Seong-Hee Lee

ORCID: 0000-0003-4448-2753
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About
Contact & Profiles
Research Areas
  • Aluminum Alloys Composites Properties
  • Microstructure and mechanical properties
  • Aluminum Alloy Microstructure Properties
  • Metal Forming Simulation Techniques
  • Metallurgy and Material Forming
  • Magnesium Alloys: Properties and Applications
  • Education and Learning Interventions
  • Advanced Welding Techniques Analysis
  • Educational Systems and Policies
  • Advanced materials and composites
  • Advanced ceramic materials synthesis
  • Wireless Networks and Protocols
  • Semiconductor materials and devices
  • Network Time Synchronization Technologies
  • Bluetooth and Wireless Communication Technologies
  • Advanced Battery Materials and Technologies
  • Advancements in Battery Materials
  • 3D IC and TSV technologies
  • Psychosocial Factors Impacting Youth
  • Copper Interconnects and Reliability
  • Hydrogen Storage and Materials
  • Metallurgy and Material Science
  • Powder Metallurgy Techniques and Materials
  • Interactive and Immersive Displays
  • Energy and Environmental Systems

Mokpo National University
2015-2025

Electronics and Telecommunications Research Institute
2007-2025

SK Group (South Korea)
2022-2024

Korea National University of Transportation
2021-2022

Cornell University
2022

Dongguk University
2015-2016

Seoul National University of Science and Technology
2015

Sungkyul University
2014

Jeju National University
2013

Marvell (United States)
2010

This article introduces a 192-Gb 896-GB/s 12-high stacked third-generation high-bandwidth memory (HBM3 DRAM) with low power consumption and high-reliability traits. New design schemes features, including internal low-voltage signaling, center strobe calibration, through-silicon via (TSV) auto-calibration, symbol-correcting in-DRAM ECC, machine-learning-based layout optimization, allow large amounts of data transfers among the vertically base core dies limited delay mismatch or SI...

10.1109/jssc.2022.3193354 article EN IEEE Journal of Solid-State Circuits 2022-08-17

Despite the excellent generalization capabilities of large-scale language models (LLMs), their severe limitations, such as illusions, lack domain-specific knowledge, and ambiguity in reasoning process, challenge direct application to clinical decision support systems (CDSSs). To address these challenges, this study proposes a synergistic joint model that integrates knowledge graphs (KGs) LLMs enhance improve explainability CDSSs. The proposed leverages KGs provide structured, insights while...

10.3390/math13060949 article EN cc-by Mathematics 2025-03-13

With the emergence of large-language models (LLM) and generative AI, which require an enormous amount model parameters, required memory bandwidth capacity for high-end systems is on unprecedented increase. To meet this need, we present extended version high-bandwidth memory-3 (HBM3 DRAM), HBM3E, achieves a 1280GB/s with cube density 48GB. New design schemes features, such as all-around power-through-silicon via (TSV), 6-phase read-data-strobe (RDQS) scheme, byte-mapping swap voltage-drift...

10.1109/isscc49657.2024.10454440 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2024-02-18

Ever since the introduction of high bandwidth memory (HBM DRAM) and its succeeding line-ups, HBM DRAM has been heralded as a prominent solution to tackle wall problem. However, despite continual advancements advent high-end systems, including supercomputers, hyper-scale data centers machine learning accelerators, are expediting requirements for higher-performance solutions. To accommodate increasing system-level demands, we introduce HBM3 DRAM, which employs multiple new features design...

10.1109/isscc42614.2022.9731562 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2022-02-20

This article presents an overview of the IEEE project 802.15.5 that targets providing mesh capabilities to both high-rate and low-rate wireless personal area networks. Low-rate is built on 802.15.4 MAC, while utilizes 802.15.3 MAC. We seek share our insights motivations approach adopted in major components standard instead presenting a la carte items drawn specification. hope this helps readers better understand rationale intent protocol design.

