Lilan Gao

ORCID: 0000-0002-7288-6686
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About
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Research Areas
  • Aluminum Alloys Composites Properties
  • Magnesium Alloys: Properties and Applications
  • Electronic Packaging and Soldering Technologies
  • Aluminum Alloy Microstructure Properties
  • 3D IC and TSV technologies
  • Mechanical Behavior of Composites
  • Corrosion Behavior and Inhibition
  • Orthopaedic implants and arthroplasty
  • Bone Tissue Engineering Materials
  • Titanium Alloys Microstructure and Properties
  • Biomedical and Engineering Education
  • Structural Analysis of Composite Materials
  • Biotechnology and Related Fields
  • Advanced Image and Video Retrieval Techniques
  • Bone fractures and treatments
  • Powder Metallurgy Techniques and Materials
  • Integrated Circuits and Semiconductor Failure Analysis
  • Advanced ceramic materials synthesis
  • Total Knee Arthroplasty Outcomes
  • Advanced materials and composites
  • Advanced Welding Techniques Analysis
  • Fuel Cells and Related Materials
  • Bone health and osteoporosis research
  • Mechanical Circulatory Support Devices
  • Adhesion, Friction, and Surface Interactions

Tianjin University of Technology
2011-2023

Tianjin University
2010-2019

Magnesium alloys have better biocompatibility and biodegradability than conventional biomedical metal materials, but the corrosion resistance is so poor that implant loses its mechanical integrity before damaged tissue completely recovers. In this study, ZEK100 magnesium alloy was pre-deformed with a high-pressure torsion (HPT) process then fabricated hydroxyapatite (HA) coatings different contents of Mg(OH)2 nanopowder via hydrothermal method. The specimens were characterized by scanning...

10.1016/j.matdes.2019.107933 article EN cc-by-nc-nd Materials & Design 2019-06-12

Silver nanoparticles (AgNPs) are emerging as powerful tools in healthcare due to their unique properties, including antimicrobial activity, high surface area, and biocompatibility. They widely used medical applications such wound healing, drug delivery, cancer therapy, diagnostics, particularly for combating multidrug-resistant bacteria. AgNPs enhance the effectiveness of traditional antibiotics show potential synergistic therapies with other nanomaterials. However, challenges remain...

10.54254/2755-2721/2025.20129 article EN cc-by Applied and Computational Engineering 2025-01-13

10.1016/j.ijadhadh.2011.11.007 article EN International Journal of Adhesion and Adhesives 2011-12-05

10.1557/jmr.2018.489 article EN Journal of materials research/Pratt's guide to venture capital sources 2019-02-11

Purpose The paper aims to study the effect of sintering temperature on microstructure, shear strength and ratcheting fatigue life nanosilver sintered lap joint. In addition, Gerber model is used predict lives joints at different temperatures. Design/methodology/approach this paper, were prepared three temperatures 250 °C, 280 °C 310 °C. bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission microscope tests, long-term reliability studied conducting...

10.1108/ssmt-08-2023-0047 article EN Soldering and Surface Mount Technology 2024-05-29

10.1557/jmr.2017.104 article EN Journal of materials research/Pratt's guide to venture capital sources 2017-04-17

Abstract Ultrahigh molecular weight polyethylene (UHMWPE) artificial joint has remained the preferred polymer component in total replacement surgery. However, more and concerns have been raised about failure of UHMWPE components due to initiation propagation cracks at notches with fixed functions. For this reason, biaxial fatigue crack growth (FCG) experiments reinforced by carbon nanofibers (CNF) hydroxyapatite (HA) were carried out using elastic–plastic fracture mechanics theory. The FCG...

10.1002/jbm.b.34507 article EN Journal of Biomedical Materials Research Part B Applied Biomaterials 2019-10-21

10.1016/j.microrel.2015.04.004 article EN Microelectronics Reliability 2015-05-13

Power electronics may operate at high temperatures even above 200∘C. In recent years, silver sintering technology is being gradually applied in high-temperature power electronic packaging due to its excellent thermal, electrical, and mechanical properties. Compared with early pressure-assisted technology, pressureless can simplify the process reduce capital investment. Silver chip-level substrate-level presented as follows: firstly, traditional state-of-the-art technologies are reviewed:...

10.1109/icma54519.2022.9856054 article EN 2022 IEEE International Conference on Mechatronics and Automation (ICMA) 2022-08-07

Silver paste, as a novel thermal interface material, has wide applications in elevated temperature power electronics. In practice, usually pressure higher than 5 MPa is necessary for large‐area bonding by silver regardless the fact that uneven may cause fracture of brittle components such chips and ceramic substrates. Herein, feasibility using liquid dispersant to assist sintering proved. The introduced method can obtain sound with lower MPa. employed dispersants, namely, α terpineol,...

10.1002/adem.202201574 article EN Advanced Engineering Materials 2022-12-23

Mandibular defect repair has always been a clinical challenge, facing technical bottleneck. The new materials directly affect technological breakthroughs in mandibular field. Our aim is to fabricate scaffold for repairing with advanced biomaterials. Therefore, novel dual-channel printed consisting of silk fibroin/collagen type I /hydroxyapatite (SCH) and polycaprolactone/hydroxyapatite (PCL/HA) was fabricated by 3D printing technology double nozzles. mechanical properties behaviors were...

10.2139/ssrn.4583280 preprint EN 2023-01-01

Graduation project is an important integrated practice segment for undergraduate education, since the quality of education can be directly evaluated by graduation project. Under background science collaborative and engineering accreditation, it necessary to explore intelligent system train students all sorts research projects, thus improve students' practical ability innovation ability. This paper first analyzed problems in major process equipment control engineering, then introduced a novel...

10.1145/3505711.3505733 article EN 2021-11-20
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