A5078739598- Copper Interconnects and Reliability
- Semiconductor materials and devices
- Electrodeposition and Electroless Coatings
- Semiconductor materials and interfaces
- Metal and Thin Film Mechanics
- Molecular Junctions and Nanostructures
- Electronic Packaging and Soldering Technologies
- Magnetic Properties of Alloys
- Metallic Glasses and Amorphous Alloys
- ZnO doping and properties
- Magnetic properties of thin films
- Magnetic Properties and Applications
- Copper-based nanomaterials and applications
- Gas Sensing Nanomaterials and Sensors
- Ga2O3 and related materials
- Rare-earth and actinide compounds
- Magnetic and transport properties of perovskites and related materials
- Transition Metal Oxide Nanomaterials
- Advanced materials and composites
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Advanced Condensed Matter Physics
- Metallurgical and Alloy Processes
- Advanced ceramic materials synthesis
- Anodic Oxide Films and Nanostructures
Central South University
2024-2025
National Formosa University
2015-2024
National University of Formosa
2007-2023
National Chi Nan University
2020
Western Digital (China)
2008
National Yunlin University of Science and Technology
2004
Huawei Technologies (China)
2001-2004
National Tsing Hua University
1995-2000
Tsinghua University
1996
Near-ultraviolet nitride-based light-emitting diodes (LEDs) with peak emission wavelengths around 410 nm were fabricated onto c-face patterned sapphire substrates (PSS). It was found that the electroluminescence intensity of PSS LED shown 63% larger than conventional LED. For a typical lamp-form operating at forward current 20 mA, output power and external quantum efficiency estimated to be 10.4 mW 14.1%, respectively. The improvement in light could attributed decrease threading dislocations...
Abstract The cyclic stability of aqueous zinc‐manganese batteries (ZMBs) is greatly restricted by the side reaction anode and irreversibility cathode. In this work, a solid‐liquid hybrid electrolyte mixing traditional ZnSO 4 ‐based diatomite (denoted as Dtm) proposed that exhibits good compatibility reversibility in both interface cathode interface. abundant hydroxyl groups at disturb hydrogen bond network water molecule, which weakens corrosion active to Zn anode. Moreover, negatively...
Advancements in electrical components have intensified the challenges for copper alloy wear resistance and high-temperature performance applications. The surface coating preparation of Cu alloys is crucial enhancing their lifespan promoting sustainable resource development. This study explored microstructure properties Cu-Cr-X coatings (X = Mo/W, Al2O3/TiO2) on substrates via laser-cladding to improve hardness, vital component reliability switching capacity. process involved adjusting power...
Thin textured titanium nitride (TiN) films with thicknesses under 100 nm were grown on (100) silicon wafers by employing a radio-frequency generator to sputter reactively Ti target poisoned modes in mixtures of fixed Ar (3.6×10−1 Pa) and N2 at various partial pressures. The texture the TiN can be tailored appropriately controlling pressure reactive nitrogen. (111) deposited over broad range lower pressures from 2.9×10−2 1.8×10−1 Pa, while narrow higher nitrogen (2.3×10−1 3.3×10−1 Pa)....
Cobalt nitride thin films could be prepared by employing a direct current reactive sputtering deposition on (100) silicon substrates in mixtures of fixed Ar (4×10−1 Pa) and N2 at various partial pressures. The CoxN tailored appropriately controlling the pressure nitrogen. With adequately increasing nitrogen to argon pressure, series sequence phase formation from α-Co, Co4N, Co3N, Co2N, CoN observed. transition was accompanied substantial refinement improvement films’ grain structure. Rapid...
Ultrathin TaSiC amorphous films prepared by magnetron cosputtering using TaSi2 and C targets on Si(100), in a sandwiched scheme Si(100)∕TaSiC(5nm)∕Cu, were evaluated for barrier performance copper metallization. Optimizing carbon content maximizes thermal stability of the as depicted sheet-resistance, x-ray diffraction, transmission electron microscopy examination. The temperatures 700°C (24at.% C) 750°C (34at.% have been systematically verified discussed. Since Ta, Si, are compatible with...
The use of an ultrathin Ru–Ta–C film as a barrier for copper metallization in sub- ultra-large-scale integration (ULSI) has been evaluated. films, fixed at , were deposited by magnetron sputtering using Ru and TaC targets, the composition structure adjusted tuning respective deposition power. films gradually changed from to nanocrystalline or nearly amorphous when optimizing TaC. For sandwiched scheme failure temperature was least . We also electroplated Cu directly onto without seeding....
Amine-terminated self-assembled monolayers are molecular nanolayers, typically formed via wet-chemical solution on specific substrates for precision surface engineering or interface modification. However, homogeneous assembling of a highly ordered monolayer by the facile, wet method is rather tricky because it involves process parameters, such as solvent type, concentration, soaking time and temperature, humidity level. Here, we select 3-aminopropyltrimethoxysilane (APTMS) model molecule...