10.1109/mcom.2010.5394031 article EN IEEE Communications Magazine 2010-01-01

A cold roll-bonding (CRB) process is applied to study the effects of stacking number on microstructure and mechanical properties roll-bonded age-treated Al sheets. Commercial AA1050 AA6061 sheets with a thickness 2 mm were stacked alternately each other two four layers, by multi-pass rolling. The then subjected natural aging (T4) artificial (T6) treatments. as showed typical deformation structure, where grains are elongated in rolling direction regardless number. However, after T4 T6...

10.3365/kjmm.2023.61.9.652 article EN Korean Journal of Metals and Materials 2023-09-04

The Accumulative-Roll Bonding (ARB) process was applied to an aluminum based MMC fabricated by a sheath rolling method, in order improve the mechanical properties. 8 cycles of ARB were performed at ambient temperature under unlubricated conditions. also on unreinforced material, for comparison with composite sample. tensile strength increases number up 5 ARB, above which it decreases slightly. material 2 does not change. strengthening is caused improvement homogeneity distribution...

10.2320/matertrans1989.40.1422 article EN Materials Transactions JIM 1999-01-01

An ultra low carbon interstitial free (IF) steel was severely deformed by the six-layer stack accumulative roll-bonding (ARB) process for improvement of mechanical properties. As-received material with 1 mm in thickness showed a recrystallization structure average grain diameter 27 μm. The ARB conducted at ambient temperature after deforming as-received to 0.5 thick cold rolling. performed stacked, i.e. 3 sheet, up cycles (an equivalent strain ∼7.1). In each cycle, stacked sheets were,...

10.2320/matertrans.45.2177 article EN MATERIALS TRANSACTIONS 2004-01-01

In this study, we tried to fabricate the nanostructured bulk copper alloys by a severe plastic deformation process. The sheets of (OFC, PMC90, and DLP) were heavily deformed an equivalent strain 6.4 accumulative roll-bonding (ARB) microstructure mechanical property fabricated specimens systematically investigated. was finely subdivided with increasing ARB severely exhibited ultrafine lamellar boundary structure where mean lamella spacing about 200 nm. strength significantly increased...

10.1166/jnn.2007.073 article EN Journal of Nanoscience and Nanotechnology 2007-11-01

Bluetooth technology has been widely adopted in consumer or mobile devices due to its small form factor and low product cost. However increasing demand for high-speed multimedia applications continuously stimulates adopt an alternative MAC PHY technology. In this paper, we propose a dual-mode application which uses both legacy module low-speed communication UWB communication. We modified profiles high definition video transmission developed SoC that can be used speed

10.1109/tce.2010.5439122 article EN IEEE Transactions on Consumer Electronics 2010-02-01

Changes in MiCrostruCture and texture of a Multi-staCk aCCuMulative roll Bonding ProCessed CoMPlex aluMinuM alloy with annealingChanges the microstructure annealing temperature nanostructured complex aluminum fabricated by multi-stack accumulative Roll (aRB) process using various al alloys are investigated detail.The aRB is performed up to 4 cycles without lubrication at room temperature.The specimen multi-layer sheet which aa1050, aa5052 aa6061 alternately stacked each other.The average...

10.24425/amm.2024.147795 article EN cc-by-nc Archives of Metallurgy and Materials 2024-04-10

The drawing process severely deforms commercial AA1070 alloy for electrical wire, reducing a rod from diameter of 2.0 mm to 0.4 mm, followed by annealing. annealing was conducted at various temperatures ranging 200℃ 450℃, with each temperature maintained 1hour. effects increasing on the microstructure, mechanical properties, and properties Al wire were investigated in detail. drawn showed deformed microstructure fiber texture that {110}<111> {112}<111> components strongly...

