiomyolipoma should be considered first but and/or multifocal carcinoma is likely diagnosis.

In this paper, a large 2.5D glass interposer is demonstrated with 50 um chip-level interconnect (FLI), 3/3 line and space (L/S) escape routing, six metal layers, which are targeted for JEDEC high bandwidth memory (HBM). Our routing design suggests that double sided panel processing L/S can accommodate required signal lines HBM. Then, transmission on 25mm × 30mm interposers 300 core thickness be realized by utilizing semi additive process. Finally, 10mm 10m dies daisy chains successfully...

Emerging high-performance computing systems have been aggressively driving advances in packaging technologies to meet their escalating performance and miniaturization needs. Large, high-density 2.5D silicon interposers gained momentum with the recent split-die trend but face critical reliability challenges at board-level that are addressed by introducing an additional organic BGA package between interposer board. Glass substrates emerged as a promising alternative owing superior electrical...

This paper describes the first demonstration of 10 μm diameter interlayer vias in low-moisture uptake and low surface-roughness dry film polymer dielectric for multi-layered re-distribution layer (RDL) structures to achieve 50 um bump pitch high density organic glass interposers. A new series films, ZS-100, at thickness were deposited on thin CTE or cores using double-sided vacuum lamination processes. The ultra-small fabricated by 248nm KrF excimer laser drilling, followed electroless...

We have developed optoelectronic packages having optical waveguide holes with core-clad structures for chip-to-chip interconnection within computer systems. A rate of 10-Gb/s/ch signal transmission has been demonstrated. The package we consists two guide pins and four-channel holes. are used to align an fiber connector device. transmit signals vertically through the package. Using in package, high-quality achieved.

We have developed optoelectronic packages having optical waveguide holes with core-clad structure for chip-to-chip interconnection within computer systems. 4-channels × 10 Gb/s signal transmissions between were demonstrated thin-film polymer waveguide.

We developed optical I/Os in packages for chip-to-chip interconnections. The of 55-µm-diameter and 1.2-mm-long through-holes demonstrate low loss 10-Gb/s transmission. This package aims at future CPU systems with embedded capacitors.

The purpose of this study was to assess urea kinetic modeling (UKM) as a marker for adequate dialysis in continuous ambulatory peritoneal (CAPD) patients. UKM conducted on 19 anuric patients CAPD more than 2 years. Serum beta 2-microglobulin (beta 2M) also measured large molecular weight substances. Patient clinical conditions were evaluated by the doctors and well. thus asked complete questionnaire uremic symptoms daily activities. A comparison made kinetics biochemical parameters based...

We have developed optoelectronic packages for on-board optical interconnections and demonstrated 10-Gb/s up to 12-Gb/s transmissions. In this paper, we describe the structure of interconnect systems that propose low-cost chip-to-chip signal The package is intended be pluggable from an LGA socket connector in order ease system maintenance. connectors with a polymer waveguide are designed assembled between socket. separated printed circuit board (PCB) produce PCB mature fabrication process....

A compact 10-Gb/s times 12-channel optical transmitter was developed for very short-reach interconnections. The 10-Gb/s/ch operations were achieved without employing the heat pipes or sinks typically required to keep vertical-cavity surface-emitting lasers at a low temperature under 85degC. Alumina ceramic substrates with high dissipation capability are incorporated in order maintain operation. is designed be as standard mechanically transferable (MT) connector. To enhance usability, can...

維持透析を受ける血液透析 (HD) 患者は身体機能が低下しているため, 習慣的な運動を続けることが困難な場合が多い. HD患者の身体機能を維持・向上するためには, HD患者の特徴を考慮した効果的な運動療法の介入方法を構築する必要がある. 本研究は, 維持HD患者の運動継続に影響を及ぼすセルフ・エフィカシー (SE) を評価し, 身体機能とSEとの関係からHD患者に対する運動療法の効果について検討した. 維持HD患者122例を運動群と非運動群に分類して, 運動群には運動療法としてelastic resistance training (ERT) を2か月間施行し4か月間の観察期間を設けた. 6か月の研究期間を終了した運動群24例と非運動群20例を対象に, 患者背景因子としてHD期間, dry weight, body mass index, ヘマトクリット, 血清アルブミン, 症状得点, 身体機能 (PF) 偏差得点を, 身体機能の指標として握力と等尺性膝伸展筋力を測定した. 日常身体活動に対するSEの評価として身体活動SE尺度を用い, 上肢の運動に対するSE (上肢SE),...

目的:急性虫垂炎の診断はしばしば困難で，術後病理学的に虫垂に炎症が乏しいことがあり，このような誤診例の特徴を明らかにすることを目的とした．対象:急性虫垂炎の診断で手術を施行し，虫垂の炎症が乏しかった誤診例25例と正診例119例．方法:臨床症状，検査成績，CT所見を比較した．結果:誤診例の最終診断は憩室炎10例，腸炎5例，婦人科疾患3例，腎盂腎炎1例，不明6例で，誤診例では嘔気（8.0vs.33.6％;P=0.01）が少なく，CT所見では誤診例で虫垂の同定率が低く（44.0vs.94.1％;P＜0.0001），短径が短く（7.1vs.9.9mm;P=0.016），虫垂内腔の液体貯留が少なく（27.2vs.90.2％;P＜0.0001），腹水貯留が少なかった（8.0vs.55.5％;P＜0.0001）．結語:消化器症状の有無，CT所見により急性虫垂炎の診断能の向上は可能と考えられた．