A5080818574- Advanced MEMS and NEMS Technologies
- Mechanical and Optical Resonators
- Photonic and Optical Devices
- Force Microscopy Techniques and Applications
- Advanced Surface Polishing Techniques
- Thermal properties of materials
- Plasma Diagnostics and Applications
- Carbon Nanotubes in Composites
- Graphene research and applications
- Nanomaterials and Printing Technologies
- Optical and Acousto-Optic Technologies
- Photonic Crystals and Applications
- Electromagnetic Compatibility and Noise Suppression
- Microbial Community Ecology and Physiology
- Near-Field Optical Microscopy
- High voltage insulation and dielectric phenomena
- Genomics and Phylogenetic Studies
- Environmental DNA in Biodiversity Studies
- Spectroscopy and Chemometric Analyses
- Infrared Target Detection Methodologies
- Adhesion, Friction, and Surface Interactions
- Terahertz technology and applications
- Dielectric materials and actuators
- Remote-Sensing Image Classification
- Advanced Fiber Optic Sensors
The University of Western Australia
2014-2025
ARC Centre of Excellence for Transformative Meta-Optical Systems
2023-2025
Australian Research Council
2025
Wrocław University of Science and Technology
2013-2014
Abstract Metabarcoding of environmental DNA (eDNA) when coupled with high throughput sequencing is revolutionising the way biodiversity can be monitored across a wide range applications. However, large number tools deployed in downstream bioinformatic analyses often places challenge configuration and maintenance workflow, consequently limits research reproducibility. Furthermore, scalability needs to considered handle growing amount data due increase sequence output scale project. Here, we...
A mechanically tunable metamaterial concept for transmissive spectral discrimination within the long‐wavelength infrared (LWIR) range (8–12 μm) is proposed and validated. The consists of a periodically perforated gold membrane that exhibits extraordinary optical transmission (EOT) effect, combined with parallel silicon separated by an air gap. This structure acts as band‐pass filter, its position highly sensitive to separation gap between membranes, which influences resonance conditions EOT....
Atomic force microscope (AFM) cantilevers with integrated actuation and sensing provide several distinct advantages over conventional cantilever instrumentation. These include clean frequency responses, the possibility of down-scaling parallelization to arrays as well absence optical interference. While microfabrication technology has continuously advanced years, overall design remained largely unchanged; a passive rectangular shaped been adopted industry wide standard. In this article, we...
Spin-on polyimide is an organic thin film often used as a sacrificial layer for surface micromachining due to its high thermal stability, ease of removal, and compatibility with many materials processes in the realization microelectromechanical systems (MEMS). The incorporation sloped sidewalls fabricating pedestal structures crucial order provide strong anchors free-standing MEMS devices, especially cases having aspect ratio and/or where structural have limited deposition conformality. This...
Over the past three decades, silicon photonic devices have been core to realization of large‐scale photonic‐integrated circuits. However, nitride is another key complementary metal oxide semiconductor‐compatible material for high‐density circuits, having low manufacturing costs, optical losses, and excellent mechanical properties, that can provide enhanced performance over in an integrated platform. This article presents design, fabrication, testing a proof‐of‐concept switchable coupler...
This paper presents studies of long-term stability capacitors embedded in printed circuit boards. Planar fabricated from FaradFlex dielectric foil with copper plates laminated to FR-4 substrate served as test structures. The was BaTiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ceramic/polymer composition various fillers and consequently constants. Moreover samples differed thickness surface size. investigated were covered LDP 2×106...
This paper describes first attempt to coarse-grained molecular dynamics study of heat transfer in thermal interface materials. All calculations and most preparation steps are conducted using customized PERL scripts for Materials Studio 6.0. The part introduces the developed approach modeling, which allows properties materials provide base modern packages electronic integrated circuits systems on a chip. second shows detail process preparing models, parameters used models. Also at this stage...
Amorphous and polycrystalline silicon are commonly used as sacrificial layers in the surface micromachining of microelectromechanical systems (MEMS) devices, because they have high thickness uniformity over a large wafer area, similar coefficient thermal expansion to suspended structural materials such nitride oxide. However, low deposition rate amorphous-silicon hinders its application devices that require suspension gap greater than several micrometres, chemical stability can be an issue....
This paper presents a proof-of-concept for microelectromechanical system (MEMS)-based fixed cavity Fabry–Pérot interferometers (FPIs) operating in the long-wavelength infrared (LWIR, 8 to 12 μm) region. work reports first time on use of low-index BaF2 thin films combination with Ge high-index such applications. Extremely flat and stress-free ∼3-μm-thick free-standing distributed Bragg reflectors (DBRs) are also presented this article, which were realized using thick lift-off trilayer...
The Microelectronics Research Group (MRG) at University of Western Australia is a key partner the Australian Council Centre Excellence for Transformative Meta-Optical Systems. In this presentation, an overview ongoing research will be given with emphasis on flagship activities MCT-based imaging arrays and Microelectromechanical Systems (MEMS). MCT development utilise vertically integrated capability from semiconductor material growth, through device modelling design, to focal-plane-array...
While agile multispectral imaging solutions presently exist, their size, weight and power (SWaP) specifications prevents deployment on small portable platforms such as drones. As much of the size existing is attributed to wavelength-selective optical subsystem, realizing low-SWaP hinges miniaturization this subsystem. The ultimate implementation would integrate component at focal plane array. This paper presents a solution which aims achieve integration. Recent developments in...
Future remote imaging systems promise spectroscopic functionalities extending well beyond the visible wavelengths. This allows real-time spectral information to be gathered from multiple wavelength bands which is highly attractive for numerous sensing spectroscopy/imaging applications and aids target recognition. paper briefly presents a micro-electromechanical (MEMS) based electrically tuneable adaptive filter technology developed technologically important infrared (IR) of electromagnetic...
The increasing requirements for heat dissipation in modern microelectronic devices makes it necessary to develop new materials (e.g. thermal interface materials) with high conductivity. Due excellent and thermo-mechanical properties some nanomaterials, like carbon nanotubes, are increasingly being used create thermally conductive composites. development of such composites requires the good understanding physical parameters materials. There is a consensus that numerical methods can greatly...
This paper presents the results of experimental work on a low temperature through-wafer reactive ion etching (RIE) technique obtained in course development process that can be used small sample processing for microelectromechanical systems (MEMS). Low RIE are crucial step many dry MEMS fabrication processes, where to fabricate silicon vias, trenches, and perform release membranes other devices. The etch developed here also separate fabricated devices, especially when it is desirable produce...
In electrostatically actuated microelectromechanical systems (MEMS), the risk of snapping-down moveable beams and membranes increases with decreasing gap between actuation electrodes. Van der Waals forces play a significant role in subsequent stiction substrate or other surfaces. order to enable recovery MEMS devices from snap-down position, size roughness contact surface anti-stiction bumps underlying is studied. This paper examines design parameters bumps, which allow restoring recover...