10.3365/kjmm.2024.62.10.749 article EN Korean Journal of Metals and Materials 2024-10-04

A cold roll-bonding (CRB) process was applied to enhance the mechanical properties of AA5052 sheet for small ship. Two and four sheets 1 mm thickness, 40 width 300 length were stacked, then roll-bonded a thickness 0.5 respectively by two-pass rolling after such surface treatment as degreasing wire brushing. The performed at ambient temperature without lubricant using 4-high mill speed 6.0m/sec. annealed 1h various temperatures from 200 500℃. showed deformation structure in which grains are...

10.5781/jwj.2024.42.5.12 article EN Journal of Welding and Joining 2024-10-29

An ultra low carbon IF steel was severely strained by accumulative roll-bonding (ARB) process and subsequently annealed for 0.5 h at various temperatures ranging from 673 to 1073 K strengthening grain refinement. The ARB carried out up 5 cycles (an apparent equivalent strain of 4.0) ambient temperature without lubrication. as-ARBed specimen exhibited a dislocation cell structure with relatively high density, rather than well-defined ultrafine grained structure. However, the subsequent...

10.2320/matertrans.43.2320 article EN MATERIALS TRANSACTIONS 2002-01-01

A photopatternable and solution-processable thin gate dielectric for organic thin-film transistors has been fabricated here using an organosiloxane-based organic−inorganic hybrid material. Incorporation of a UV-sensitive functional group allowed us to directly obtain high-resolution patterned conventional photolithography. Uniform distribution ZrO2 nanoclusters increased the constant material from which hydroxyl groups were removed by low-temperature heat treatment. Coplanar-type utilizing...

10.1021/jp0761463 article EN The Journal of Physical Chemistry C 2007-10-05

Multi-layer stack accumulative roll bonding (ARB) process is proposed and applied to commercial purity aluminum for ultra grain refinement. The six sheets 0.5 mm thick, 50 wide 400 long were degreased wire-brushed. stacked together, cold-roll-bonded by 50%-reduction rolling. roll-bonding was followed four-pass rolling so that the final thickness mm. sheet then cut pieces of same length procedure repeated sheets. ARB up cycles (an equivalent strain 13.2) successfully performed. tensile...

10.2320/matertrans.44.1376 article EN MATERIALS TRANSACTIONS 2003-01-01

A cold roll-bonding process was applied to fabricate an AA1050/AA6061/AA1050 laminate complex sheet. Two AA1050 and one AA6061 sheets of 2 mm thickness, 40 width 300 length were stacked up after surface treatment that included degreasing wire brushing; material then reduced a thickness 3 by one-pass rolling. The sheet bonded the rolling further 1.2 in conventional performed at ambient temperature without lubricant using 2-high mill with roll diameter 210 mm. speed 5.0 m/sec. fabricated...

10.3740/mrsk.2016.26.7.388 article EN cc-by-nc Korean Journal of Materials Research 2016-07-01

The cold rolling workability and mechanical properties of two new alloys, designed cast Al-5.5Mg-2.9Si Al-7Mg-0.9Zn were investigated in detail. alloy sheets 4 mm thickness, 30 width 100 length reduced to a thickness 1 by multi-pass at ambient temperature. was better for the than alloy; case former alloy, edge cracks began occur 50% reduction, their number increased with reduction; however, latter did not have any even higher reduction. tensile strength elongation also alloy. Work hardening...

10.3740/mrsk.2016.26.11.628 article EN cc-by-nc Korean Journal of Materials Research 2016-11-01

The differential speed accumulative roll bonding (DSARB) process was attempted to strengthen 1100 aluminum sheet via grain refinement. peripheral of one 2.0 m/min and that another 3.6 m/min. ratio kept at 1.8. conducted up 6 cycles ambient temperature without lubrication. For comparison, the conventional (CARB) with a rolling 3.0 grains developed by DSARB were more equiaxed than those produced CARB. Tensile strength processed sample higher CARB same plane strain compressive strain....

10.2320/matertrans.44.1382 article EN MATERIALS TRANSACTIONS 2003-01-01
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