Hanwen Hu

ORCID: 0000-0002-9052-2552
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About
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Research Areas
  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Additive Manufacturing and 3D Printing Technologies
  • Atmospheric and Environmental Gas Dynamics
  • Copper Interconnects and Reliability
  • Atmospheric chemistry and aerosols
  • Random lasers and scattering media
  • Advanced Sensor and Energy Harvesting Materials
  • Catalysts for Methane Reforming
  • Zeolite Catalysis and Synthesis
  • Carbon dioxide utilization in catalysis
  • Air Quality and Health Impacts
  • Air Quality Monitoring and Forecasting
  • Catalytic Processes in Materials Science
  • Thin-Film Transistor Technologies
  • Semiconductor materials and devices
  • Nanomaterials for catalytic reactions
  • Gas Sensing Nanomaterials and Sensors
  • Neural Networks and Reservoir Computing
  • Advanced Photocatalysis Techniques
  • Nanoparticle-Based Drug Delivery
  • Characterization and Applications of Magnetic Nanoparticles
  • Environmental Impact and Sustainability
  • GaN-based semiconductor devices and materials
  • Advanced Optical Imaging Technologies

North Sichuan Medical University
2025

Texas A&M University
2024-2025

Walker (United States)
2024-2025

Beijing University of Technology
2022-2025

National Yang Ming Chiao Tung University
2014-2024

Chinese Academy of Sciences
2009-2024

Collaborative Innovation Center of Chemistry for Energy Materials
2023-2024

Xiamen University
2023-2024

Dalian Institute of Chemical Physics
2023-2024

Central China Normal University
2024

Photocatalytic two-electron oxygen reduction to produce high-value hydrogen peroxide (H2O2) is gaining popularity as a promising avenue of research. However, structural evolution mechanisms catalytically active sites in the entire photosynthetic H2O2 system remains unclear and seriously hinders development highly-active stable photocatalysts. Herein, we report high-loading Ni single-atom photocatalyst for efficient synthesis pure water, achieving an apparent quantum yield 10.9% at 420 nm...

10.1038/s41467-023-42887-y article EN cc-by Nature Communications 2023-11-06

Abstract Converting CO 2 to olefins is an ideal route achieve carbon neutrality. However, selective hydrogenation light olefins, especially single‐component olefin, while reducing CH 4 formation remains a great challenge. Herein, we developed ZnZrO x /SSZ‐13 tandem catalyst for the highly of olefins. This shows C = −C and propylene selectivity up 89.4 % 52 %, respectively, suppressed down there no obvious deactivation. It demonstrated that isolated moderate Brønsted acid sites (BAS) SSZ‐13...

10.1002/anie.202316874 article EN Angewandte Chemie International Edition 2024-01-05

Abstract A stretchable, flexible, and bendable random laser system capable of lasing in a wide range spectrum will have many potential applications next‐ generation technologies, such as visible‐spectrum communication, superbright solid‐state lighting, biomedical studies, fluorescence, etc. However, producing an appropriate cavity for spectral remains challenge owing to the rigidity resonator coherent loops. 2D materials with wrinkled structures exhibit superior advantages high...

10.1002/adma.201703549 article EN Advanced Materials 2017-10-09

Abstract. The MIXv2 Asian emission inventory is developed under the framework of Model Inter-Comparison Study for Asia (MICS-Asia) Phase IV and produced from a mosaic up-to-date regional inventories. We estimated emissions anthropogenic biomass burning sources covering 23 countries regions in East, Southeast South aggregated to uniform spatial temporal resolution seven sectors: power, industry, residential, transportation, agriculture, open shipping. Compared MIXv1, we extended dataset...

10.5194/acp-24-3925-2024 article EN cc-by Atmospheric chemistry and physics 2024-04-03

Production of multicolor or multiple wavelength lasers over the full visible-color spectrum from a single chip device has widespread applications, such as superbright solid-state lighting, color laser displays, light-based version Wi-Fi (Li-Fi), and bioimaging, etc. However, designing lasing devices remains challenging issue owing to material requirements for producing emissions sophisticated design action. Here we demonstrate simple highly efficient segment white random based on...

10.1021/acsnano.8b03035 article EN ACS Nano 2018-10-23

Fine pitch Cu/SiO2 hybrid bonding has been successfully demonstrated at a low temperature of 120∘C, breakthrough, using Au passivation method in this work. To explore the mechanism structures for details, Cu-Cu direct with on both wafer-level and chip-level discussed, including analyses AFM, SAT, TEM, electrical measurements, reliability test. fine structure stable performance can be achieved under an atmospheric environment. Accordingly, scheme excellent quality, thermal budget, high shows...

10.1109/jeds.2021.3114648 article EN cc-by IEEE Journal of the Electron Devices Society 2021-01-01

In advanced packaging schemes, such as fan-out integration technology, photosensitive polyimide (PSPI) is the key material to fabrication of panel level redistribution-layer (RDL). However, a large mismatch coefficient thermal expansion (CTE) between silicon (Si) and PSPI will cause serious warpage issue. Furthermore, deformation may occur under external heat pressure, leading deterioration RDL reliability. this work, with low CTE excellent adhesion strength on different substrate was...

10.1109/jeds.2024.3358830 article EN cc-by IEEE Journal of the Electron Devices Society 2024-01-01

Abstract The rapid progress in miniaturization and integration of semiconductor power devices has made heat dissipation a critical concern the development high‐performance devices, thereby increasing demands for transfer efficiency polymer composites. To address this issue, an efficient three‐dimensional (3D) conduction network structure is constructed matrix by leveraging mutual reaction amino epoxy groups on surface filler treated coupling during melt mixing process, approach leads to...

10.1002/pc.28186 article EN Polymer Composites 2024-02-02

In this article, low-temperature Cu-Cu bonding with the Ag passivation layer was accomplished at 180 °C for 3 min without a postannealing process. The effectively prevents Cu from oxidation and assists diffusion to realize bonding. small grain size of controlled by sputtering working pressure is observed improve quality. Different plasma treatment parameters conditions were executed evaluate behavior investigated, corresponding mechanism discussed as well. addition, reliability assessments,...

10.1109/tcpmt.2020.3037365 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2020-11-11

Abstract Semiconductor heterojunctions can significantly enhance the separation of photogenerated charge carriers, among which Z‐type are more conducive to photocatalysis due their special transfer paths and strong oxidizing reducing properties. However, introducing efficient active sites has always been a significant challenge in improvement heterogeneous photocatalysts. Herein, through in‐depth analysis reaction mechanism structural characteristics, single atom catalysts ingeniously...

10.1002/adma.202502918 article EN Advanced Materials 2025-04-24

The many distinct advantages of random lasers focused efforts on developing a breakthrough from optical pumping to electrical pumping. However, progress in these is limited due high loss and low gain. In this work, we demonstrate an electrically pumped quantum dot (QD) laser with visible emission based previously unexplored paradigm named coherent Förster resonance energy transfer (CFRET). the CFRET process, when photonic mode formed because multiple scattering emitted light traveling mixed...

10.1126/sciadv.aba1705 article EN cc-by-nc Science Advances 2020-10-07

Pt has been investigated as a metal passivation material to achieve low-temperature Cu-Cu direct bonding process. With 10-nm layer capping on Cu surface, good surface with no oxides and small grain size can be obtained. During the process, atoms diffuse through form new without any pretreatment. This scheme provides solution for bonding, excellent strength, electrical performance, ability endure temperature variation. In addition, both chip- wafer-level process have successfully...

10.1109/tcpmt.2021.3069085 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2021-03-26
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